An automatic 3D image acquisition system for optical inspection of objects (B) includes one or more light sources (including a laser source) configured to emit a light toward a field of view wherein an object (B) to be inspected is placed, and at least one digital sensor that acquires at least part of the light reflected by the object (B) to be inspected.

The the-digital sensor includes and intensity sensor and is operatively connected to a data processing unit configured to determine physical and/or geometric features of the object (B) to be inspected on the basis of the light acquired by the digital sensor.

The automatic optical inspection system includes an image intensifier apparatus and optical elements which define a path of the laser light pulse from the laser source to the field of view and from the field of view to the image intensifier apparatus.

An apparatus to detect optical flatness of an OLED display layer includes a light-emitting assembly, a light-receiving assembly, and an image processor. The light-emitting assembly includes a light source and a first enhancement element. The light source emits reference light through the first enhancement element. The first enhancement element enhances brightness of the reference light and guides the enhanced reference light to a display layer of a display device being detected. The light-receiving assembly receives light reflected by the display layer according to the reference light and generates an image thereof. The image processor receives the image and obtains a result of detection as to surface flatness of the display layer according to the image.

A method and an apparatus of inspecting a substrate with a component mounted thereon, which are capable of inspecting whether the component is properly mounted or not without additional setting or changing inspection condition, are provided. The method comprises measuring a three-dimensional shape by irradiating the pattern image toward the substrate through at least one illumination unit and by taking a reflected image through an imaging unit, extracting a shield region from the three-dimensional shape, and inspecting a component mounting defect in an area excluding the shield region in the three-dimensional shape.

The disclosed technology relates to an inspection apparatus that includes a stage configured to retain a specimen for inspection, an imaging device having a field of view encompassing at least a portion of the stage to view a specimen retained on the stage, and a plurality of lights disposed on a moveable platform. The inspection apparatus can further include a control module coupled to the imaging device, each of the lights and the moveable platform. The control module is configured to perform operations including: receiving image data from the imaging device, where the image data indicates an illumination landscape of light incident on the specimen; and automatically modifying, based on the image data, an elevation of the moveable platform or an intensity of one or more of the lights to adjust the illumination landscape. Methods and machine-readable media are also contemplated.

An object of the present invention is to improve the quality level discrimination accuracy of the grain G by a grain quality level discrimination device. The device includes an optical unit 3 that emits light to the grain G, receives reflected and/or transmitted light from the grain G by a photosensor, and obtains information for discrimination of the quality level of the grain G from the upper and lower surface side of the grain G, and a quality level discrimination unit 7 that discriminates the quality level of the grain G on the basis of the information. The information on the upper and lower surface sides can be acquired by one optical unit at the same time so that the divergence therebetween due to the displacement or variation of the attitude of the grain G can be avoided. The reference plate for the correction of the information is placed outside of the moving path of the grain G to prevent it from soiling or damaging. Thus the deterioration of information can be avoided. Further, a reference plate especially for the information to be obtained from the side surface of the grain G may be provided for enhancing the accuracy of the side surface information. Thus the quality level discrimination accuracy can be improved further.

A wafer inspection apparatus includes: a stage configured such that a wafer is arranged on the stage; an optical apparatus configured to align the wafer on the stage and generate an optical intensity image including an optical intensity profile; a focus adjusting unit configured to align light incident onto the wafer to be in-focus; and an image processor configured to integrate the optical intensity image with vertical level data of the in-focus to generate and analyze a three-dimensional (3D) image.

In one configuration, an optical state monitor is augmented or comprises one or more indicator-sensors that self-generate different optical profiles (signatures) in response to an item or its environment; wherein wherein the indicator-sensors cooperate with the electromagnetic radiation detectors of the optical state monitor in the detection and determination of the condition(s) of the item or its environment, or of the indicator-sensor and its environment. Of particular interest are indicator-sensors that are thin, flexible, patternable and printable (or otherwise deposited) as films or additive layers to electromagnetic detection layers or other structures of the optical state monitor.

An illumination device includes first, second, and third light-emitting diode chips arranged around a center axis along virtual outlines of first, second, and third geometric figures, respectively. The geometric figures are concentric. A bond wire is connected to a connection point of each chip in its peripheral region. Multiple groups are defined, with each including one each of the first, second, and third chips. Within a first group, the first, second, and third chips are arranged on first, second, and third virtual rays, respectively. The rays each intersect only a single light-emitting diode chip, are transverse to the center axis, and originate at, and extend outwardly from, the center axis. In the first group, the second chip neighbors the first chip, the third chip neighbors the second chip, and the chips are rotated relative to one another such that the respective connection points are oriented in different directions.

An processing apparatus includes a first illumination portion and a first imaging portion. The first illumination portion irradiates ta second inner surface on an opposite side of a second outer surface and a third inner surface on an opposite side of a third outer surface via a first outer surface of the electronic component with irradiation light in a state where the electronic component is disposed on a first inspection position. The first imaging portion captures an image of a first internal corner portion formed by the second inner surface and the third inner surface, based on the first irradiation light emitted from the first outer surface after being specularly reflected on the second inner surface and the third inner surface.

An apparatus for particle size and a distribution of a population of particle measurements, comprising: a non-monochromatic light source that emits a plurality of a non-monochromatic rays, a medium that includes a particle, wherein the medium is a liquid phase and the particle is suspended within the medium to form a particle-suspension, a droplet of the particle-suspension wherein the droplet is provided with a curved surface, and a detector that is provided with a light providing element.