Patent classifications
G01N2021/8841
System and method for inspection and metrology of four sides of semiconductor devices
A method of inspection or metrology of four sides of a sample is disclosed. The method includes providing samples in a carrier at a first side of an imaging tool and moving the samples from the carrier to the imaging tool via a pick-and-place stage assembly. The method includes imaging first and second sides of the samples via first and second channels of the imaging tool and returning the samples to the carrier. The method includes rotating the carrier by 90 degrees and translating the carrier to an opposite side of the imaging tool and moving the samples individually from the carrier to the imaging tool. The method includes imaging a third and fourth side of the sample via the first and second channel of the imaging tool and returning the one or more samples from the imaging tool to the carrier.
Panel inspection apparatus and method
A panel inspection apparatus is provided. The panel inspection apparatus has a support platform, a delivery platform and a panel inspection assembly. The delivery platform is disposed on the support platform, and the delivery platform has a push module for delivering the panel. The panel inspection assembly includes a plurality of light source modules and a plurality of image-taking modules corresponding to the light source modules. The light source modules include a front light source, a first horizontal light source, and a back light source. The image-taking modules include a front light image-taking module, a first horizontal light image-taking module, and a back light image-taking module. The push module delivers the panel across the support platform so that a plurality of light beams emitted from the light source modules can scan the panel to finish the panel inspection process.
DEVICE AND METHOD FOR SURFACE PROFILOMETRY FOR THE CONTROL OF WAFERS DURING PROCESSING
A device or apparatus is provided for carrying out measurements of shape on a first surface of a wafer relative to structures present beneath the first surface including (i) profilometry apparatus arranged in order to carry out measurements of shape on the first surface of the wafer according to at least one measurement field; (ii) imaging apparatus facing the profilometry apparatus and arranged in order to acquire a reference image of the structures on or through a second surface of the wafer opposite to the first surface according to at least one imaging field; the profilometry apparatus and said imaging apparatus being arranged so that the measurement and imaging fields are referenced in position within a common frame of reference.
A method is also provided to be implemented in this device or this apparatus.
Cosmetic Evaluation Box for Used Electronics
A cosmetic testing device for electronic devices that uses the electronic device's own camera to take photographs of the electronic device in order to determine its cosmetic condition.
BEVERAGE DISPENSE MONITORING WITH CAMERA
A beverage dispenser includes a nozzle to dispense a beverage. The beverage dispenser further includes a camera to capture an image of the beverage as the beverage is dispensed from the nozzle. The camera has a field of view that includes the beverage. The beverage dispenser further includes a light source that illuminates the field of view of the camera. The beverage dispenser further includes a computer. The computer analyzes the image of the beverage and determines a characteristic of the beverage.
Upper surface foreign material detecting device of ultra-thin transparent substrate
Provided are a foreign material detecting device and method for detecting only a foreign material on a surface of a substrate except for a foreign material on a lower surface of the substrate in a manufacturing process of a transparent substrate passing light therethrough, such as a glass substrate used in a flat panel display (FPD) such as a liquid crystal display (LCD), an organic light emitting diode (OLED), a plasma display panel (PDP), etc., a sapphire wafer used in some of semiconductors, or the like, and in a pattern forming process in a manufacturing process of the FPD and the semiconductor using the transparent substrate. More particularly, provided are a foreign material detecting device and method for detecting only a foreign material on a surface of an ultra-thin transparent substrate having a thickness of 0.3 T or less.
HYBRID INSPECTION SYSTEM AND INSPECTION METHOD FOR DOSAGE
A dosage hybrid inspection system includes a plurality of cameras selectively installed in sides of a rotating plate and a counter-rotating plate configured to vacuum suction a dosage along a circumference thereof. The cameras include a first camera unit including one or more camera arranged in the side of the rotating plate to photograph a top surface of a tablet when a bottom surface of the tablet is suctioned to the rotating plate, a second camera unit including a plurality of cameras arranged in the side of the rotating plate to photograph a portion of a circumferential surface of the tablet when the bottom surface of the tablet is suctioned to the rotating plate, a third camera unit including one or more camera arranged in the side of the counter-rotating plate to photograph the bottom surface of the tablet when the top surface of the tablet is suctioned to the counter-rotating plate, a fourth camera unit including a plurality of cameras arranged in the side of the counter-rotating plate to photograph another portion of the circumferential surface of the tablet when the top surface of the tablet is suctioned to the counter-rotating plate, wherein one or more camera of the second and fourth camera units is configured to photograph both edges of a capsule when a side surface of the capsule is suctioned to the rotating plate, and one or more camera of the first and third camera units is configured to photograph a circumferential surface of the capsule, and fifth and sixth camera units including a plurality of cameras further provided in the sides of the rotating plate and the counter-rotating plate to photograph another portion of the circumferential surface of the capsule which has not been photographed by the first and third camera units.
Method for manufacturing electrode by switching contact region of roll surface upon abnormality detection
An apparatus for manufacturing an electrode performs press-working of a strip electrode being conveyed. This manufacturing apparatus includes a press roll including a roll surface having a width that is twice or more a width of the strip electrode, a switch configured to switch a contact region of the roll surface contacting with the strip electrode during press-working, and a controller. When an abnormality of the roll surface is detected in a state where the contact region of the roll surface is a region located on the left side with respect to a center line of the roll surface, the controller controls the switch such that the contact region of the roll surface is switched to a region located on the right side with respect to the center line of the roll surface.
Combined transmitted and reflected light imaging of internal cracks in semiconductor devices
A first light source is directed at an outer surface of a workpiece in an inspection module. The light from the first light source that is reflected from the outer surface of the workpiece is directed to the camera via a first pathway. The light from the first light source transmitted through the workpiece is directed to the camera via a second pathway. A second light source is directed at the outer surface of the workpiece 180° from that of the first light source. The light from the second light source that is reflected from the outer surface of the workpiece is directed to the camera via the second pathway. The light from the second light source transmitted through the workpiece is directed to the camera via the first pathway.
Inspection system for manufactured components
An inspection station for manufactured components includes a framework and a plurality of cameras. The framework has of a plurality of vertically stacked and spaced apart plates. Each plate defines a central orifice. The central orifices of each plate are aligned along an axis. The manufactured components are configured to freefall through the central orifices defined by the plates. The plurality of cameras is secured to the framework. Each camera is focused toward a region within the framework to capture images of the manufactured components. The plurality of cameras is arranged in an array that extends radially about the axis. At least one of the cameras is positioned at an angle above a horizontal plane that is perpendicular to the axis and intersects the region within the framework. At least one of the cameras is positioned at an angle below the horizontal plane.