A device for inspecting a liquid crystal stain of a polarization plate, the device comprising a surface light source; a first polarization member; a polarization plate including a liquid crystal film; a second polarization member; and an inspection source, and a method using the device, the device and the method capable of easily inspecting liquid crystal stains generated on a polarization plate with excellent visibility.

Sub-diffraction limited magneto-optical microscopy, such as Kerr or Faraday effect microscopy, provide many advantages to fields of science and technology for measuring, or imaging, the magnetization structures and magnetization domains of materials. Disclosed is a method and system for performing sub-diffraction limited magneto-optic microscopy. The method includes positioning a microlens or microlens layer relative to a surface of a sample to image the surface of the sample, forming a photonic nanojet to probe the surface of the sample, and receiving light reflected by the surface of the sample or transmitted through the sample at an imaging sensor. The methods and associated systems and devices enable sub-diffraction limited imaging of magnetic domains at resolutions 2 to 8 times the classical diffraction limit.

A method and apparatus for cleaning vacuum ultraviolet (VUV) optics (e.g., one or more mirrors of a VUV) of a substrate inspection system is disclosed. The cleaning system ionizes or disassociates hydrogen gas in a VUV optics environment to generate hydrogen radicals (e.g., H*) or ions (e.g., H.sup.+, H.sub.2.sup.+, H.sub.3.sup.+, which remove water or hydrocarbons from the surface of the one or more mirrors. The one or more VUV mirrors may include a reflective material, such as aluminum. The one or more VUV mirrors may have a protective coating to protect the reflective material from any detrimental reaction to the hydrogen radicals or ions. The protective coating may include a noble metal.

The present invention relates to defects inspection on a silicon carbide wafer or an epitaxial layer thereon to determine the location, and adjustment of the location of the scribe line, which is a separation line forming a gap between adjacent dies. The present invention can obtain high efficiency and economy in the semiconductor process using wafers containing various defects in the surface and thin film, by minimizing the effect of wafer defects on the final yield of the semiconductor chip or die, via adjustment of scribe line positions arranged on the wafer.

Disclosed is apparatus for inspecting a sample. The apparatus includes illumination optics for simultaneously directing a plurality of incident beams at a plurality of azimuth angles towards a sample and collection optics for directing a plurality of field portions of output light from two or more of the plurality of angles towards two or more corresponding sensors. The two or more sensors are arranged for receiving the field portions corresponding to two or more angles and generating two or more corresponding images. The apparatus further comprises a processor for analyzing the two or more images to detect defects on the sample.

An angle independent optical surface inspector capable of generating a light beam, directing the light beam to a sample, and de-scanning a reflected light beam that is reflected from the sample, thereby generating a first de-scanned light beam. The de-scanning is performed at approximately one focal length of a de-scanning lens from an irradiation location where the light beam irradiates the sample. The optical inspector also capable of focusing the first de-scanned light beam, thereby generating a focused light beam, and measuring the location of the focused light beam. The measuring of the location is performed at approximately one focal length of a focusing lens from the focusing lens. The incident angle of the light beam is within ten degrees of Brewster's angle. The focusing is performed by an achromatic lens.

A determination environment information acquisition unit 31 acquires incident polarized light information of a light source in a material determination environment. A determination target information acquisition unit 32 acquires emitted polarized light information from a polarized image obtained by capturing an image of a material determination target in the material determination environment. A determination processing unit 34 can determine a material of the material determination target on the basis of the incident polarized light information acquired at the determination environment information acquisition unit 31, the emitted polarized light information acquired at the determination target information acquisition unit 32, and material polarizing characteristic information which is stored in advance in an information storage unit 33, that is, material polarizing characteristic information which indicates, for each material, polarizing and reflecting characteristics for each incident direction of incident polarized light and for each emission direction of reflected light.

An optical scanning system includes a first radiating source capable of outputting a first source light beam, a second radiating source capable of outputting a second source light beam, a first time-varying beam reflector configured to direct the first source light beam and the second source light beam toward the sample, a scan lens configured to focus the first source light beam and the second source light beam reflected by the first time-varying beam reflector onto the sample, and a compound ellipsoidal collector configured to direct light scattered from the sample toward a scattered radiation detector. The optical scanner causes one of the first or second source light beams to be directed towards a sample at an incident angle. The first light beam has a first wavelength, the second light beam has a second wavelength, and the first wavelength and the second wavelength are not the same.

According to one embodiment, an optical imaging apparatus includes: an image-forming optical portion, a wavelength selection portion, and an imaging portion. The image-forming optical portion forms an image of an object by means of light beams that include a first wavelength and a second wavelength different from the first wavelength. The first wavelength selection portion has wavelength selection regions. The wavelength selection regions are an anisotropic wavelength selection opening having a different distribution of the wavelength selection regions depending on a direction along a first axis and a direction along a second axis. The imaging portion is configured to simultaneously acquire an image of the first light beam and the second light beam.

Additive manufacturing, such as laser sintering or melting of additive layers, can produce parts rapidly at small volume and in a factory setting. To ensure the additive manufactured parts are of high quality, a real-time non-destructive evaluation (NDE) technique is required to detect defects while they are being manufactured. The present invention describes an in-situ (real-time) inspection unit that can be added to an existing additive manufacturing (AM) tool, such as an FDM (fused deposition modeling) machine, or a direct metal laser sintering (DMLS) machine, providing real-time information about the part quality, and detecting flaws as they occur. The information provided by this unit is used to a) qualify the part as it is being made, and b) to provide feedback to the AM tool for correction, or to stop the process if the part will not meet the quality, thus saving time, energy and reduce material loss.