Systems and methods here may be used for analyzing images of gemstones to automatically assign a haziness and/or fluorescence grade to the gemstone using contrast analysis on pixelated, digital images of the gemstones.

Disclosed is a system, method and computer readable medium for selecting a coreset of potential defects for estimating expected defects of interest. An example method includes obtaining a plurality of defects of interest (DOIs) and false alarms (FAs) from a review subset selected from a group of potential defects received from an inspection tool. The method further includes generating a representative subset of the group of potential defects. The representative subset includes potential defects selected in accordance with a distribution of the group of potential defects within an attribute space. The method further includes, upon training a classifier using data informative of the attribute values of the DOIs, the potential defects of the representative subset, and respective indications thereof as DOIs or FAs, applying the classifier to at least some of the potential defects to obtain an estimation of a number of expected DOIs in the specimen.

The invention relates to a method for determining deformations on an object, wherein the object is illuminated and moved while being illuminated. In the process, the object is observed by means of at least one camera and at least two camera images are generated at different times by said camera. In the camera images, polygonal chains are ascertained in each case for reflections at the object caused by form features. The form features are classified on the basis of the behavior of the polygonal chains over the at least two camera images and a two-dimensional representation is generated, the latter representing a spatial distribution of deformations. Moreover, the invention relates to a corresponding apparatus.

A manual inspection system and method to inspect for defects in Contact lenses comprising; an image acquisition system with at least two high resolution cameras; Top illumination light head used for acquiring Bright field images; a Backlit illumination module to acquire Dark field images; at least another back lit illumination module to acquire a different type of Bright field images; an interchangeable mechanism to change measurement gauges suitable for a particular product; a rotating wheel embedded with multiple optical filters to cater to different imaging requirements; a first camera to capture the full view of the contact lens at a beam splitter; a second camera suitably mounted on a swivel arm to capture a higher resolution image of a selected defective area as viewed on a projection screen; a glass template or measurement gauge mounted at a suitable position to achieve overlaid images of the lens and the gauge on a projection screen for taking measurements; a flexible template measurement gauge as an optional overlay, to replace the glass template, suitably mounted on the projection screen for easy measurement of defects and geometry of the contact lens; an XYZ table to position the contact lens; creating a database on the computer that tabulates geometrical information and detailed defect information along with their respective positional information; and subsequently analyzing the database images to arrive at corrective actions to the manufacturing process to improve the quality and yields in the contact lens.

A method for locating, in a deposition line including a succession of compartments, an origin of a defect affecting a stack of thin layers deposited on a substrate in the compartments, in which each thin layer is deposited in one or more successive compartments of the deposition line and pieces of debris remaining on the surface of a thin layer deposited in a compartment act as masks for the subsequent depositions of thin layers and are the origin of defects, includes obtaining at least one image showing the defect, determining, from the at least one image, a signature of the defect, the signature containing at least one characteristic representative of the defect, and identifying at least one compartment of the deposition line liable to be the origin of the defect from the signature of the defect and using reference signatures associated with the compartments of the deposition line.

There is provided a mask inspection system and a method of mask inspection. The method comprises: during a runtime scan of a mask of a semiconductor specimen, processing a plurality of aerial images of the mask acquired by the mask inspection system to calculate a statistic-based Edge Positioning Displacement (EPD) of a potential defect, wherein the statistic-based EPD is calculated using a Print Threshold (PT) characterizing the mask and is applied to each of the one or more acquired aerial images to calculate respective EPD of the potential defect therein; and filtering the potential defect as a “runtime true” defect when the calculated statistic-based EPD exceeds a predefined EPD threshold, and filtering out the potential defect as a “false” defect when the calculated statistic-based EPD is lower than the predefined EPD threshold. The method can further comprise after-runtime EPD-based filtering of the plurality of “runtime true” defects.

A product defect detection method, device and system are disclosed. The method comprises: acquiring a sample image of a product, extracting candidate image blocks probably including a product defect from the sample image, and extracting preset shape features corresponding to the candidate image blocks and texture features corresponding to the candidate image blocks; training a first-level classifier using the preset shape features to obtain a first-level classifier that can further screen out target image blocks probably including a product defect from the candidate image blocks; training a second-level classifier using the texture features to obtain a second-level classifier that can correctly identify a product defect; and when performing product defect detection, inputting preset shape features of candidate image blocks extracted from a product image into the first-level classifier, and then inputting texture features of obtained target image blocks into the second-level classifier to detect a defect in the product.

A semiconductor wafer fault analysis system includes: a database to store a first reference map, which is classified as a first fault type, and a second reference map, which is classified as a second fault type; a first auto-encoder/decoder to remove a noise corresponding to the first fault type from the first reference map to generate a first pre-processed reference map; a second auto-encoder/decoder to remove a noise corresponding to the second fault type from the second reference map to generate a second pre-processed reference map; and a fault type analyzer. The database is updated based on the first and second pre-processed reference maps, and the fault type analyzer is to classify a fault type of a target map based on the updated database. The target map is generated by measuring a target wafer.

An inspection station for manufactured components includes a framework and a plurality of cameras. The framework has of a plurality of vertically stacked and spaced apart plates. Each plate defines a central orifice. The central orifices of each plate are aligned along an axis. The manufactured components are configured to freefall through the central orifices defined by the plates. The plurality of cameras is secured to the framework. Each camera is focused toward a region within the framework to capture images of the manufactured components. The plurality of cameras is arranged in an array that extends radially about the axis. At least one of the cameras is positioned at an angle above a horizontal plane that is perpendicular to the axis and intersects the region within the framework. At least one of the cameras is positioned at an angle below the horizontal plane.

An inspection apparatus includes: a changing unit configured to change a condition for shooting an object to various shooting conditions; a shooting condition selecting unit configured to select all of the various shooting conditions in inspection of the object executed before a predetermined condition is established, and select one or a plurality of shooting conditions from the various shooting conditions based on effectiveness of each of the shooting conditions in inspection of the object executed after the predetermined condition is established; an image acquiring unit configured to control the changing unit and thereby acquire an image of the object under each of the selected shooting conditions; an anomaly detecting unit configured to detect an anomaly of the object based on the acquired image; and an effectiveness updating unit configured to update the effectiveness based on the acquired image.