Apparatuses systems and methods for gas emission rate detection sensitivity and probability of detection (PoD) based on emission rate. A measurement system may be characterized by its ability to detect gas plumes as a function of the emission rate of those plumes. The measurement system may be characterized based on a generalized PoD function which expresses PoD relative to emission rate as a function of gas concentration noise and gas flow speed. In an example application, the PoD may be used to estimate a cumulative distribution of gas plumes which were not detected based on a cumulative distribution of measured gas plumes. In another example application, the PoD may be used to refine an estimate for a measured emission rate.

Disclosed herein are systems and methods for synthesizing a diamond using a diamond synthesis machine. A processor receives a plurality of images of a diamond during synthesis within a diamond synthesis machine, each of the plurality of images captured within a time period. The processor executes a diamond state prediction machine learning model using the plurality of images to obtain a predicted data object, the predicted data object indicating a predicted state of the diamond within the diamond synthesis machine at a time subsequent to the time period. The processor detects a predicted defect, a number of defects, defect types, and/or sub-features of such defects and/or other characteristics (e.g., a predicted shape, size, and/or other properties of predicted contours for the diamond and/or pocket holder) of the predicted state of the diamond. The processor adjusts operation of the diamond synthesis machine.

Aspects of the subject disclosure may include, for example, an apparatus capable of determining a subject device's condition. Images of the subject device may be compared to reference images to determine the device's condition. Functionality of the subject device may be verified to determine the subject device's condition. The subject device may be classified in one or more condition classes according to the determined condition. Other embodiments are disclosed.

An abnormality in an imaging apparatus configured to generate an image or in an optical member located on an optical path for capturing the image can be accurately determined, irrespective of the environment. An image processing apparatus includes a first receiver configured to receive a first image, a second receiver configured to receive a second image having an imaging range that includes at least a portion of an imaging range of the first image, and a controller configured to determine an abnormality in the first image or the second image based on a common portion in the imaging ranges of the first image and the second image.

A system for inspecting a reflective surface includes a first imaging assembly configured to take a first image of the reflective surface, the first image including depth information, a second imaging assembly configured to take a second image of the reflective surface, the second image including contrast information, and a processor configured to acquire the first image and the second image. The processor is configured to perform: estimating a depth profile of the surface based on the depth information, correlating the depth profile with the second image, and identifying a feature of the reflective surface based on the correlation.

An inspection device for inspecting a state of a coating agent applied to a target surface having a protruding portion includes: an image capture device configured to capture an image of a predetermined inspection target region of the target surface; and an illumination device configured to emit light possible to be captured by the image capture device, toward the inspection target region, wherein the illumination device includes: a first light source configured to emit diffuse light toward an entirety of the inspection target region; and a second light source configured to emit direct light toward a shadow that is cast by the protruding portion due to emission of the diffuse light by the first light source.

An illumination device has a light source unit, a lens unit, and a filter unit An imaging device receives object light, generated by the illumination light, from the measurement object at a predetermined observation solid angle, and pixels of the imaging device can each identify the different light wavelength ranges. A processing device includes an arithmetic unit configured to obtain a normal vector at each point of the measurement object corresponding to each pixel from inclusion relation between the plurality of solid angle regions, constituting the object light, and the predetermined observation solid angle, and a shape reconstruction unit configured to reconstruct the shape of the measurement object.

The image inspection apparatus includes an image capturing unit which captures images of an object, a transparent illumination unit disposed between the object and the image capturing unit, and a control unit configured to control the image capturing unit and the illumination unit. The illumination unit radiates light to the object in a first direction and causes the light to scan and radiates light to the object in a second direction and causes the light to scan. The image capturing unit captures images of the object. The control unit identifies a light-emitting position of the illumination unit when a measurement point of the surface of the object is illuminated from images of the object captured, and calculates a distance to the measurement point on the basis of the identified light-emitting position, the first direction and the second direction.

A CPU 20 that functions as a processor of a three-dimensional display device 10 maps pieces of damage information stored in a storage unit 16 and associated with members of a construction onto members, on a three-dimensional model stored in the storage unit 16, corresponding to the pieces of damage information. When accepting an instruction for displaying an inspection target member of the construction from an operation unit 18, the CPU 20 creates a three-dimensional model of only the member for which the instruction for displaying is accepted and onto which a piece of damage information is mapped and causes a display unit 30 to display the three-dimensional model.

A substrate inspection apparatus generates, when anomalies of a plurality of second solder pastes among a plurality of first solder pastes printed on a first substrate is detected, at least one image indicating a plurality of second solder pastes with anomalies detected by using an image about a first substrate, applies the at least one image to a machine-learning-based model, acquires a plurality of first values indicating relevance of respective first fault types to the at least one image and a plurality of first images indicating regions associated with one of a plurality of first fault types, determines a plurality of second fault types, which are associated with the plurality of second solder pastes by using the plurality of first values and the plurality of first images, and determines at least one third solder paste, which is associated with the respective second fault types.