Wafer taping apparatuses and methods are provided for determining whether taping defects are present on a semiconductor wafer, based on image information acquired by an imaging device. In some embodiments, a method includes applying an adhesive tape on a surface of a semiconductor wafer. An imaging device acquires image information associated with the adhesive tape on the semiconductor wafer. The presence or absence of taping defects is determined by defect recognition circuitry based on the acquired image information.

An inspection system, a lithography apparatus, and an inspection method are provided. The inspection system includes an illumination system, a detection system, and processing circuitry. The illumination system generates a first illumination beam at a first wavelength and a second illumination beam at a second wavelength. The first wavelength is different from the second wavelength. The illumination system irradiates an object simultaneously with the first illumination beam and the second illumination beam. The detection system receives radiation scattered by a particle present at a surface of the object at the first wavelength. The detection system generates a detection signal. The processing circuitry determines a characteristic of the particle based on the detection signal.

A substrate inspection device includes an imaging part that is disposed in a chamber and obtains an input image by photographing a substrate coated with a solution, and an analysis part that converts brightness data of the input image into grayscale data and analyzes a film shape of a pixel region based on the grayscale data.

An ultrasound vibrating-type defect detection apparatus (100) for detecting a defect in a semiconductor apparatus (10) is provided with: an ultrasound vibrator (42); a high-frequency power supply (40); a camera (45); and a controller (50) for adjusting the frequency of high-frequency power supplied from the high-frequency power supply (40) to the ultrasound vibrator (42), and for performing detection of a defect in the semiconductor apparatus (10). The controller (50) causes the camera (45) to capture an image of the semiconductor apparatus (10) while varying the frequency of high-frequency power supplied from the high-frequency power supply (40) to the ultrasound vibrator (42), and performs detection of a defect in the semiconductor apparatus (10) on the basis of the captured image.

An in-situ system for a gas turbine engine blade inspection including a sensor system configured to capture images of a forward surface of at least one gas turbine engine blade; a processor coupled to the sensor system, the processor configured to determine damage to the at least one gas turbine engine blade based on video analytics; and a tangible, non-transitory memory configured to communicate with the processor, the tangible, non-transitory memory having instructions stored therein that, in response to execution by the processor, cause the processor to perform operations comprising receiving, by the processor, data for the forward surface of at least one gas turbine engine blade from the sensor system; determining, by the processor, a rotational speed of a fan; and determining, by the processor, a fan synchronization.

In a crack detection device (10), an image acquisition unit (21) acquires image data acquired by taking an image of a road surface from an oblique direction with respect to the road surface. An image classification unit (22) classifies image data acquired into an acceptable range with a resolution higher than a standard value, and an unacceptable range with a resolution equal to or less than the standard value. A data output unit (23) outputs acceptable data being image data of a part classified into the acceptable range as data to detect a crack on the road surface. An image display unit (24) displays data output.

In an example, a photometric imaging device comprises a light source to illuminate a target area including a set of fiducials, an imaging device to capture images of the set of fiducials illuminated by the light source with different image viewing settings, and a controller. The controller is to: control the light source to subsequently illuminate the set of fiducials with the different image viewing settings; determine locations of the set of fiducials on the captured images; determine pixel deviations between the determined locations; and determine offset data based at least in part on the determined pixel deviations.