The invention relates to a method and system for performing VPD-DC on wafer surfaces, wherein the pipette substitutes for the function of the scan tube and is operated such that a bulge of scanning liquid protrudes from the pipette channel and contacts the wafer surface for scanning.

A defect inspection apparatus includes a first objective lens having an optical axis is perpendicular to a wafer mounting surface of the stage, a second objective lens having an optical axis forms a predetermined acute angle with respect to the wafer mounting surface of the stage, and a dichroic mirror which reflects light having a first wavelength and transmits or reflects light having a second wavelength. Emitted light of a first optical path 111 from a first light source which is reflected from or transmitted through the dichroic mirror and first emitted light and second emitted light polarized and separated from a second light source which are transmitted through or reflected from the dichroic mirror are incident on the first objective lens, and emitted light of a second optical path from the first light source is incident on the second objective lens.

Disclosed herein is a method including: providing a light guiding arrangement (LGA) configured to redirect light, incident thereon in a direction perpendicular to an external surface of the sample, into or onto the sample, such that light impinges on an internal facet of the sample nominally normally thereto; generating a first incident light beam (LB), directed at the external surface normally thereto, and a second incident LB, parallel to the first incident LB and directed at the LGA; obtaining a first returned LB by reflection of the first incident LB off the external surface, and a second returned LB by redirection by the LGA of the second incident LB into or onto the sample, reflection thereof off the internal facet, and inverse redirection by the LGA; measuring an angular deviation between the returned LBs and deducing therefrom an actual inclination angle of the internal facet relative to the external surface.

Disclosed herein an apparatus and method for estimating a phase retarder and method of manufacturing the phase retarder using the same. The apparatus includes: a polarization element configured to output an incident light as a linear polarization and to make the linear polarization incident onto a phase retarder to be tested; a polarization image acquisition module equipped with a plurality of polarized pixels receiving an emitting light that is output from the phase retarder, on which the linear polarization is incident, and configured to obtain a polarization image based on the emitting light that is modulated in the polarized pixels; and a processor configured to evaluate quality of the phase retarder based on uniformity of a brightness value between polarized pixels of the polarization image. The polarized pixels modulate the emitting light based on a plurality of transmission angles and detects the modulated emitting light.

An apparatus to detect optical flatness of an OLED display layer includes a light-emitting assembly, a light-receiving assembly, and an image processor. The light-emitting assembly includes a light source and a first enhancement element. The light source emits reference light through the first enhancement element. The first enhancement element enhances brightness of the reference light and guides the enhanced reference light to a display layer of a display device being detected. The light-receiving assembly receives light reflected by the display layer according to the reference light and generates an image thereof. The image processor receives the image and obtains a result of detection as to surface flatness of the display layer according to the image.

A system may include a wafer that includes ICs and defines cavities. Each cavity may be formed in a BEOL layer of the wafer and proximate a different IC. The system may also include an interposer that includes a transparent layer configured to permit optical signals to pass through. The interposer may also include at least one waveguide located proximate the transparent layer. The at least one waveguide may be configured to adiabatically couple at least one optical signal out of the multiple ICs. Further, the interposer may include a redirecting element optically coupled to the at least one the waveguide. The redirecting element may be located proximate the transparent layer and may be configured to receive the at least one optical signal from the at least one waveguide. The redirecting element may also be configured to vertically redirect the at least one optical signal towards the transparent layer.

An extreme ultraviolet (EUV) collector inspection apparatus and method capable of precisely inspecting a contamination state of an EUV collector and EUV reflectance in accordance with the contamination state are provided. The EUV collector inspection apparatus includes a light source arranged in front of an EUV collector to be inspected and configured to output light in a visible light (VIS) band from UV rays, an optical device configured to output narrowband light from the light, and a camera configured to perform imaging from an UV band to a VIS band. An image by wavelength of the EUV collector is obtained by using the optical device and the camera and a contamination state of the EUV collector is inspected.

An optical inspection device for an optical performance test of a display device including a lens part configured to transmit external light, a phase film part configured to change a phase difference of the external light and transmit the external light, and an image processor configured to obtain electrical information of the external light, in which a phase difference of the phase film part is at least 7000 nm.

The dual-purpose adapter for inspecting circular (plug-type or receptacle-type) ruggedized fiber optic connector has a guide and a fitting tip. The guide is formed by fastening a template inserter to a frame in two alternative opposite directions. The template inserter has light channels corresponding in relative positions to the endfaces in the ruggedized connector, and two locating holes for coupling and aligning with the ruggedized connector through two guide pins. Depending upon the direction in which the template inserter is fastened to the frame, the fitting tip may be inserted into a respective end of the light channels to allow the optical axis of an inspector probe connected to it to intersect at right angle with PC or APC endfaces for inspection by the inspector probe. For receptacle-type connectors, the guide further includes the two guide pins which can be locked from axial movement at two positions.

A defects evaluation system and method are provided in the present invention. Based on the principle of the microscopic scattering dark-field imaging, the present invention implements a sub-aperture scanning for the surface of spherical optical components and then obtains surface defects information with image processing. Firstly, the present invention takes full advantage of the characteristic that the surface defects of spherical optical components can generate scattering light when an annular illumination beam irradiates on the surface, to implement the sub-aperture scanning and imaging that covers the entire spherical surface. Then, a series of procedures such as the global correction of sub-apertures, the 3D stitching, the 2D projection and the digital feature extraction are taken to inspect spherical surface defects. Finally, actual size and position information of defects are evaluated quantitatively with the defects calibration data. The present invention achieves the automatic quantitative evaluation for surface defects of spherical optical components, which considerably enhance the efficiency and precision of the inspection, avoiding the influence of subjectivity on the results. Eventually, reliable numerical basis for the use and process of spherical optical components is provided.