A position detection and determination device and a position calibration device and method are provided. The position detection and determination device includes a standard positioning pin position limiting component configured to limit standard position information of a positioning pin of a load port of a silicon wafer pod; a positioning pin position detecting component configured to detect real-time position information of the positioning pin of the load port of the silicon wafer pod; and a determining module configured to obtain the standard position information and the real-time position information, and determine whether the position of the positioning pin of the load port of the silicon wafer pod is accurate or not according to the standard position information and the real-time position information.

An acoustic scatterometer has an acoustic source operable to project acoustic radiation onto a periodic structure and formed on a substrate. An acoustic detector is operable to detect the −1st acoustic diffraction order diffracted by the periodic structure and while discriminating from specular reflection (0th order). Another acoustic detector is operable to detect the +1st acoustic diffraction order diffracted by the periodic structure, again while discriminating from the specular reflection (0th order). The acoustic source and acoustic detector may be piezo transducers. The angle of incidence of the projected acoustic radiation and location of the detectors and are arranged with respect to the periodic structure and such that the detection of the −1st and +1st acoustic diffraction orders and discriminates from the 0th order specular reflection.

An acoustic scatterometer has an acoustic source operable to project acoustic radiation onto a periodic structure and formed on a substrate. An acoustic detector is operable to detect the −1st acoustic diffraction order diffracted by the periodic structure and while discriminating from specular reflection (0th order). Another acoustic detector is operable to detect the +1st acoustic diffraction order diffracted by the periodic structure, again while discriminating from the specular reflection (0th order). The acoustic source and acoustic detector may be piezo transducers. The angle of incidence of the projected acoustic radiation and location of the detectors and are arranged with respect to the periodic structure and such that the detection of the −1st and +1st acoustic diffraction orders and discriminates from the 0th order specular reflection.

A measuring and calculating apparatus to measure and calculate a positional displacement amount of a pattern on a surface of a target object. The apparatus includes: a measuring unit to measure a first two-dimensional intensity distribution of a first diffracted light and a second two-dimensional intensity distribution of a second diffracted light; a storage unit to store a first and a second measurement data respectively indicating the first and the second two-dimensional intensity distribution; and an arithmetic unit to execute arithmetic processing using the first and the second measurement data to acquire difference data between the first and the second measurement data, and calculate a positional displacement amount of a difference pattern between the first and second patterns in accordance with the difference data.

A printing solder point quality identification and maintenance suggestion system and a method thereof are disclosed. In the system, when solder paste inspection data, component inspection data or circuit inspection data indicates presence of defect, an analysis and calculation device intercepts the operating data, the equipment data, the raw material data, the process data and the environment data from a time data stream, to generate a data feature portrait. The analysis and calculation device then sets a reliability value based on location association between the solder paste inspection data, the component inspection data, the circuit inspection data and the maintenance data in the location data stream, and performs similarity calculation on the data feature portrait and the comparison data feature portrait to calculate a similarity value, and then calculates a relative reliability value, and compares the relative reliability value with a reliability threshold value to generate maintenance suggestion information.

A method of performing metrology analysis of a thin film includes coupling a radiation into an optical element disposed adjacent to a surface of the thin film. The radiation is coupled such that the radiation is totally internally reflected at an interface between the optical element and the thin film. An evanescent radiation generated at the interface penetrates the thin film. The method furthers include analyzing the evanescent radiation scattered by the thin film to obtain properties of the thin film.

A method of performing metrology analysis of a thin film includes coupling a radiation into an optical element disposed adjacent to a surface of the thin film. The radiation is coupled such that the radiation is totally internally reflected at an interface between the optical element and the thin film. An evanescent radiation generated at the interface penetrates the thin film. The method furthers include analyzing the evanescent radiation scattered by the thin film to obtain properties of the thin film.

An image processing method includes the steps of lighting up at least a part of light emitting units of a light emitting device; capturing a plurality of detection images corresponding to a plurality of sections of the light emitting device respectively, wherein each section includes a plurality of lighted-up light emitting units, each detection image includes a plurality of light spots respectively corresponding to the light emitting units of the associated section, and every two adjacent sections have an overlap area including at least one lighted-up light emitting unit; and stitching the detection images of the adjacent sections together by taking the light spots corresponding to at least one lighted-up light emitting unit of the overlap area as alignment reference spots, so that the light emitting statuses of all the light emitting units are presented by a single image.

The presently-disclosed technology enables real-time inspection of a multitude of subcomponents of a component in parallel. For example, the component may be a semiconductor package, and the subcomponents may include through-silicon vias. One embodiment relates to a method for inspecting multiple subcomponents of a component for defects, the method comprising, for each subcomponent undergoing defect detection: extracting a subcomponent image from image data of the component; computing a transformed feature vector from the subcomponent image; computing pairwise distances from the transformed feature vector to each transformed feature vector in a training set; determining a proximity metric using said pairwise distances; and comparing the proximity metric against a proximity threshold to detect a defect in the subcomponent. Another embodiment relates to a product manufactured using a disclosed method of inspecting multiple subcomponents of a component for defects. Other embodiments, aspects and features are also disclosed.

An optical system configured to measure a raised or receded surface feature on a surface of a sample may comprise a broadband light source; a tunable filter configured to filter broadband light emitted from the broadband light source and to generate a first light beam at a selected wavelength; a linewidth control element configured to receive the first light beam and to generate a second light beam having a predefined linewidth and a predetermined coherence length; collimating optics optically coupled to the second light beam and configured to collimate the second light beam; collinearizing optics optically coupled to the collimating optics and configured to align the collimated second light beam onto the raised or receded surface feature of the sample, and a processor system and at least one digital imager configured to measure a height of the raised surface or depth of the receded surface from light reflected at least from those surfaces.