An inspection system serves to qualify semiconductor structures. The inspection system has an ion beam source for space-resolved exposition of the structures to be qualified with an ion beam. The inspection system also includes a secondary ion detection device with a mass spectrometer. The mass spectrometer is configured to measure an ion mass to charge ratio in a given bandwidth.

An inspection system serves to qualify semiconductor structures. The inspection system has an ion beam source for space-resolved exposition of the structures to be qualified with an ion beam. The inspection system also includes a secondary ion detection device with a mass spectrometer. The mass spectrometer is configured to measure an ion mass to charge ratio in a given bandwidth.

An information processing apparatus includes information acquisition means configured to acquire quantitative information on a test substance, which is estimated by inputting spectrum information of a sample including the test substance into a learning model, and degree-of-contribution acquisition means configured to acquire a degree of contribution of the acquired quantitative information on the test substance.

An information processing apparatus includes information acquisition means configured to acquire quantitative information on a test substance, which is estimated by inputting spectrum information of a sample including the test substance into a learning model, and degree-of-contribution acquisition means configured to acquire a degree of contribution of the acquired quantitative information on the test substance.

The charged particle beam irradiation apparatus includes: a focused ion beam column; an electron beam column; an electron detector; an image forming unit configured to form an observation image based on a signal output from the electron detector; and a control unit configured to repeatedly perform exposure control in which the focused ion beam column is controlled to expose a cross section of a multilayered sample toward a stacking direction with the focused ion beam, the control unit being configured to perform, every time exposure of an observation target layer at a cross section of the multilayered sample is detected in a process of repeatedly performing the exposure control, observation control in which the electron beam column is controlled to radiate the electron beam, and the image forming unit is controlled to form an observation image of the cross section of the multilayered sample.

The charged particle beam irradiation apparatus includes: a focused ion beam column; an electron beam column; an electron detector; an image forming unit configured to form an observation image based on a signal output from the electron detector; and a control unit configured to repeatedly perform exposure control in which the focused ion beam column is controlled to expose a cross section of a multilayered sample toward a stacking direction with the focused ion beam, the control unit being configured to perform, every time exposure of an observation target layer at a cross section of the multilayered sample is detected in a process of repeatedly performing the exposure control, observation control in which the electron beam column is controlled to radiate the electron beam, and the image forming unit is controlled to form an observation image of the cross section of the multilayered sample.

A method for analyzing secondary ion mass spectrum data representing respective secondary ion counts for a range of masses at a given mass resolution. The mass spectrum data is obtained by Secondary Ion Mass Spectrometry, SIMS. Automatic quantification of the ion species and/or cluster ions detected in the analyzed spectrum data is provided.

A method for analyzing secondary ion mass spectrum data representing respective secondary ion counts for a range of masses at a given mass resolution. The mass spectrum data is obtained by Secondary Ion Mass Spectrometry, SIMS. Automatic quantification of the ion species and/or cluster ions detected in the analyzed spectrum data is provided.

Techniques for generating full-spatial resolution, full spectral resolution image(s) from a 3D spectral-data cube for any spectral value within a given spectral range are provided without requiring the acquisition of all full-spatial resolution, full spectral resolution data by an instrument. The 3D spectral-data cube is generated from a limited number of full-spatial resolution, sparse spectral resolution data and a sparse-spatial resolution, full-spectral resolution data of the same area of the sample. The use of the 3D spectral-data cube reduces the data acquisition time.

Techniques for generating full-spatial resolution, full spectral resolution image(s) from a 3D spectral-data cube for any spectral value within a given spectral range are provided without requiring the acquisition of all full-spatial resolution, full spectral resolution data by an instrument. The 3D spectral-data cube is generated from a limited number of full-spatial resolution, sparse spectral resolution data and a sparse-spatial resolution, full-spectral resolution data of the same area of the sample. The use of the 3D spectral-data cube reduces the data acquisition time.