A gas sensor includes an insulation layer and detection cells covered with the insulation layer. Each of the plurality of detection cells includes: a first electrode; a second electrode having a surface exposed from the insulation layer; and a metal oxide layer disposed between the first electrode and the second electrode. In each of the detection cells, a resistance value of the metal oxide layer decreases with a response time, which is different in each of the detection cells, when a gas containing a hydrogen atom comes into contact with the second electrodes.

A semiconductor gas sensor includes a substrate having a cavity, a first insulation layer formed on the substrate, including an exposure hole formed at a position corresponding to the cavity and a peripheral portion of the cavity, a second insulation layer formed on the first insulation layer, covering the exposure hole, a heating electrode formed on the second insulation layer, being formed at a position corresponding to the cavity, a sensing electrode formed over the heating electrode, being electrically insulated from the heating electrode, a detection layer covering the sensing electrode, being capable of having a variable resistance when acting with a predetermined kind of gas, and a vent hole formed by penetrating the second insulation layer to communicate with the exposure hole, and the vent hole being capable of dissipating heat from the heating electrode in a upward direction with respect to the substrate. Thus, the exposed hole and the cavity may relieve sage of a membrane toward the cavity and may dissipate heat from the heating electrode swiftly and efficiently.

A hydrogel-based interdigitated microelectrode biosensor is disclosed. The hydrogel-based interdigitated microelectrode biosensor includes: a first interdigitated microelectrode having a plurality of first protrusion electrodes arranged in a comb-like shape on a substrate; a second interdigitated microelectrode facing the first interdigitated microelectrode and having a plurality of second protrusion electrodes arranged in a comb-like shape on the substrate, the second protrusion electrodes being arranged alternately with the first protrusion electrodes of the first interdigitated microelectrode; and a hydrogel filled in a space between the first and second interdigitated microelectrodes arranged alternately with each other. The hydrogel is provided between the interdigitated microelectrodes such that the presence and concentration of a biological substance, such as a protein, are detected by measuring the impedance between the interdigitated microelectrodes.

A MEMS gas sensor includes a photoacoustic sensor including a thermal emitter and an acoustic transducer, the thermal emitter and the acoustic transducer being inside a mutual measurement cavity. The thermal emitter includes a semiconductor substrate and a heating structure supported by the semiconductor substrate. The heating structure includes a heating element. The MEMS gas sensor further includes a chemical sensor thermally coupled to the heating element, and the chemical sensor including a gas adsorbing layer.

The present invention generally relates to metal oxide-based sensors and platforms and integrated chemical sensors incorporating the same, methods of making the same, and methods of using the same.

A chemical sensor (10) is described with at least one layer of a metal oxide (11) arranged between two current injecting electrodes (16,16′) with the length (L) of the layer of a metal oxide between the current injecting electrodes being less than 50 microns and one or a pair of voltage sensing electrodes (17) connected to the layer of a metal oxide (11) with the electrodes (16,16′,17) forming a 3- or 4-terminal arrangement for determining the resistance changes of layer material (11) excluding series resistances such as contact resistances close to or at at least one of the current injecting electrodes (16) from the resistance measurement.

A wiring (3) comprising electrical conductors (4, 5, 6, 7) is formed in a dielectric layer (2) on or above a semiconductor substrate (1), an opening is formed in the dielectric layer to uncover a contact pad (8), which is formed by one of the conductors, and a further opening is formed in the dielectric layer to uncover an area of a further conductor (5), separate from the contact pad. The further opening is filled with an electrically conductive material (9), and the dielectric layer is thinned from a side opposite the substrate, so that the electrically conductive material protrudes from the dielectric layer.

The present invention relates to a gas sensor package including an insulating substrate, a metal layer on one surface of the insulating substrate, a stepped portion disposed on the metal layer and configured to divide the metal layer into a plurality of portions, and a gas sensor chip mounted on the metal layer located on the stepped portion and including a sensing part, wherein a width of the stepped portion is provided to be equal to or less than an interval between two adjacent electrode terminals of a plurality of electrode terminals of the gas sensor chip.

A gas sensor array containing a gas flow path in which a gas to be analyzed flows, and a plurality of gas sensors set along the gas flowing direction of the gas flow path, wherein the gas sensors each has a constitution wherein semiconductor microcrystals that come into contact with the gas to be analyzed that flows in the above gas flow path are disposed between two electrodes.

A gas sensor includes a base, an insulating layer, two sensing electrodes, a heating layer, a gas-sensing material, and an exciting light source. A thru-hole is formed on the base, the insulating layer is disposed on the base to cover the thru-hole, and a portion of the insulating layer corresponding to the thru-hole is defined as an element area. Each sensing electrode disposed on the insulating layer has a sensing segment disposed on the element area and a sensing pad disposed outside the element area. The heating layer disposed on the insulating layer has a heating segment disposed on the element area and two heating pads disposed outside the element area. The gas-sensing material is disposed on the element area and covers the sensing segments and the heating segment. The exciting light source is arranged in the thru-hole and is configured to emit light toward the gas-sensing material.