The disclosure provides a gas permeable electrode and method for making the electrode to create diffusion pathways (or pores) in the metal electrode in a manner that is not destructive to delicate or soft sensing material. A first polymer, which is gas-permeable, is applied as a continuous coating over a surface of the sensing material. A second polymer that is immiscible with the first polymer is applied over a surface of the first polymer (e.g., spray-dry deposition of the second polymer) to form a micro-pattern or a polymeric template. The incompatibility/immiscibility between the first polymer and the second polymer leads to segregation of the second polymer into a pattern of discontinuous bumps, dots, islands or blobs on top of the first polymer. The porous electrode comprises at least one layer of an electrically conductive metal that is deposited over the first and second polymers. Bumps of the second polymer promotes small cracks or voids in the metal electrode layer that enable fast diffusion of analytes through the electrode.

The disclosed subject matter relates generally to methods of forming a semiconductor device, such as a moisture sensor. More particularly, the present disclosure relates to a method of forming a sensor device and a bond pad in the same dielectric region. The present disclosure also relates to the semiconductor devices formed by the method disclosed herein.

An electronic device for sensing a target analyte in a gas, liquid or vapor sample, the device has at least two sensing elements, each sensing element having an exposed layer of a transduction material supported on a dielectric substrate. The dielectric substrate of at least one of the sensing elements is made of a different dielectric material than the dielectric substrate of at least one other of the sensing elements. The different dielectric materials providing a different sensing response according to one or more transduction modes. The plurality of sensing elements in the device yield a specific transduction pattern for a specific target analyte in a gas, liquid or vapor sample.

Novel integrated circuit environmental and temperature sensors in combination with measurement circuitry fully integrated as part of an ASIC die, which may be co-packaged with a pressure sensor integrated circuit to create a compact yet sensitive environment monitoring product. Embodiments may include one or more integrated local heating elements and control circuitry that are power supply independent, make efficient use of battery power, include an accurate in-built temperature detection capability, and provide digital close-loop control of the heating elements.

A sensor including a detection film formed from a resin composition, a first electrode provided on a first surface of the detection film, and a second electrode provided on a second surface of the detection film, wherein the first surface of the detection film includes a rough surface having fine irregularities with a root mean square roughness (Rq) of 0.3 m to 3.0 m in a portion that is in contact with the first electrode.

Noncontact sensing components are provided herein, in an aspect, they can be for an electronic device. The noncontact sensing components can contain a semiconductor layer having a r-GO portion and a CNT portion. The noncontact sensing components can be used to detect the presence or movement of a humidity source in the vicinity of the noncontact sensing component. The resistance/humidity response of the component can be based on the combined contribution of carbon nanotube (positive resistance variation) and reduced-graphene oxide (negative resistance variation) behaviors.

Monolithic humidity sensor devices, and methods of manufacture. The devices include circuitry on or over a silicon substrate. A primary passivation barrier is formed over the circuitry with conductive vias therethrough; a capacitor, comprising metal fingers with spaces therebetween, is formed above said primary passivation barrier and electrically coupled by the conductive vias to the circuitry. A secondary passivation barrier is formed over the capacitor. A hygroscopic material layer is formed over the secondary passivation barrier, wherein the capacitor is operable to exhibit a capacitance value responsive to moisture present in the hygroscopic material layer and the circuitry is operable to generate a signal responsive to said capacitance value.

The present invention provides a humidity sensor, comprising a substrate having a coating wire and at least one humidity detecting portion S, each humidity detecting portion S comprises at least two electrodes, and each of electrodes is connected to their respective coating wires, and an electrochemical medium which is electrically insulated when dry and conductive when wet is provided between electrodes. This kind of humidity sensors can be used to monitor humidity in a highly sensitive manner, especially monitor the amount and extent of urine.

A relative humidity sensor is disclosed. The relative humidity sensor includes a first electrode and a second electrode disposed above a dielectric substrate. A sensitive layer is disposed above at least one of the first electrode and the second electrode, where the sensitive layer is formed from a composition including a polyimide and a hydrophobic filler. A dust protection layer is disposed above the sensitive layer.

A chip substrate, a manufacturing method thereof, a gene sequencing chip, and a gene sequencing method. The chip substrate includes a base substrate; first electrode, located on the base substrate in an array; an insulating layer, located at gaps between two adjacent ones of the first electrodes, and partially covering the two adjacent ones of the first electrodes to form containing spaces being in one-to-one correspondence with the first electrodes; a capacitive dielectric layer, located on a side of the first electrodes away from the base substrate, and located in the containing spaces; and second electrodes, located on a side of the capacitive dielectric layer away from the base substrate, the capacitive dielectric layer includes a first region and a second region, an orthographic projection of the second electrodes on the base substrate is overlapped with an orthographic projection of the first region on the base substrate.