An eddy-current flaw detector includes a trace data calculator configured to calculate each coordinate with respect to flaw detection points on which an inspection probe is used upon performing an eddy-current testing based on an inputted condition of eddy-current flaw detection and surface shape data of an inspection-object surface measured by a profilometer, and to calculate a normal vector of each flaw detection point; a gap evaluation calculator configured to acquire an evaluation result on a gap between the inspection-object surface and the inspection probe for each flaw detection point; a flaw detection data collector configured to acquire flaw detection data of an inspection object for each flaw detection point; a flaw detection data analyzer configured to evaluate presence/absence of a flaw in the inspection-object surface based on the flaw detection data of the inspection object and the evaluation result on the gap for each flaw detection point.

A readout circuit for an electromagnetic inspection system for nondestructive testing of a test object is disclosed. The inspection system includes a plurality of sensors for sensing an electromagnetic response from the test object and generating therefrom a plurality of response signals. The readout circuit can include a plurality of anti-aliasing filters, each configured to receive the response signal from one of the sensors and bandlimit the response signal to produce one of a plurality of bandlimited signals. The readout circuit can also include a time-division multiplexer configured to multiplex the bandlimited signals into a time-division multiplexed (TDM) signal including a sequence of frames outputted at a TDM frame rate, each frame including a plurality of time slots, each time slot assigned to one of the bandlimited signals, wherein the anti-aliasing filters are configured to operate based on the TDM frame rate to attenuate aliasing artifacts in the TDM signal.

A defect inspection device configured to measure a surface shape of an inspection target using light applied to the inspection target via a spatial light phase modulator based on an interference state of reflected light from the inspection target obtained via the spatial light phase modulator, to measure magnetic field distribution of a surface of the inspection target magnetized by an excitation device for magnetizing the inspection target using light applied to the inspection target via the spatial light phase modulator based on an interference state of reflected light from the inspection target obtained via the spatial light phase modulator, and to separate data of a magnetic field specific portion which exists on the surface of the inspection target from magnetic field distribution data which is a measurement result of magnetic field distribution of the inspection target based on surface shape data which is a measurement result of the surface shape of the inspection target, to suppress deterioration of measurement accuracy of magnetic field distribution generated by the surface shape of the inspection target and to improve defect detection accuracy.

Quantization noise in an oversampled eddy current digital drive circuit is reduced using a noise shaping filter.

Methods and apparatus for detecting the presence or absence of unwanted metal deposits on a substrate holder of an electroplating apparatus are described herein. In various embodiments, a plating sensor is used to detect unwanted metal deposits. The plating sensor may be mounted relatively far away from the area that it measures (e.g., the sensor target area). For instance, the plating sensor may be on one side of the electroplating apparatus (in some cases mounted on a drip shield), and the sensor target area may be on the opposite side of the electroplating apparatus. In this way, the plating sensor can measure across the electroplating apparatus. This placement provides a relatively deep depth of focus for the plating sensor, and provides some physical separation between the plating sensor and the electroplating chemistry. Both of these factors lead to more reliable detection results.

An approach to determining the crash dynamic behavior of structural castings made of a AlSi10MnMg alloy in a simple and cost-effective manner is provided. In this approach eddy current testing is carried out using a high-resolution measuring coil which is adjusted to the cast-specific conductivity.

The embodiments herein relate to methods and apparatus for detecting whether unwanted metallic deposits are present on a bottom of a substrate holder used in an electroplating apparatus. The presence of such unwanted deposits is harmful to electroplating processes because the deposits scavenge current that is intended to cause electroplating on a substrate. When such current scavenging occurs, the electroplating results on the substrates are poor. For instance, features positioned near the edge of a substrate are likely to plate to an insufficient thickness. Further, where such current scavenging is great, the overall thickness of the material plated on the substrate may be too thin. As such, there is a need to detect when such unwanted deposits are present, such that plating under these poor conditions may be avoided. This detection will help preserve costly wafers.

The present invention relates to a device for detecting a crack in a battery cell by using an eddy current, comprising: an inspection unit comprising a first sensor for inducing an eddy current and a second sensor for sensing a signal of the eddy current induced by the first sensor, wherein the inspection unit performs inspection by means of the eddy current while the battery cell is driven; a transfer unit for sequentially transferring a plurality of battery cells from a point where the battery cells are introduced to a point where the battery cells are taken out; and a control unit which is electrically connected to the inspection unit and receives, evaluates, and controls the eddy current signal sensed by the inspection unit. The device for detecting a crack in a battery cell of the present invention can detect the presence and positions of cracks generated on an electrode, an electrode tab, and a welding unit by means of a non-destructive method.

A rotary bolt hole eddy current inspection scanner using a differential eddy current probe, the circuitry of the scanner is embodied with a filtering circuit with three filters: FIR (Finite Impulse Response), a low pass filter, and a phase control filter (by means of a Hilbert transform). The result from a scan of a bolt hole is an output signal on an impedance plane exhibiting a “backwards 6” shape of stable size when the scanner changes its rotating rate significantly.

A system and method for non-destructive analysis of a structure. A probe acquires a transient time based reference signal and at least one test signal. The reference signal and test signals are transformed to the frequency domain. The frequency domain test signal can be normalized using the frequency domain reference signal. Parameters of interest are evaluated at each test location by iteratively determining estimated parameter values, generating an estimated frequency domain test signal using the estimated parameter values and determining the convergence between the estimated frequency domain test signal and the normalized frequency domain test signal. The parameters values are determined as the estimated parameter values resulting in a maximized convergence between the estimated signal and the normalized test signal. The parameter values can be used to visualize and model various features of the structure.