G01N29/0681

Method, atomic force microscopy system and computer program product

This document is directed at a method of manufacturing a semiconductor element, the method comprising manipulating a surface of a substrate using an atomic force microscope, the atomic force microscope including a probe, the probe including a cantilever and a probe tip, the substrate including at least one or more device features embedded underneath the surface. The method comprises: imaging the embedded device features, and identifying that a position of the probe tip of the atomic force microscope is aligned with the feature; and displacing the probe tip transverse to the surface for exerting a stress for performing the step of surface manipulation, as for example contact holes. Imaging is performed by applying and obtaining an acoustic signal to and from the substrate via the probe tip, including a first and a second signal component at different frequencies. The imaging and surface manipulation are performed using said same probe and probe tip.

Method of and atomic force microscopy system for performing subsurface imaging

The document relates to a method of performing subsurface imaging of embedded structures underneath a substrate surface, using an atomic force microscopy system. The system comprises a probe with a probe tip, and a sensor for sensing a position of the probe tip. The method comprises the steps of: positioning the probe tip relative to the substrate: applying a first acoustic input signal to the substrate; applying a second acoustic input signal to the substrate; detecting an output signal from the substrate in response to the first and second acoustic input signal; and analyzing the output signal. The first acoustic input signal comprises a first signal component and a second signal component, the first signal component comprising a frequency below 250 megahertz and the second signal component either including a frequency below 2.5 megahertz or a frequency such as to provide a difference frequency of at most 2.5 megahertz with the first signal component, such as to enable analysis of an induced stress field in the substrate; and wherein the second acoustic input signal comprises a third signal component having a frequency above 1 gigahertz, such that the return signal includes a scattered fraction of the second acoustic input signal scattered from the embedded structures. This enables to perform imaging a various depths in one pass, across a large range of depths.

METHOD FOR MEASURING DAMAGE OF A SUBSTRATE CAUSED BY AN ELECTRON BEAM
20210333226 · 2021-10-28 ·

A method for measuring damage (D) of a substrate (1) caused by an electron beam (2). The method comprises using an atomic force microscope (AFM) to provide a measurement (S2) of mechanical and/or chemical material properties (P2) of the substrate (1) at an exposure area (1a) of the electron beam (2). The method further comprises calculating a damage parameter (Sd) indicative for the damage (D) based on the measurement (S2) of the material properties (P2) at the exposure area (1a).

Method of performing atomic force microscopy with an ultrasound transducer

A method of performing atomic force microscopy (AFM) measurements, uses an ultrasound transducer to transmit modulated ultrasound waves with a frequency above one GHz from the ultrasound transducer to a top surface of a sample through the sample from the bottom surface of the sample. Effects of ultrasound wave scattering are detected from vibrations of an AFM cantilever at the top surface of the sample. Before the start of the measurements, a drop of a liquid is placed on a top surface of the ultrasound transducer. The sample is placed on the top surface of the ultrasound transducer, whereby the sample presses the liquid in the drop into a layer of the liquid between the top surface of the ultrasound transducer and a bottom surface of the sample. The AFM measurements are started after a thickness of the layer of the liquid has stabilized.

Method of detecting an anomaly in a single crystal structure

A method of detecting an anomaly in a crystallographic structure, the method comprising: illuminating the structure with x-ray radiation in a known direction relative to the crystallographic orientation; positioning the structure such that its crystallographic orientation is known; detecting a pattern of the diffracted x-ray radiation transmitted through the structure; generating the simulated pattern based on the known direction relative to the crystallographic orientation; comparing the detected pattern to a simulated pattern for x-ray radiation illuminating in the known direction; and, detecting the anomaly in the crystallographic structure based on the comparison.

Acoustical microscope
11085901 · 2021-08-10 ·

A system and method for using a microscope to aurally observe a specimen in a fluid is provided. In one embodiment of the present invention, the microscope is modified to include a first beam splitter, splitting a visual of the specimen magnified by the objective lens. A first beam is then provided to an audio frequency modulation sensing (AFMS) device, whose function is to sense photoacoustic modulation of the specimen and to extract aural data, allowing sound energy to be observed by a user (e.g., displayed on screen, played on a speaker, etc.). The second beam is provided to a second beam splitter, allowing visuals to be provided to the eyepiece and to at least one other sensor, where a second visual of the specimen is captured. The second visual can then be displayed on a screen in time synchronization with aural data provided by the AFMS device.

METHODS AND SYSTEMS TO DETECT SUB-SURFACE DEFECTS IN ELECTRONICS MODULES USING SHEAR FORCE MICROSCOPY

A method of detecting sub-surface voids in a sample comprises positioning a probe adjacent to a first point on the sample, emitting an ultrasonic wave from the probe towards the sample, moving the probe towards the sample, measuring a shear force amplitude of a reflection of the ultrasonic wave at the probe as the probe moves towards the sample, creating an approach curve by plotting the measured shear force amplitude of the reflection of the ultrasonic wave as a function of a distance between the probe and the sample, and determining whether a sub-surface void exists at the first point on the sample based on a slope of the approach curve.

Acoustic Array Detection and Imaging
20210302389 · 2021-09-30 ·

Novel tools and techniques for acoustic array detection and imaging are provided. A system includes an acoustic array comprising one or more array panels. Each of the one or more array panels includes a transceiver array of one or more acoustic transceivers, each acoustic transceiver further including a transmitter element configured to generate sound and a receiver element to capture sound. A driver circuit is coupled to a first transceiver array of a first array panel of the one or more array panels, the driver circuit configured to drive individually each transmitter element and each receiver element of the first transceiver array. A controller interface is coupled to the driver circuit, and a controller coupled to the controller interface.

Atomic force microscopy system, method for mapping one or more subsurface structures located in a semiconductor device or for monitoring lithographic parameters in a semiconductor device and use of such an atomic force microscopy system

Atomic force microscopy system comprising an atomic force microscopy device and a substrate carrier having a carrier surface carrying a substrate. The substrate has a substrate main surface and a substrate scanning surface opposite the substrate main surface. The atomic force microscopy device comprises a scan head including a probe. The probe comprises a cantilever and a probe tip arranged on the cantilever. The atomic force device further comprises an actuator cooperating with at least one of the scan head or the substrate carrier for moving the probe tip and the substrate carrier relative to each other in one or more directions parallel to the carrier surface for scanning of the substrate scanning surface with the probe tip. A signal application actuator applies, during said scanning, an acoustic input signal to the substrate, said acoustic input signal generating a first displacement field in a first displacement direction only. A tip position detector monitors motion of the probe tip relative to the scan head during said scanning for obtaining an output signal. The tip position detector is arranged for monitoring motion of the probe tip only in a direction orthogonal to the displacement direction.

Method of and system for detecting structures on or below the surface of a sample using a probe including a cantilever and a probe tip

The present document relates to a method of detecting structures on or below the surface of a sample using a probe including a cantilever and a probe tip, the cantilever being characterized by one ore more normal modes of resonance including a fundamental resonance frequency, the method including: applying, using a transducer, a vibrational input signal to the sample; sensing, while the probe tip is in contact with the surface, an output signal indicative of motion of the probe tip due to vibrations at the surface induced by the vibrational input signal; wherein the vibrational input signal comprises at least a first signal component having a frequency within a range of 10 to 100 megahertz; and wherein the vibrational input signal is amplitude modulated using at least a second signal component having a modulation frequency below 5 megahertz. The present document further relates to a scanning probe microscopy method.