A method of determining a bonding energy of a bonded wafer includes receiving the bonded wafer including a first wafer bonded with a second wafer, and inserting a blade between the first wafer and the second wafer to form a crack between the first wafer and the second wafer, the crack extending from a portion of the blade contacting the first wafer and the second wafer to a point where the first wafer and the second wafer are still bonded. The method further includes passing light beams through the crack at an outer edge of the bonded wafer, and collecting light beams transmitting through the crack at a light detector. And the method further includes determining the bonding energy of the bonded wafer based on a light intensity of the collected light beams.

A device of inspecting defects of a wafer diced or aligned, the wafer including, after being diced or aligned, a silicon wafer layer and a blue film affixed to the bottom of the silicon wafer layer, the device including: an immersion liquid detector having a casing, the casing having a transparent lid, allowing a liquid to flow through and fill between the blue film and the transparent lid; a lens assembly disposed in the casing and below the transparent lid; an optical lens assembly disposed in the casing and below the lens assembly; a light source for generating visible light and infrared light; and a visible-light camera and an infrared camera, both adapted to perform imaging on the bottom of the silicon wafer layer.

A bidirectional reflectance spectroscopy measurement device for trace mineral samples of extraterrestrial objects includes a monochromatic illumination module, a microscopic spectroscopy measurement module, a sample carrying module and a control and data analysis module, wherein the monochromatic illumination module is configured with a light outlet, the microscopic spectroscopy measurement module is configured with a light inlet, the sample carrying module is located between the light outlet and the light inlet, and the control and data analysis module is electrically connected to the monochromatic illumination module, the microscopic spectroscopy measurement module and the sample carrying module respectively, the sample carrying module is configured to place and protect a sample to be measured, by synchronously controlling the monochromatic illumination module and the microscopic spectroscopy measurement module, spectral data of different spectral bands of a trace sample to be measured in the sample carrying module is obtained.