A wafer measurement apparatus for measuring a bonding strength of a bonded wafer includes a wafer holder to hold a bonded wafer into which a blade is inserted and where a crack occurs, a lighting assembly including a light source, a light source controller to select the light source of the lighting assembly for detection of the crack reflected in the bonded wafer, on photographing conditions, a photographing assembly to photograph the bonded wafer by using the photographing conditions corresponding to a wavelength of the light source, on sensitivity of the wavelength of the light source, and a calculator to select one photographing condition, transmit the selected photographing condition, and calculate bonding strength, on a crack distance from a blade edge, extracted from an image of the bonded wafer, to a crack edge.

The invention relates to a device for carrying out bending tests on panel-shaped or beam-shaped samples (1), in which two rotary drives are arranged at a distance from one another and a flange (3) is fastened to each of the drive shafts of the rotary drives, said drive shafts being oriented parallel to one another. At least two bar-shaped bending elements (2) oriented parallel to the axis of rotation of the drive shafts and arranged at a distance from the axis of rotation and at a distance from one another are provided on each of the flanges (3). A panel-shaped or beam-shaped sample (1) can be introduced between the two bar-shaped bending elements (2) on the two flanges (3). In the event of rotation of the rotary drives in opposite directions of rotation, bending forces are exerted on the sample (1) and each of the two rotary drives can be controlled individually and connected to an electronic open-loop or closed-loop control unit.

A wafer measurement apparatus for measuring a bonding strength of a bonded wafer includes a wafer holder to hold a bonded wafer into which a blade is inserted and where a crack occurs, a lighting assembly including a light source, a light source controller to select the light source of the lighting assembly for detection of the crack reflected in the bonded wafer, on photographing conditions, a photographing assembly to photograph the bonded wafer by using the photographing conditions corresponding to a wavelength of the light source, on sensitivity of the wavelength of the light source, and a calculator to select one photographing condition, transmit the selected photographing condition, and calculate bonding strength, on a crack distance from a blade edge, extracted from an image of the bonded wafer, to a crack edge.

A method of testing a material sample of a type used in a wall of a structure in a standard test for in-plane fracture toughness evaluation. The method comprises obtaining a sample having a lateral length no larger than a thickness of the wall of the structure, shaping the sample to have (a) a bottom surface, (b) a profiled top surface having a central notch, (c) a first coupling feature on a first side of the central notch, and (d) a second coupling feature on a second side of the central notch, assembling a test specimen which increases the width of the sample beyond the lateral width by coupling a first lateral extension to the first coupling feature and a second lateral extension to the second coupling feature, and applying a standard fracture toughness test to the so-assembled test specimen and sample to evaluate the fracture toughness of the sample.

The present disclosure relates to an information processing device, an information processing method, and a program for enabling more accurate prediction of a crack to be made. A model acquisition unit acquires a structure model M.sub.D from a model generation unit, an external device (not illustrated), or the like. Amplitude load energy A in an element E0 having no cracks is set on the basis of a relationship between an equivalent stress and an equivalent elastic strain experimentally obtained according to a material constituting the element E0. Since the equivalent elastic strain depends on a crack variable p, the amplitude load energy A is expressed as a function of the crack variable . A crack prediction unit predicts a crack to be generated in a structure D by calculating a differential equation having a term proportional to the amplitude energy. The present disclosure can be applied to, for example, a crack prediction device that predicts a crack.

A reinforced concrete tile having top and bottom surfaces defining a thickness, the reinforced concrete tile comprising two or more reinforcing inserts imbedded in the concrete tile in proximity to the bottom surface, the two or more reinforcing inserts being of elongated shape and comprising a plurality of scales distributed along the length and extending upwardly from the bottom surface whereby a compensating force is created upon application of a load on the top surface such that deflection is reduced as the load is increased for at least a range of loads until a yield load is reached.

A method of testing a test specimen assembly is disclosed herein. The method can include providing the test specimen assembly which includes a control element and a test element, which are formed from different materials.

An embodiment interfacial bonding test structure may include a first substrate having a first planar surface, a second substrate having a second planar surface that is parallel to the first planar surface, a first semiconductor die, and a second semiconductor die, each semiconductor die bonded between the first substrate and the second substrate thereby forming a sandwich structure. The first semiconductor die and the second semiconductor die may be bonded to the first surface with a first adhesive and may be bonded to the second surface with a second adhesive. The first semiconductor die and the second semiconductor die may be displaced from one another by a first separation along a direction parallel to the first planar surface and the second planar surface. The second substrate may include a notch having an area that overlaps with an area of the first separation in a plan view.

To easily detect a crack having occurred in a steel material. A current measurement device measures a value of a current flowing through a target steel material that is immersed in an electrolyte aqueous solution and applied with tensile stress while subjected to hydrogen charging, and a device for detecting the occurrence of a crack or the like uses the measured current value to determine the occurrence of a crack in the target steel material when the amount of change in the current flowing through the target steel material, the change rate of the amount of change in the current, or the change rate of the change rate of the amount of change in the current exceeds a threshold value. The device for detecting the occurrence of a crack or the like determines the occurrence of a crack in the steel material when the change rate of the change rate of the amount of change in the current is less than a negative value of an absolute value of the threshold value, and determines the occurrence of fracture in the steel material when the change rate exceeds the absolute value of the threshold value.

Aspects of the present disclosure include a crack detection system having a crack detection sensor including a plurality of sectors disposed concentrically around a hole within the crack detection sensor, a plurality of contacts configured to electrically connect to one or more sectors of the plurality of sectors, and a crack detection circuit configured to measure resistances of the one or more sectors of the plurality of sectors via two or more of the plurality of contacts to detect a crack in the one or more sectors of the plurality of sectors.