G01N2203/0064

METHODS OF DETERMINING STRAIN LIMITS AND DESIGNING DEVICES BASED ON STRAIN LIMITS

A method and system is disclosed for determining upper strain limits for materials, and designing devices or components based on determined strain limits.

Infant care device including predictive failure side panels

An infant care device that can include a failure indicating feature in one or more of the side panels to discourage improper use of the side panels to move the infant care device. When a side panels is used to move the infant care device and a force greater than a pre-determined maximum is applied to the side panel, the failure indicting feature indicates such improper use. The failure indicating feature is designed to provide an indication at a level of force that is less than the level of force that would damage the hinge and latch assembly holding the side panel. The failure indicating feature can provide a physical indication or a visual indication when a force greater than a predetermined maximum is applied to the side panel.

CRACK GROWTH PREDICTION DEVICE, CRACK INSPECTION SYSTEM, AND CRACK GROWTH PREDICTION METHOD

A crack growth prediction device includes: a parameter input unit to which parameters of initial values of at least a shape of the structure, a force applied to the structure, a material characteristic of the structure, and a crack shape, including uncertainty of each parameter, are each inputted as a probability distribution; a model generation unit which generates a state space model for predicting a crack growth state constituted of a state equation and an observation equation from the inputted parameters; a crack shape measurement unit which measures the crack shape of the structure; and an estimation unit which estimates a posterior distribution including the crack shape and the parameters, from a probability distribution of a measurement value of the crack shape measured by the crack shape measurement unit and uncertainty due to measurement error, and a prior distribution of the crack shape predicted by the state space model.

METHOD FOR EVALUATING SUSCEPTIBILITY TO LIQUID METAL EMBRITTLEMENT CRACKING IN RESISTANCE SPOT WELDED PORTION OF STEEL SHEET

A method for evaluating susceptibility to liquid metal embrittlement cracking in a resistance spot welded portion of a steel sheet that enables highly accurate and quantitative evaluation is provided. The method includes: overlapping a first steel sheet and a second steel sheet, one or both of which are galvanized steel sheets, without an intervening gap to obtain a sheet combination, sandwiching the sheet combination between a pair of electrodes, and applying current and pressure via the electrodes to perform resistance spot welding; applying to a welded portion of the second steel sheet at the same time as or after the end of the current application; then observing the welded portion of the second steel sheet to ascertain the presence or absence of liquid metal embrittlement cracking; and evaluating susceptibility to liquid metal embrittlement cracking in the welded portion based on the observation result.

ELECTRODE CATALYST LAYER EVALUATION DEVICE, ELECTRODE CATALYST LAYER EVALUATION METHOD, AND PROGRAM
20250258075 · 2025-08-14 ·

To provide an electrode catalyst layer evaluation device, an electrode catalyst layer evaluation method, and a program, which are capable of reducing cost and man-hours. The electrode catalyst layer evaluation device includes the acquisition unit that acquires the hardness and loss tangent tan of the electrode catalyst layer of a fuel cell, and the crack occurrence rate estimation unit that estimates the crack occurrence rate of the electrode catalyst layer, based on the hardness and loss tangent tan acquired by the acquisition unit.

Fine Detection Device and Method for Crack Initiation and Propagation of Rock Specimen During Loading Process
20250258072 · 2025-08-14 ·

The present disclosure provides a fine detection device and method for crack initiation and propagation of a rock specimen during loading process. The device comprises an organic glass skeleton, a plurality of sensor support skeletons, a multi-parameter dynamic acquisition system, a servo press bearing platform and a computer, wherein the organic glass skeleton is placed in the middle of the servo press bearing platform, the sensor support skeletons are arranged inside the organic glass skeleton, the rock specimen is arranged inside the sensor support skeleton, the multi-parameter dynamic acquisition system is fixedly arranged on the sensor support skeleton, the multi-parameter dynamic acquisition system is in contact with the rock specimen, and the multi-parameter dynamic acquisition system and the servo press bearing platform are electrically connected to the computer.

Fine detection device and method for crack initiation and propagation of rock specimen during loading process

The present disclosure provides a fine detection device and method for crack initiation and propagation of a rock specimen during loading process. The device comprises an organic glass skeleton, a plurality of sensor support skeletons, a multi-parameter dynamic acquisition system, a servo press bearing platform and a computer, wherein the organic glass skeleton is placed in the middle of the servo press bearing platform, the sensor support skeletons are arranged inside the organic glass skeleton, the rock specimen is arranged inside the sensor support skeleton, the multi-parameter dynamic acquisition system is fixedly arranged on the sensor support skeleton, the multi-parameter dynamic acquisition system is in contact with the rock specimen, and the multi-parameter dynamic acquisition system and the servo press bearing platform are electrically connected to the computer.

Test structures to determine integrated circuit bonding energies and methods of making and using the same

An embodiment interfacial bonding test structure may include a first substrate having a first planar surface, a second substrate having a second planar surface that is parallel to the first planar surface, a first semiconductor die, and a second semiconductor die, each semiconductor die bonded between the first substrate and the second substrate thereby forming a sandwich structure. The first semiconductor die and the second semiconductor die may be bonded to the first surface with a first adhesive and may be bonded to the second surface with a second adhesive. The first semiconductor die and the second semiconductor die may be displaced from one another by a first separation along a direction parallel to the first planar surface and the second planar surface. The second substrate may include a notch having an area that overlaps with an area of the first separation in a plan view.

Apparatuses and methods for detecting cracks

Aspects of the present disclosure include a crack detection system having a crack detection sensor including a plurality of sectors disposed concentrically around a hole within the crack detection sensor, a plurality of contacts configured to electrically connect to one or more sectors of the plurality of sectors, and a crack detection circuit configured to measure resistances of the one or more sectors of the plurality of sectors via two or more of the plurality of contacts to detect a crack in the one or more sectors of the plurality of sectors.

TEST STRUCTURES TO DETERMINE INTEGRATED CIRCUIT BONDING ENERGIES AND METHODS OF MAKING AND USING THE SAME
20250347602 · 2025-11-13 ·

An embodiment interfacial bonding test structure may include a first substrate having a first planar surface, a second substrate having a second planar surface that is parallel to the first planar surface, a first semiconductor die, and a second semiconductor die, each semiconductor die bonded between the first substrate and the second substrate thereby forming a sandwich structure. The first semiconductor die and the second semiconductor die may be bonded to the first surface with a first adhesive and may be bonded to the second surface with a second adhesive. The first semiconductor die and the second semiconductor die may be displaced from one another by a first separation along a direction parallel to the first planar surface and the second planar surface. The second substrate may include a notch having an area that overlaps with an area of the first separation in a plan view.