G01N2203/0224

SOLDER JOINT LIFE PREDICTOR AND SOLDER JOINT LIFE PREDICTION METHOD
20220105583 · 2022-04-07 · ·

A control device including a solder joint life predictor includes: a temperature sensor that measures temperature of a solder joint on an electronic circuit board that drives a heater and a motor; a storage that stores a reference acceleration factor that is an acceleration factor based on a test condition of a thermal shock test and a reference condition in an environment in which the electrical appliance is used; a calculator that calculates an actual acceleration factor from a temperature variation range and a maximum reached temperature of the solder joint during one cycle from start to end of driving of the heater or the motor; and a determiner that predicts the life of the solder joint by comparing the integrated value of the acceleration factor ratios with a threshold.

CYCLIC FLEXING ENVIRONMENTAL CHAMBER AND METHODS

In one aspect, an apparatus includes a chamber configured to control one or more of humidity, pressure, or temperature and a jaw configured to flex a material system. The chamber includes an enclosure disposed within the chamber, the enclosure having an insulating material, and a motor or an actuator disposed within the enclosure. The chamber includes an inlet tube coupled with the enclosure at a first end and a first wall of the chamber at a second end. In one aspect, a method for determining material performance includes exposing a material system to a relative humidity of from 0% to 98% and flexing the material system at a first temperature in a chamber, the chamber comprising an enclosure disposed within the chamber and a motor disposed within the enclosure. The method includes operating the motor at a second temperature different from the first temperature during the flexing.

TEST ASSEMBLY AND METHOD OF TESTING AN ASSEMBLY FOR THERMAL FATIGUE
20240102904 · 2024-03-28 · ·

A method of testing a test specimen assembly is disclosed herein. The method can include providing the test specimen assembly which includes a control element and a test element, which are formed from different materials.

Thermal-stress-pore pressure coupled electromagnetic loading triaxial Hopkinson bar system and test method

The present disclosure provides a thermal-stress-pore pressure coupled electromagnetic loading triaxial Hopkinson bar system and test method, the system mainly consists of an electromagnetic pulse generation system, a servo-controlled axial pressure loading system, a servo-controlled confining pressure loading system, a thermal control system, a pore pressure loading system, a bar system, and a data monitoring and acquisition system. Based on the conventional Hopkinson bar, the present disclosure creatively introduces a real-time loading and control system for confining pressure, thermal, and pore pressure, aiming to solve the technical problem that the existing test apparatus cannot be used to study dynamic response of deep rock mass under the coupling effect of thermal-stress-pore pressure and dynamic disturbance during dynamic impact loading.

Method to estimate strain rate dependent elastic modulus of materials using dynamic mechanical analysis data
10345210 · 2019-07-09 · ·

A method for predicting an elastic modulus of a material includes providing a sample in a dynamic mechanical analysis device, performing a temperature sweep test to obtain a first data set, performing a frequency sweep test to obtain a second data set, using the second data set to generate a master curve in a frequency domain of the at least one of the storage modulus of the sample or the loss modulus of the sample using time-temperature superposition, converting the master curve in the frequency domain into a time domain relaxation function, and using the time domain relaxation function to predict the elastic modulus of the material.

System and method for determining the adiabatic stress derivative of the temperature for rocks under water

A system and method for determining adiabatic stress derivative of temperature for rocks under water. The system includes three pressure vessels disposed in seawater. A data collecting unit is in the first pressure vessel. A rock sample is in a first chamber of the second pressure vessel. A temperature sensor is in each of the center of the rock, the surface of the rock sample, and the first chamber. A pressure sensor is also in the first chamber. Outputs of the temperature sensors and the pressure sensor are communicated with inputs of the data collecting unit. A first drain valve is provided on the second pressure vessel and communicated with the first chamber. A second drain valve is provided between the second pressure vessel and the third pressure vessel, and communicated with the first chamber and the second chamber.

PROCESSES FOR PREDICTING SMALL SCALE STEADY STATE (S4) CRITICAL TEMPERATURES

This disclosure provides methods of predicting the steady state small scale critical temperatures (S4 T.sub.c) of polymer resins and pipes therefrom.

Wear test apparatus

Disclosed is an exemplary test apparatus having an autoclave head, a fretting mechanism connected on a first end to a first side of the autoclave head, a load train operably connected with a first end of the fretting mechanism, an autoclave adapter connected on a first side to a second side of the autoclave head, and a force balance assembly connected to a second side of the autoclave head and configured to equalize a pressure acting on the load train. Certain exemplary embodiments include an upper plate, a plurality of upper tie rods connected to a first side of the upper plate and a second side of the autoclave adapter, a lower plate, a plurality of lower tie rods connected to the first side of the autoclave head and a first side of the lower plate, and a pressure vessel sealingly connected to the first side of the autoclave head.

Solder joint life predictor and solder joint life prediction method
12032039 · 2024-07-09 · ·

A control device including a solder joint life predictor includes: a temperature sensor that measures temperature of a solder joint on an electronic circuit board that drives a heater and a motor; a storage that stores a reference acceleration factor that is an acceleration factor based on a test condition of a thermal shock test and a reference condition in an environment in which the electrical appliance is used; a calculator that calculates an actual acceleration factor from a temperature variation range and a maximum reached temperature of the solder joint during one cycle from start to end of driving of the heater or the motor; and a determiner that predicts the life of the solder joint by comparing the integrated value of the acceleration factor ratios with a threshold.

HYDROGEN TANK CYCLING FACILITY

An installation for cyclic testing of a hydrogen tank, including a first, low-pressure circuit for circulating a first fluid having a first viscosity and in which a pressure-generating hydraulic power unit is arranged, a second, high-pressure circuit for circulating a second fluid having a second viscosity lower than the viscosity of the first fluid, a third high-pressure circuit for circulating a third fluid with a melting point lower than that of the first fluid and preferably at most ?40? C., and at least one multiplier arranged at the junction of the first circuit and the second circuit.