A self-healing method for fractured single crystal SiC nanowires. A hair in a Chinese brush pen of yellow weasel's hair moves and transfers nanowires, which are placed on an in-situ TEM mechanical microtest apparatus. An in-situ nanomechanical tension test is realized. The nanowires are loaded. Displacement is 0-200 nm. Fracture strength of the single crystal nanowires is 12-15 GPa. After the nanowires are fractured, unloading causes slight contact between the fractured end surfaces, electron beam is shut off, and self-healing of the nanowires is conducted in a vacuum chamber. Partial recrystallization is found at a fracture after self-healing through in-situ TEM representation. A fracture strength test is conducted again after self-healing. A fractured position after healing is the same as the position before healing. The fracture strength of the single crystal nanowires after self-healing is 1-2.5 GPa. The recovery ratio of the fracture strength is 10-20%.

Apparatus and methods of evaluating brittleness by measuring force applied to an electrode specimen by simulating a wound state of a jelly-roll type electrode assembly are disclosed herein. In an embodiment, a brittleness evaluation apparatus includes a jig unit, a driving unit, and a measurement analyzing unit. The jig unit includes two jigs, a groove formed between the jigs, a pressing plate, and guides. The jigs facing each other and have top surfaces formed in a horizontal plane and configured to receive a specimen arranged on the top surfaces along a length direction extending between and along the top surfaces. The pressing plate is arranged perpendicular to the length direction and configured to cause the specimen to bend by descending into the groove. The guides are located on each of the top surfaces of the jigs and configured to prevent distortion of the specimen during descent of the pressing plate.

According to one embodiment described herein, the forces of a shrink film may be measured. The method of measuring the forces may include providing a shrink film processing unit and a testing vehicle moveable within the shrink film processing unit, positioning a shrink film around the testing vehicle, processing the wrapped testing vehicle by shrinking the shrink film around the testing vehicle as the testing vehicle moves through the shrink film processing unit, and measuring the forces applied by the shrink film on the testing vehicle with one or more force sensors at multiple separate sensor positions on the exterior of the testing vehicle during processing, after processing, or both.

Apparatus and methods of evaluating brittleness by measuring force applied to an electrode specimen by simulating a wound state of a jelly-roll type electrode assembly are disclosed herein. In an embodiment, a brittleness evaluation apparatus includes a jig unit, a driving unit, and a measurement analyzing unit. The jig unit includes two jigs, a groove formed between the jigs, a pressing plate, and guides. The jigs facing each other and have top surfaces formed in a horizontal plane and configured to receive a specimen arranged on the top surfaces along a length direction extending between and along the top surfaces. The pressing plate is arranged perpendicular to the length direction and configured to cause the specimen to bend by descending into the groove. The guides are located on each of the top surfaces of the jigs and configured to prevent distortion of the specimen during descent of the pressing plate.

A method and system for analyzing a physical characteristic of a film sample are described herein. The system may include a material holder system configured to hold the film sample. The system may include a tensile testing system configured to stretch the film sample and determine a physical characteristic of the film sample. The system may include a movable system coupled to the material holder system and configured to move the held film sample to be analyzed or tested between stations. The movable system is configured to move the held film sample in the material holder system to the tensile testing system.

A portable flexure fixture including a fixture housing, a translatable plug, a load ring, and a support ring. The fixture housing includes a first end opposite a second end, a plug receiving opening extending into the first end and a test opening extending into the second end. The support ring is disposed in the fixture housing. The translatable plug is insertable into the plug receiving opening of the fixture housing and is translatable in both a sample engaging direction and a sample releasing direction. Further, the load ring is coupled to the translatable plug and is positioned at a sample facing end of the translatable plug such that translation of the translatable plug in the sample engaging direction translates the load ring in the sample engaging direction and translation of the translatable plug in the sample releasing direction translates the load ring in the sample releasing direction.

A self-healing method for fractured SiC single crystal nanowires. A hair in a Chinese brush pen of yellow weasel's hair moves and transfers nanowires, which are placed on an in-situ TEM mechanical microtest apparatus. An in-situ nanomechanical tension test is realized. The nanowires are loaded. Displacement is 0-200 nm. Fracture strength of the single crystal nanowires is 12-15 GPa. After the nanowires are fractured, unloading causes slight contact between the fractured end surfaces, electron beam is shut off, and self-healing of the nanowires is conducted in a vacuum chamber. Partial recrystallization is found at a fracture after self-healing through in-situ TEM representation. A fracture strength test is conducted again after self-healing. A fractured position after healing is the same as the position before healing. The fracture strength of the single crystal nanowires after self-healing is 1-2.5 GPa. The recovery ratio of the fracture strength is 10-20%.

A procedure is provided for evaluating the score, snap and edge appearance of wallboard panels, and includes scoring a wallboard panel with a knife at a constant and known force using a benchtop board scoring device; snapping the scored panel in a Universal Board Testing Machine to measure the breaking force, forming a snapped panel edge; measuring a cleanliness of the snapped panel edge by placing a straight edge against the snapped panel edge and measuring gaps between the snapped panel edge and the straight edge in a plurality of locations on a face of the panel, and a plurality of locations on a back of the panel; and averaging all of the measured gaps to create an Index Score.

A method of evaluating the quality of a thin film layer may include: forming the thin film layer on a substrate; applying a stress to the thin film layer; and evaluating the quality of the thin film layer. A device for evaluating the quality of the thin film layer may include a stress chamber for applying a stress to the thin film layer and a refractive index measuring unit for evaluating the quality of the thin film layer based on a rate of change of a refractive index.

Systems and methods for determining a Material's (MTL) mechanical properties. The methods comprise: coupling a first end of MTL to a First Mechanical Mechanism (FMM) movable in a First Direction (FD) and coupling a second end of MTL to a Second Mechanical Mechanism (SMM) movable in a Second Direction (SD); applying a first Pulling Force (PF) to MTL; applying an Oscillating Force (OF) to MTL; applying a second PF to MTL so as to cause any undulations in MTL to be removed and to cause a loading of fibers or polymeric units that support MTL; allowing MTL to oscillate through a series of cycles of loading and unloading; measuring a strain/stress on MTL as a function of time; determining a natural frequency of MTL based on the strain/stress; and determining an elastic modulus of MTL using the natural frequency.