Provided is a sensor apparatus that includes a substrate, one or more first IMU sensors, and one or more second IMU sensors. The substrate has a first surface and a second surface opposite to the first surface. The one or more first IMU sensors are arranged on the first surface. The one or more second IMU sensors are arranged on the second surface. By arranging the IMU sensors on both the first surface and the second surface, it is possible to reduce the size of the apparatus and to suppress a deformation of the substrate due to heat. This makes it possible to realize a highly accurate measurement based on a detection result (sensing result) of a plurality of IMU sensors.

A dual axis accelerometer with a single proof mass measures in-plane acceleration (e.g., either along an x-axis or a y-axis), out-of-plane acceleration (e.g., normal to an x-y plane), and tilt of a fixed portion of a MEMS layer (e.g., normal to the x-y plane). In response to a tilt measurement, the dual-axis accelerometer compensates any offset (e.g., variability) of the out-of-plane accelerometer in order to maintain offset stability. In some embodiments, multiple dual axis accelerometers, perpendicularly configured, may be implemented via processing circuitry to offer three axis sensitivity capability.

A transducer includes a second semiconductor substrate on which a first insulation layer having a first metal layer on its surface is disposed, a first semiconductor substrate that overlaps the second semiconductor substrate and on which a second insulation layer having a second metal layer on its surface is disposed, a functional element located between the first semiconductor substrate and the second semiconductor substrate, and a eutectic reaction layer bonding the first semiconductor substrate and the second semiconductor substrate to each other in a bonding region located around the functional element. The eutectic reaction layer is a bonding layer formed by eutectic bonding between the first metal layer and the second metal layer. At least one of the first insulation layer and the second insulation layer has a recess having a bottom wider than the bonding region in plan view. The bonding region is located at the bottom.

A MEMS tri-axial accelerometer is provided with a sensing structure having: a single inertial mass, with a main extension in a horizontal plane defined by a first horizontal axis and a second horizontal axis and internally defining a first window that traverses it throughout a thickness thereof along a vertical axis orthogonal to the horizontal plane; and a suspension structure, arranged within the window for elastically coupling the inertial mass to a single anchorage element, which is fixed with respect to a substrate and arranged within the window, so that the inertial mass is suspended above the substrate and is able to carry out, by the inertial effect, a first sensing movement, a second sensing movement, and a third sensing movement in respective sensing directions parallel to the first, second, and third horizontal axes following upon detection of a respective acceleration component. In particular, the suspension structure has at least one first decoupling element for decoupling at least one of the first, second, and third sensing movements from the remaining sensing movements.

Disclosed is an accelerometer. The accelerometer includes: an outer coupling structure, a detection structure connected to the outer coupling structure and an inner coupling structure. The detection structure includes anchors connected to the outer coupling structure, two seesaw structures elastically connected to the anchors, and a displacement detection component. The two seesaw structures are oppositely arranged, and the outer coupling structure includes an outer coupling structure inner ring that is coupled to the outer sides of the two seesaw structures and an outer coupling structure outer ring that encircles an outer circumference of the outer coupling structure inner ring. The accelerometer further includes a detection electrode plate secured to a side, close to the outer coupling structure, of the inner coupling structure. The anchors are evenly distributed at a center of the outer coupling structure, and the inner coupling structure is distributed around the anchors.