A sensor module includes a sensor substrate including a circuit substrate and an inertial sensor mounted on the circuit substrate, a package including a first surface and a second surface in a front-back relationship and a side surface coupling the first surface and the second surface, and housing the sensor substrate inside, and a flexible wiring portion electrically coupled to the sensor substrate and extending from the side surface to an outside of the package, wherein the package includes a convex portion protruding from the first surface and engaging with an object.