Apparatus and associated methods relate to maximizing a signal to noise ratio of an accelerometer by inhibiting signals arising from movements of a proofmass in directions perpendicular to a direction of intended sensitivity. The direction of intended sensitivity of the accelerometer is along an axis of the proofmass. The accelerometer is rendered substantially insensitive to lateral accelerations of the proofmass by making the accelerometer axially symmetric. Two axially-asymmetric acceleration sensing devices are axially engaged in such a manner as to render the coupled sensing devices substantially axially-symmetric. In some embodiments, each acceleration sensor has an axially-thin membrane portion extending from a proofmass portion. The two acceleration sensors can be engaged in an antiparallel fashion at projecting ends of the proofmass portions. An engagement surface will be located about halfway between the axially-thin membrane portions of the two acceleration sensors, thereby causing mechanical symmetry about the engagement surface.

Provided is an accelerometer. The accelerometer includes a frame portion with an opening formed inside, a central portion disposed in the opening, a connecting portion disposed on an upper surface and a lower surface of the central portion and connecting the frame portion and the central portion, and a sensing portion that converts a sensed acceleration into an electrical signal, and the accelerometer senses an acceleration in a Z-axis direction penetrating an upper surface and a lower surface of the central portion, and reduces a sensing of an acceleration in an X-axis direction and a Y-axis direction crossing the Z-axis direction.

A sensor unit includes: a substrate; a first sensor module that is disposed at the substrate and that includes a first acceleration sensor; and a second sensor module that is disposed at the substrate and includes a second acceleration sensor, in which the first sensor module and the second sensor module are arranged to be adjacent to each other at one surface side of the substrate, the first acceleration sensor is eccentrically disposed at the second sensor module side in the first sensor module, and the second acceleration sensor is eccentrically disposed at the first sensor module side in the second sensor module.

There is provided a near-zero-power wakeup system in which a MEMS sensor for mechanical or acoustic signals is coupled to a very-low-power complementary metal oxide semiconductor (CMOS) application-specific integrated circuit (ASIC). Power consumption can be minimized by operating the ASIC with sub-threshold gate voltages.

According to one embodiment, a sensor includes a first support portion, a first movable portion, a first piezoelectric element, and a first magnetic element. The first movable portion extends in a first extension direction and is connected to the first support portion. The first piezoelectric element is fixed to the first movable portion. The first piezoelectric element includes a first electrode, a second electrode provided between the first electrode and the first movable portion, and a first piezoelectric layer provided between the first electrode and the second electrode. The first magnetic element is fixed to the first movable portion. The first magnetic element includes a first magnetic layer, a second magnetic layer, and a first intermediate layer provided between the first magnetic layer and the second magnetic layer.

A method of manufacturing a low density accelerometer comprises the steps of: providing a rigid hollow housing having an upper member and a lower member and forming a groove circumferentially along an inner surface of the rigid hollow housing about a location where the upper member is configured to meet the lower member; providing a sensor assembly including a sensing element affixed to a solid proof mass; disposing the sensor assembly in the lower member of the rigid hollow housing, such that an outer edge of the sensing element engages and is in physical contact with the groove defined in the inner surface of the rigid hollow housing; and placing the upper member of the rigid hollow housing over the lower member of the rigid hollow housing, to enclose the sensor assembly within the rigid hollow housing, wherein the sensor assembly is in physical contact with the rigid hollow housing at the groove.

A vehicle control apparatus according to an embodiment of the present technology includes a control unit. The control unit generates a control signal for controlling behavior of a vehicle body on a basis of a first acceleration detection signal and a second acceleration detection signal, the first acceleration detection signal including information relating to an acceleration acting on the vehicle body, the first acceleration detection signal having an alternating current waveform corresponding to the acceleration, the second acceleration detection signal including information relating to the acceleration, the second acceleration detection signal having an output waveform, an alternating current component corresponding to the acceleration being superimposed on a direct current component in the output waveform.

A monolithic, bulk piezoelectric actuator includes a bulk piezoelectric substrate having a starting top surface and an opposing starting bottom surface and a at least two electrodes operatively disposed on the bulk piezoelectric substrate consisting of at least two discrete electrodes disposed on either/both of the starting top surface and the starting bottom surface and at least one electrode disposed on the respective other starting bottom surface or starting top surface. A stage includes a base, at least two of the monolithic, bulk piezoelectric actuators disposed on the base, a movable platform disposed on the base, and a respective number of deformable connectors each having a first connection to a respective one of the piezoelectric actuators and a second connection to a respective portion of the movable platform. A method for monolithically making a monolithic, bulk piezoelectric actuator involves a direct write micropatterning technique.

A split-type piezoelectric sensor includes a first circuit board and a second circuit board. The first circuit board includes a sub-board, a piezoelectric film, and a first connector. The sub-board and the first circuit board are located on the same plane, and the sub-board is located in a hollow area of the first circuit board and connected to one end in the first circuit board. The piezoelectric film is attached to the sub-board and is electrically connected to the sub-board. The first connector and the piezoelectric film are provided on the same side, and the first connector is electrically connected to the first circuit board. The second circuit board includes a signal processing unit and a second connector electrically connected to the signal processing unit. The second connector is opposite to and detachably connected to the first connector, and the second connector supports the first circuit board.

A measurement unit module includes a printed circuit board (PCB) and electronic components being mounted on a front face of the PCB, a plurality of measurement unit modules are arranged at intervals in an extending direction of a stripped flat cable, the stripped flat cable is electrically connected to back faces of the plurality of PCBs in sequence to form a measurement unit cluster, the measurement unit cluster is packaged and molded by an extrusion technology of silica gel to form the flexible sensing strip, and the flexible sensing strip can be wound into a sensing strip reel. The packaging structure has the beneficial effects that connection integrity between the measurement unit modules is enhanced, connection strength is improved, and reliability of a flexible clinometer is improved. The flexible sensing strip can be wound into the sensing strip reel so as to be convenient to carry and convey.