G01P15/123

CIRCUIT FOR SENSING AN ANALOG SIGNAL, CORRESPONDING ELECTRONIC SYSTEM AND METHOD
20220065893 · 2022-03-03 ·

A circuit configured to sense an input analog signal generated by a sensor at a first frequency and to generate an output digital signal indicative of the sensed input analog signal. The circuit includes a conditioning circuit, an ADC, a feedback circuit, and a low-pass filter. The conditioning circuit is configured to receive the input analog signal and to generate a conditioned analog signal. The ADC is configured to provide a converted digital signal based on the conditioned analog signal. The feedback circuit includes a band-pass filter configured to selectively detect a periodic signal at a second frequency higher than the first frequency and to act on the conditioning circuit to counter variations of the periodic signal at the second frequency. The low-pass filter is configured to filter out the periodic signal from the converted digital signal to generate the output digital signal.

NEUROMORPHIC MICRO-ELECTRO-MECHANICAL-SYSTEM DEVICE

A micro-electro-mechanical-system (MEMS) device comprises an inertial component configured for being connected to a structure by a flexible connection allowing the inertial component to deform or move relative to the structure in response to an external stimulus applied to the structure. One or more resonant components are connected to the structure or inertial component, the resonant component(s) having resonant mode(s). Transduction unit(s) measures an oscillatory motion of the resonant component relative to the inertial component and/or structure. An electronic control unit applies a pump of electrostatic force to induce an oscillatory motion of the resonant component(s) in the resonant mode, the oscillatory motion being a non-linear function of a strength of the electrostatic force. The resonant component is configured to be coupled to the inertial component and/or the structure such that a deformation and/or motion of the inertial component in response to an external stimulus changes the strength of the pump, the electronic control unit configured for producing and outputting an output signal being a mathematical function of the measured oscillatory motion. A system for producing a neuromorphic output for a MEMS device exposed to external stimuli is also provided.

ORGANIC SEMICONDUCTOR ELEMENT, STRAIN SENSOR, VIBRATION SENSOR, AND MANUFACTURING METHOD FOR ORGANIC SEMICONDUCTOR ELEMENT

An organic semiconductor element of the present invention includes: an organic semiconductor film formed from single crystal of an organic semiconductor, and a doped layer formed in a surface of the organic semiconductor film. A strain sensor of the present invention includes: the organic semiconductor element, a pair of electrodes which are electrically connected through the doped layer, and a substrate which is deformable, and which has the organic semiconductor element formed on one surface thereof. A vibration sensor of the present invention includes: the organic semiconductor element, a pair of electrodes which are electrically connected through the doped layer, and a substrate which has flexibility, and which is fixed at one end or both ends thereof, the substrate having the organic semiconductor element formed on the surface of the flexible portion of the substrate.

Sensor element, inertial sensor, and electronic apparatus

A sensor element according to the present technology includes a base portion, a movable portion, first and second bridge portions, and an acceleration detector unit. The movable portion is movable relative to the base portion by reception of an acceleration along at least a uniaxial direction. The first bridge portion includes a first beam and a first structure, the first beam connects the base portion and the movable portion, the first structure being provided between the first beam and the base portion and supporting the first beam. The second bridge portion includes a second beam and a second structure, the second beam extends in a second axis direction orthogonal to the first axis and parallel to the main surface and connects the base portion and the movable portion, the second structure being provided between the second beam and the base portion and supports the second beam.

Piezoresistive detection resonant device in particular with large vibration amplitude

Piezoresistive detection resonant device comprising a substrate, a mobile par configured to move with respect the substrate, suspension elements suspending the mobile part to the substrate, a piezoresistive detection device to detect the motions of the mobile part, said piezoresistive detection device comprising at least one strain gauge, wherein the piezoresistive detection resonant device also comprises a folded spring with at least two spring arms, connected to the mobile part and configured to be deformed by the motion of the mobile part, the at least one gauge being suspended between the substrate and the folded spring in such manner that the deformation of the gauge is reduced compared to the motion of the mobile part.

Piezoelectric thin-film sensor and use thereof
11131589 · 2021-09-28 · ·

A piezoelectric sensor comprises a support structure, a channel extending through the support structure, a sensing material stack coupled to the support structure and extending over the channel, and a filler material disposed within the channel and over the sensing material stack. The sensing material stack comprises an structural layer, a first electrode layer disposed on the structural layer, a piezoelectric material disposed in a piezoelectric layer on the first electrode, and a second electrode disposed on the piezoelectric layer opposite the first electrode layer.

INCREASING SENSITIVITY OF A SENSOR USING AN ENCODED SIGNAL

A physical disturbance sensor includes a plurality of piezoresistive elements configured in a resistive bridge configuration. A signal transmitter is electrically connected to the physical disturbance sensor and configured to send an encoded signal to the piezoresistive elements of the resistive bridge configuration. A signal receiver is electrically connected to the piezoresistive elements and configured to receive a signal from the physical disturbance sensor. The received signal from the physical disturbance sensor is correlated with the sent encoded signal in determining a measure of physical disturbance.

Acceleration sensor

The disclosure discloses an acceleration sensor, where the acceleration sensor comprises: a housing, and a mass block in the housing and connected with the housing via at least two hanging beams, where an auxiliary buffer component is further provided between the mass block and a bottom surface of the housing, and an elastic coefficient of the auxiliary buffer component decreases as force applied thereon increases.

Strain gauge sensor accelerometer with improved accuracy

An MEMS or NEMS accelerometer adapted to measure an acceleration along a sensing axis includes a substrate featuring a plane; a mass having a central zone and suspended relative to the substrate; a single lever arm comprising: a first end connected to the substrate by means of a first connection adapted to allow rotation of the lever arm about a rotation axis perpendicular to the sensing axis, and a second end connected to the mass by means of a second connection adapted to transmit movement in translation of the mass to the lever arm whilst allowing rotation of the lever arm about the rotation axis; the second end of the lever arm being disposed at the level of the central zone of the mass; at least one strain gauge comprising: a first end connected to the substrate, and a second end connected to the lever arm.

Sensor unit, electronic apparatus, and moving body

A sensor unit with high reliability and stable detection accuracy against vibrations of an installation target object is to be provided. A sensor unit includes: a sensor module configured including a substrate with inertial sensors mounted thereon, and an inner case in which the substrate is installed; and an outer case accommodating the sensor module. A recessed part is formed in the inner case. The inertial sensors are arranged in an area overlapping with the recessed part as viewed in a plan view seen from the direction of thickness of the substrate, and a filling member is provided to fill a space formed by the substrate and the recessed part. The sensor module is joined to a bottom wall of the outer case via a joining member.