Patent classifications
G01P15/123
Method of manufacturing physical quantity sensor device and physical quantity sensor device
An inner housing part has through-holes for connecting first lead pins (power supply terminal, output terminal, ground terminal) with the connector pins. The inner housing part has grooves that house second lead pins for adjusting output signals of a sensor chip. Three of the grooves each has a shape in which a distance between opposing sides of the groove is less than a diameter of the second lead pin that corresponds to the groove. The inner housing part is fixed to a case by a thermoset adhesive so as to house lead pins arranged in the case included in a sensor element. The second lead pins are fitted in the grooves, suppressing lifting of the inner housing part during curing of the adhesive.
COMPOSITE SENSOR AND MANUFACTURING METHOD THEREOF
The present disclosure provides a composite sensor and a manufacturing method thereof. The composite sensor includes: a first substrate and a second substrate configured to be laminated with the first substrate; a pressure sensor located on the first substrate and configured to sense a change in external pressure; and an acceleration sensor located on the second substrate and configured to sense a change in acceleration. A pressure film of the pressure sensor is configured to be spaced from the second substrate to form a pressure cavity, and a proof mass of the acceleration sensor is configured to be spaced from the first substrate to form a first anti-collision cavity. The present disclosure may reduce the chip area and reduce mutual interference.
Inertial sensor
A method of determining whether parametric performance of an inertial sensor has been degraded comprises: recording first data output from an inertial sensor; then recording second data output from the inertial sensor; comparing the first data output with the second data output; and determining whether the parametric performance of the inertial sensor has been degraded based on the comparison between the first and second data output.
CIRCUIT FOR SENSING AN ANALOG SIGNAL, CORRESPONDING ELECTRONIC SYSTEM AND METHOD
A circuit configured to sense an input analog signal generated by a sensor at a first frequency and to generate an output digital signal indicative of the sensed input analog signal. The circuit includes a conditioning circuit, an ADC, a feedback circuit, and a low-pass filter. The conditioning circuit is configured to receive the input analog signal and to generate a conditioned analog signal. The ADC is configured to provide a converted digital signal based on the conditioned analog signal. The feedback circuit includes a band-pass filter configured to selectively detect a periodic signal at a second frequency higher than the first frequency and to act on the conditioning circuit to counter variations of the periodic signal at the second frequency. The low-pass filter is configured to filter out the periodic signal from the converted digital signal to generate the output digital signal.
SENSOR UNIT, ELECTRONIC APPARATUS, AND MOVING BODY
A sensor unit with high reliability and stable detection accuracy against vibrations of an installation target object is to be provided.
A sensor unit includes: a sensor module configured including a substrate with inertial sensors mounted thereon, and an inner case in which the substrate is installed; and an outer case accommodating the sensor module. A recessed part is formed in the inner case. The inertial sensors are arranged in an area overlapping with the recessed part as viewed in a plan view seen from the direction of thickness of the substrate, and a filling member is provided to fill a space formed by the substrate and the recessed part. The sensor module is joined to a bottom wall of the outer case via a joining member.
Force sensor
A force sensor includes a sensor chip that detects displacements in multiple axial directions, and a strain body that transfers force applied thereto to the sensor chip. The strain body includes a sensor chip mount on which the sensor chip is mounted, multiple columns disposed around and apart from the sensor chip mount, and connecting beams via which the sensor chip mount is fixed to the columns.
POSTURE CONTROL APPARATUS, HOLDING APPARATUS, POSTURE CONTROL METHOD, AND PROGRAM
[Object] To provide a technology capable of accurately controlling posture of an object to be held.
[Solving Means] A posture control apparatus according to the present technology includes a control unit. The control unit determines, on the basis of a static acceleration component, a gravity direction in a holding apparatus holding an object to be held, the static acceleration component being computed on the basis of a first acceleration detection signal and a second acceleration detection signal, the first acceleration detection signal being acquired by detecting a dynamic acceleration component acting on the holding apparatus, the second acceleration detection signal being acquired by detecting the dynamic acceleration component and the static acceleration component acting on the holding apparatus, and controls, by controlling posture of the holding apparatus on the basis of the gravity direction, posture of the object to be held.
Sensor unit, electronic apparatus, and moving body
A sensor unit with high reliability and stable detection accuracy against vibrations of an installation target object is to be provided. A sensor unit includes: a sensor module configured including a substrate with inertial sensors mounted thereon, and an inner case in which the substrate is installed; and an outer case accommodating the sensor module. A recessed part is formed in the inner case. The inertial sensors are arranged in an area overlapping with the recessed part as viewed in a plan view seen from the direction of thickness of the substrate, and a filling member is provided to fill a space formed by the substrate and the recessed part. The sensor module is joined to a bottom wall of the outer case via a joining member.
STRAIN GAUGE SENSOR ACCELEROMETER WITH IMPROVED ACCURACY
An MEMS or NEMS accelerometer adapted to measure an acceleration along a sensing axis includes a substrate featuring a plane; a mass having a central zone and suspended relative to the substrate; a single lever arm comprising: a first end connected to the substrate by means of a first connection adapted to allow rotation of the lever arm about a rotation axis perpendicular to the sensing axis, and a second end connected to the mass by means of a second connection adapted to transmit movement in translation of the mass to the lever arm whilst allowing rotation of the lever arm about the rotation axis; the second end of the lever arm being disposed at the level of the central zone of the mass; at least one strain gauge comprising: a first end connected to the substrate, and a second end connected to the lever arm.
PORTABLE STRAIN GAUGE FOR IMPROVED IMPULSE AND PEAK FORCE DETECTION
Systems and methods for evaluating the performance of an athlete using a strain gauge is described. In some embodiments, the measurement system comprises a strain gauge and a central processing device. The strain gauge can include a power source, an inertial measurement unit (IMU) comprising a load cell, a microcontroller, and a wireless communication module. The strain gauge can be configured to output strain data at a rate of at least 1 kHz and the central processing device can be configured to receive the strain data transmitted from the wireless communication module.