A method for upgrading an automatic testing system includes electrically connecting at least one pogo pin attaching device to an expansion instrument and a pogo pin of a pogo pin interface of the automatic testing system wherein the pogo pin attaching device comprises at least one metal attaching member and at least one cable, each of said at least one cable having two opposite ends, a first end electrically connected to the metal attaching member and a second end electrically connected to the expansion instrument, and the metal attaching member attaches to the pogo pin. In response to operating the automatic testing system, electrically connecting the pogo pin to a subject so that a measurement path is established between the subject and the expansion instrument through the pogo pin attaching device, wherein the measurement path is configured to connect signals for upgrading the automatic testing system.

Provided is an electronic device inspection apparatus that suppresses cost increase. A prober is provided with a stage on which a carrier or a wafer is placed. The stage is provided with a stage cover on which the carrier is placed, a cooling unit in contact with the stage cover, and an LED irradiation unit facing the carrier across the stage cover and the cooling unit. Each of the stage cover and the cooling unit is formed of light-transmitting material. A light-transmitting coolant flows in a coolant flow path in the cooling unit. The LED irradiation unit has a plurality of LEDs oriented to the carrier. The carrier is formed of a glass substrate having a substantially disk-like shape. A plurality of electronic devices is arranged on a surface of the carrier at predetermined intervals.

A device includes a test pad on a chip. A first microbump has a first surface area that is less than a surface area of the test pad. A first conductive path couples the test pad to the first microbump. A second microbump has a second surface area that is less than the surface area of the test pad. A second conductive path couples the test pad to the second microbump.

A wire connector for a vehicle may include: a male connector having male terminals; a female connector having female terminals into which the male terminals of the male connector are inserted; and a circuit portion through which a current supplied by a continuity tester flows. The continuity tester can detect whether the male connector and the female connector are assembled without error.

The disclosed computer-implemented method may include providing test signals from a panel test board included in a fixture to a device under test included in a carrier including providing interface signals from the panel test board to a connector included on a fixture interposer block included in the fixture, interfacing the connector on the fixture interposer block with one or more pogo pins included on a panel interposer board included in the carrier, the interfacing providing the interface signals as inputs to a re-timer circuit included on the panel interposer board, generating, by the re-timer circuit, output interface signals whose signal strength is greater than a signal strength of the interface signals input to the re-timer circuit, and providing the interface signals output from the re-timer circuit to the device under test. Various other methods, systems, and computer-readable media are also disclosed.

Methods are provided that performs continuous semiconductor testing during long soak time testing using a chamberless single insertion model (SIM) handler and also using a chamberless asynchronous insertion model (AIM) handler having two manipulators. The methods include dividing a group of semiconductors having an ambient temperature into a first subgroup having a plurality of portions and a second subgroup having a plurality of portions, the second subgroup being identical to the first subgroup. The methods also include using thermal chucks to change the temperature of the first portion of the first subgroup and the first portion of a second subgroup prior to testing from ambient temperature to a stabilized designated temperature during a soak time. The methods also include testing all of the portions of the first subgroup and the second subgroup using predetermined protocols that include Soak Time, Test Time, Index Time, and sometimes Wait Time.

The invention relates to a probe card (PC) for use with an automatic test equipment (ATE), wherein the probe card (PC) comprises a probe head (PH) on a first side thereof, and wherein the probe card (PC) is adapted to be attached to an interface (IF) and wherein the probe card (PC) comprises a plurality of contact pads on a second side in a region opposing at least a region of the interface (IF), arranged to contact a plurality of contacts of the interface (IF), and wherein the probe card (PC) comprises one or more coaxial connectors (CCPT) arranged to mate with one or more corresponding coaxial connectors (CCPT) of the interface (IF). The invention relates further to pogo tower (PT) for connecting a wafer probe interface (WPI) of an automatic test equipment with the probe card (PC).

A conduction inspection jig includes a first member having first openings, a second member having second openings and formed to be positioned above the first member, a third member formed to be positioned between the first member and the second member such that the third member forms a space between the first member and the second member and at least substantially surrounds the space, and a probe formed to pass through one of the first openings and one of the second openings such that the probe extends through the space formed between the first member and the second member.

A test and measurement instrument includes an input for accepting an input signal from a Device Under Test (DUT), acquisition memory for storing a sampled waveform derived from the input signal, an output display, and one or more processors configured to accept a portion of the sampled waveform as a search portion, search the sampled waveform for portions similar to the search portion, and visually indicate, on the output display, portions of the sampled waveform that are similar to the search portion as matched portions. Methods of operation and description of storage media, the operation of which performs the above operations, are also described.

The present invention belongs to the technical field of electric automobiles and particularly relates to a fault tolerance decision-making method and system for sensor failure of a vehicular wheel hub driving system. The method comprises a current sensor failure diagnostic process, a position/velocity sensor failure diagnostic process and a selection process for a wheel hub motor fault tolerance control method. The system comprises a current sensor failure diagnostic module, a position/velocity sensor failure diagnostic module and a selection module for a wheel hub motor fault tolerance control method. The position/velocity sensor failure diagnostic module further comprises a fault tolerance control switching module. The present invention has the characteristics of establishing a control strategy decision-making mechanism oriented to random complicated current and position sensor failure conditions and designing a multivariable decision-making model according to a vehicular velocity range and a sensor fault condition to realize a fault tolerance control process compatible with a full velocity range.