An electronic power connector. The electronic power connector includes at least one contact configured to electrically connect a power supply to a load, an insulating sleeve, and an electronic assembly. The insulating sleeve includes a sensor slot configured to receive a sensor and is configured to receive the at least one contact. The electronic assembly including a transformer winding configured to receive the at least one contact and sense a current.

A measurement equipment configured to be connected to a measurement device and an HF coaxial connection element and a torque limiter. The torque limiter is configured for connecting the HF coaxial connection element with the measurement device with a predetermined torque. Furthermore, the invention provides an HF coaxial connection element configured to be connected to a corresponding HF coaxial connection element. The HF coaxial connection element comprises a torque limiter configured for detachably connecting the HF coaxial connection element with the corresponding HF coaxial connection element with a predetermined torque, a centering element for centering the HF coaxial connection element with respect to the corresponding HF coaxial connection element and a twist protection element for preventing twisting motion between the HF coaxial connection element and the corresponding HF coaxial connection element. A corresponding torque limiter is also provided.

The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. The sliding is largely longitudinal, with a small and desirable lateral component determined by the inclination of the interface.

A holder includes a substrate, at least one first fastener and a pressure block. The substrate includes a top surface, a primary recess recessed from the top surface, at least one first side-recess recessed from the top surface, wherein the first side-recess neighbors and communicates with the primary recess, and a channel recess recessed from the top surface, wherein the channel recess neighbors and communicates with the primary recess, and the first side-recess and the channel recess are positioned at opposite sides of the primary recess. The first fastener is disposed in the first side-recess, wherein the first fastener has a top substantially leveled with the top surface of the substrate. The pressure block is disposed in the channel recess, wherein the pressure block has a top substantially leveled with the top surface of the substrate.

The present disclosure relates to a measuring system including: an automation field device embodied for determining and/or monitoring a process variable of a medium; a connection unit, which includes a connection plug, which is electrically connected with the field device, and a cable, which is connected to the connection plug with a cable connection and which serves for supplying the field device with electrical energy and/or for transmitting information between the field device and a superordinated unit; and a protective cover, which surrounds the connection unit and the field device connected with the connection unit in a protection section, wherein by means of the protective cover the impact resistance of the measuring system in the protection section is increased.

A system for measuring an electrical response of a device under test (DUT) includes a reflectometer with reduced heat dissipation used with a vector network analyzer (VNA). The reflectometer is tethered to the VNA using a tether of scalable length which carries low frequencies. The reflectometer has a distributed harmonic generator including a non-linear transmission line (NLTL) for multiplying a frequency of an RF signal received from the VNA to generate a test signal having a frequency in the millimeter wave range at a test port connected to the DUT. A sampler in the reflectometer receives a local oscillator (LO) signal from the VNA and includes another NLTL for receiving the LO signal and generating pulses at a frequency in the millimeter wave range. When the test signal is transmitted to the DUT, the sampler outputs intermediate frequency signals which are transmitted to the VNA for characterization of the DUT.

A cover for an electrical rail mount device is provided. Further, an electrical rail mount device for mounting on a rail is provided, comprising at least one input terminal configured to receive an input line, fixing means configured to fix the input line to the input terminal to establish an electrical connection, a lockable cover reversibly movable from an open state into a closed state, whereas the cover is configured to cover the fixing means in the closed state, such that the fixing means can only be accessed by moving the cover from the closed state into the open state, an electrical element arranged in the cover and configured to provide an electrical function to an active electronic element of the electrical rail mount device, wherein an electrical connection is provided between the electrical element and the active electronic element.

An IC testing apparatus whereby a wedge body with inclined surfaces is attached to a bottom side of existing contact finger modules. The inclined support is then attached to the top of a load board of the testing apparatus. The inclined surfaces cause the normally horizontal finger modules to become inclined to the horizontal. In this manner, testing can be carried out in the usual way with existing contact finger modules, whilst the problems of IC device contact pad burr and oxidization are solved. Furthermore, because the outer, load board end of the contact fingers are also at an angle, these outer tips of the contact fingers naturally come into contact with the load board, without requiring any soldering.

A method for electrically connecting a test and measurement instrument to a via of a printed circuit board, PCB, the method comprising: dispensing a UV-curable conductive adhesive into a back-drilled hole formed in the PCB, the back-drilled hole extending to the via, such that the dispensed adhesive contacts the via; curing the dispensed adhesive by applying a UV light source to the dispensed adhesive; and connecting a test and measurement instrument to the cured adhesive using a conductive member.

In a method of testing a semiconductor wafer, a probe tip contacts a pad in a scribe line space between facing sides of first and second dies. The probe tip is electrically coupled to an automated test equipment (ATE). The second die is spaced apart from the first die. The scribe line space includes an interconnect extending along at least an entire length of the facing sides of the first and second dies. The pad is electrically coupled through the interconnect to at least one of the first or second dies. With the ATE, circuitry is tested in at least one of the first or second dies. The pad is electrically coupled through the interconnect to the circuitry.