Proposed are a test device and a manufacturing method of the test device capable of testing a test object that is provided with an electrode which has a size and/or a pitch distance ranging from 1 to 100 micrometers (?m).

An electrical assembly comprising an electrical connector assembly that may include: a utility device comprising a plurality of pins; a socket attached to a cord, the socket comprising a plurality of receptacles to receive the plurality of pins; and one or more metal-oxide varistors (MOVs) disposed inside the socket, where the one or more MOVs are electrically connected to the plurality of pins when the plurality of pins are received by the plurality of receptacles.

A jig for a sample for a solar photovoltaic device is disclosed. The jig includes a cradle unit supporting the sample and a contact unit including at least one probe pin coming into contact with a busbar of the sample located in the cradle unit. The contact unit includes a coupling plate coupled with the cradle unit and at least one contact bar including a PCB and connected to the coupling plate, the contact bar having at least one probe pin aligned with the busbar of the sample with interposition of a probe pin connecting block. the jig includes a rotation support unit coupled with the cradle unit by a rotation shaft to allow the cradle unit to be rotated at an angle of 180 or greater so that upper and lower surfaces of the sample supported by the cradle unit are reversed.

The present disclosure provides an electrical test fixture, comprising a base provided with an accommodating slot for accommodating therein a circuit board to be detected, and a printed circuit board for providing an electrical test signal, the accommodating slot being provided therein with a connector electrically connected to the printed circuit board; and an upper cover movably connected to the base in a first state in which the upper cover is opened in such a manner that the circuit board to be detected is capable of being placed in the accommodating slot and in a second state in which the upper cover is engaged with the base and is capable of abutting against the circuit board to be detected in the accommodating slot in such a manner that the circuit board to be detected comes into contact and is connected with the connector.

Interconnection meter socket adapters are provided. An interconnection meter socket adapter comprises a housing enclosing a set of electrical connections. The interconnection meter socket adapter may be configured to be coupled to a standard distribution panel and a standard electric meter, thereby establishing connections between a distribution panel and a user such that electrical power may be delivered to the user while an electrical meter measures the power consumption of the user. A power regulation module is disposed between the interconnection meter socket adapter, and configured to selectively connect one or more energy sources or energy sinks.

A connector device includes: a connection terminal including a first terminal connection portion electrically connected to a first counterpart terminal, a second terminal connection portion electrically connected to a second counterpart terminal, and a coupling portion having a flat plate shape, disposed between the first terminal connection portion and the second terminal connection portion electrically connected between the first terminal connection portion and the second terminal connection portion; a current sensor configured to measure current flowing in the coupling portion on the basis of magnetic flux according to the current; and a casing including a first housing portion housing the second terminal connection portion, and a second housing portion housing the coupling portion and the current sensor.

A test device and a method are provided in the invention. The test device includes a first connection interface, a storage device, a processor and a second connection interface. The first connection interface is coupled to a device under test (DUT) and obtains power information from the DUT according to a first instruction.

The storage device stores the power information. The processor is coupled to the first connection interface and storage device, when the first connection interface is coupled to the DUT, sends the first instruction to the first connection interface, receives the power information from the first connection interface, and stores the power information in the storage device. The second connection interface is coupled to an external controlling system, sends the power information to the external controlling system and receives a test instruction from the external controlling system to test the DUT.

A probe structure for inspecting characteristics of a connector having at least one terminal includes a plunger, a coaxial probe, a flange, a housing, and a spring. A first end portion of the housing and the flange are configured to restrict rotation of the housing in the circumferential direction in a state in which the first end portion of the housing is fitted into the through-hole of the flange. Thus, inspection of characteristics of the terminal of the connector can be performed with higher accuracy.

A test coaxial connector has a probe portion with a small height, and prevents breakage of a switch-equipped coaxial connector even when the test coaxial connector is not properly fitted to the switch-equipped coaxial connector. The test coaxial connector includes a housing and a probe housed in the housing. The probe is formed of one continuous structure having elasticity, the structure including a contact at or near an end portion of the structure and including, at or near another end portion of the structure, a connection portion to which a central conductor of a coaxial cable is to be connected.

A test matrix adapter device having a plurality of segments arranged in a plane, the respective segments have line-shaped and column-shaped frame sections, and the segments are connected to one another in a form-fitting manner by the frame sections. Semiconductor receiving devices are arranged within the segments, that each have a plurality of first contact surfaces that are spaced apart from one another. The semiconductor receiving device are form-fittingly connected by webs to the frame sections of an assigned segment. The semiconductor receiving device has a bottom side and a base region at least partially enclosed by a frame, and an outer side. The column-shaped frame sections have projections that have second contact surfaces that are connected by conductor tracks to the first contact surfaces. The semiconductor receiving device adapted to receive a packaged semiconductor component with terminal contacts and to connect the terminal contacts to the first contact surfaces.