An apparatus for exchanging a probe includes a stacker configured to receive a probe and to align the probe, a probe connector connected to the probe, and a laser alignment unit including a light emitter and a light receiver. The light emitter is configured to emit a laser beam to the probe, and the light receiver is configured to detect the laser beam reflected by the probe. The laser alignment unit is configured to detect when the probe is properly aligned on the probe connector using the light receiver, and the laser alignment unit is configured to stop moving the stacker when it is detected that the probe is properly aligned.

An active probe adapter adapts an active probe to a PXI instrumentation module. The active probe adapter includes a first module interface (MI) connector on a first side of the active probe adapter. The first MI connector is configured to connect to a corresponding interface connector of the PXI instrumentation module. The active probe adapter further includes a plurality of probe pads on a second side of the active probe adapter opposite to the first side. The plurality of probe pads is configured to interface with an active probe employed with the PXI instrumentation module. The active probe adapter may include a second MI connector on the active probe first side configured to connect to a PXI power module and provide power to the active probe.

An example test system includes a test carrier to hold devices for test; a device shuttle to transport the devices; and a robot to move the devices between the test carrier and the device shuttle. The device shuttle is configured to move, towards a stage of the test system containing the robot, a first device among the devices that has not been tested. The device shuttle is configured to move in a first dimension. The robot is configured to move the first device from the device shuttle to the test carrier. The robot is configured to move in a second dimension that is different from the first dimension.

A test paddle is provided that includes a body portion having a first end and a second end. The test paddle includes a plurality of adapters provided about the second end and a plurality of contacts provided about the first end, each of the plurality of adapters electrically coupled to one of the plurality of contacts. The test paddle includes a removable insulation plate selectively attached to the body portion. A method for testing relays is also provided.

A meter socket is provided for watt-hour meters. The meter socket comprises a block assembly mounted at a center of the meter socket, a bypass mechanism situated in the bottom portion of the block assembly and a plurality of clamp jaws. The block assembly includes a top portion and a bottom portion. The bypass mechanism includes a plurality of rotary bypass blades coupled to a lever arm. Each clamp jaw includes a clamp jaw assembly that includes a jigsaw mechanism situated in the top portion of the block assembly. The jigsaw mechanism includes a copper jaw bus, a contact plate, a jaw spring, a bypass spring, a compression spring, a shoulder screw, a rivet or one or more fasteners. Each clamp jaw further includes a clamp jaw bypass mechanism that includes a jaw opening formed between the copper jaw bus and the jaw spring to receive a rotary bypass blade of the plurality of rotary bypass blades of the bypass mechanism.

The disclosure describes a novel method and apparatus for improving silicon interposers to include test circuitry for testing stacked die mounted on the interposer. The improvement allows for the stacked die to be selectively tested by an external tester or by the test circuitry included in the interposer.

A testing device is disclosed. The testing device includes: a testing platform; an electromagnetic relay platform arranged opposite to the testing platform; and a plurality of probe assemblies disposed between the electromagnetic relay platform and the testing platform. Each of the probe assemblies includes an electromagnetic base and a probe mounted in a side of the electromagnetic base away from the electromagnetic relay platform. Each of the electromagnetic bases is attracted together with the electromagnetic relay platform under an electromagnetic attraction force when the electromagnetic relay platform is energized. The above testing device may be used for testing a variety of circuit boards, and has a relatively wide application.

The methods and apparatus described herein are designed and configured to allow one user to test cable continuity using a wire-configurable directional connector. The methods and apparatus may transmit a first and second voltage pulse through a first and second wire of a cable under test, respectively, having a wire-configurable directional connector attached. Both voltage pulses travel through the wire-configurable directional connector. The first voltage pulse selectively leaves at least one of the second wire and a third wire of the cable under test and the second voltage pulse selectively leaves the third wire. The methods and apparatus may store a pre-determined pattern of a returning voltage pulse specific to the cable under test, and determine a state of the first, second, and third wires in response to receiving the first and second voltage pulses.

A system for simplifying integration of a light emitting diode (LED) into multiple applications includes, an identification module to uniquely identify the light emitting diode (LED) during testing, a storage module for storing testing data of the light emitting diode (LED), a transfer module for transferring testing data of the light emitting diode (LED) down a supply chain to customer end for further processing to achieve a required final color mix, and, a light source molded around a frame, the light emitting diode (LED) being attached and electrically connected to the light source. In use, the testing data includes data relating to at least one characteristic of the light emitting diode (LED). In further use, the LED is a red, green and blue (RGB) LED.

A modular RF measuring device has a motherboard arranged centrally within the device so as to define a front side and a rear side, the front side and the rear side each comprising module interfaces.