A contact includes a first terminal including a plurality of arms; a second terminal; a spring connecting the arms to the second terminal; and a casing covering the spring, wherein the arms outwardly protrude from one end of the casing, wherein an interval between the arms increases from a side of the casing to front edges of the arms, wherein when the arms are pushed toward the casing the arms are retracted into the casing and contact an inner side of the casing so that the interval between the arms decreases.

An apparatus includes a wiring base plate arranged on an upper side of a chuck top and having a wiring path connected to a tester, a probe card having a probe board spaced from the wiring base plate with a first surface thereof opposed to the wiring base plate and having a wiring path corresponding to the wiring path and probes provided on a second surface of the probe board to be connected to the wiring path and enabling to respectively contact connection pads of a semiconductor wafer on the chuck top, and an electric connector connecting the wiring base plate to the probe board by low heat conduction supporting members and decreasing heat conduction therebetween and electrically connecting the wiring paths.

A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction.

A test fixture assembly is for performing a test of a DUT (Device under Test), the DUT includes a plurality of pins exposed on a surface of the DUT, and the test fixture assembly includes a circuit board and a socket unit. The circuit board includes a plurality of test pads, which are exposed on a surface of the circuit board. The socket unit includes a socket base and a plurality of socket probes, which are inserted through the socket base. A first end and a second end of each of the socket probes are respectively exposed on two opposite surfaces of the socket base. Each of the test pads, a corresponding one of the socket probes and a corresponding one of the pins are configured to be linearly arranged along a socket probe direction.

Aspects of the present disclosure include digital wire harness assembly stations, and automated testing techniques. Examples include systems and methods for assembling and testing wire harnesses. A wire harness assembly system may include a display, a screen, a cable connector mount, an electrical testing unit, and at least one computing device to execute a test program associated with a digital wire harness diagram. At least one wire harness assembly station may move along a first track, and a test adapter associated with the electrical testing unit may be movable along a second track. The at least one computing device may execute a test program at the wire harness assembly station while the wire harness assembly and the test adapter move, respectively, along the first and second tracks.

The present invention relates to the inspection process which includes providing access to the microdevice contacts, measuring the microdevice and analyzing the data to identify defects or performance of the micro device. The invention also relates to the forming of test electrodes on microdevices. The test electrodes may be connected to hidden contacts. The type of microdevices may be vertical, lateral or a flip chip.

A terminal block test adapter releasably attached to a terminal block for releasably connecting electrical wires thereto without breaking or shorting current flowing through the terminal block. The terminal block test adapter includes a plurality of spring biased connector posts within post housings adapted to be linearly aligned with connector posts within post housings of the terminal block. When in use, a proximal end of each connector post of the terminal block test adapter is adapted to be used for releasably connecting a test wire thereto for electrical testing purposes without breaking or shorting current flowing through the terminal block.

To provide a conductive connector that is easy to manufacture and has a low disconnection risk. This conductive connector comprising a non-conductive elastic body and a reticulated fiber body comprising a covered region with a surface covered by metal is manufactured through the covering of the periphery of the non-conductive elastic body with the reticulated fiber body such that the reticulated fiber body is in a C-shape. The reticulated fiber body has, for example, alternatingly arranged uncovered regions not covered with metal and covered regions.

Implementations herein include socket systems and methods of using socket systems. Socket systems herein may comprise a housing configured to hold a printed circuit board, a clamp hingedly attached to the housing, and a soft partially-conductive substrate. A chip may be placed upon the soft partially-conductive substrate. By closing the clamp toward the housing, a uniform, gentle compressive force may be applied to the chip to effect contact between the chip's pins and the printed circuit board by selective compressing the soft partially-conductive substrate.

The object of the present invention is to provide an anisotropically conductive connector that can be arranged at narrow pitches to match the compactness of electric and electronic components, has excellent connection stability to an electrode, does not easily damage the electrode to be connected, can reduce the accumulation of oxidized foreign matter and suppress an increase in resistance value, and is easy to replace even if conduction failure occurs during use, an anisotropically conductive connector having a frame, and an inspection apparatus. An anisotropically conductive connector including an insulation portion which is strip-shaped and made of an elastic material having insulating properties, and a plurality of silver wires which penetrate the insulation portion from a first surface to a second surface in a thickness direction and are arranged at a constant pitch in a length direction of the insulation portion, wherein each of the plurality of silver wires is provided perpendicularly or obliquely to the thickness direction of the insulation portion.