The present invention relates to a manufacturing method of a semiconductor test device. A semiconductor test device according to an embodiment of the present invention, which is a semiconductor test device for testing an electrical connection of a semiconductor, may include: a first membrane portion comprising a first surface and a second surface opposite to the first surface and including a plurality of first aperture patterns extending from the first surface toward a direction of the second surface; and a second membrane portion comprising a third surface, connected to the first surface of the first membrane portion, and a fourth surface opposite to the third surface and including a plurality of second aperture patterns extending from the fourth surface toward a direction of the third surface.

Provided is a rubber socket having a structure with a built-in component. In the rubber socket with a built-in component, a connection sheet having components attached to an upper surface, a lower surface, or upper and lower surfaces of a conductive sheet composed of a conductive part and an insulating part is detachably coupled to the upper surface, the lower surface, or the upper and lower surfaces, and a guide sheet made of an inelastic insulating material is attached to an upper side, a lower side, or upper and lower sides of the connection sheet, and characteristics of a tester or a device to be tested may be tested using the components.

Some embodiments relate to a method of an integrated circuit structure having a conductive structure for circuit probe testing. The method includes providing an integrated circuit structure including a substrate, a dielectric structure disposed over the substrate, and a plurality of electrodes disposed over an upper surface of the dielectric structure. The method also includes forming a first dielectric layer over the dielectric structure and the plurality of electrodes, etching the first dielectric layer over each of the plurality of electrodes, forming a conductive layer over the first dielectric layer and the plurality of electrodes, and removing at least a portion of the conductive layer to form a plurality of conductive structures over the plurality of electrodes. Each of the plurality of conductive structures contacts a corresponding subset of the plurality of electrodes.

An electrical testing device includes a housing having a base and a cover. The base and the cover define a cavity. The electrical testing device includes an input connector and a plurality of output connectors in electrical communication with the input connector. A fuse is in electrical communication with the input connector and the plurality of output connectors. The input connector and each output connector of the plurality of output connectors is adapted to connect to an interchangeable test lead. The input connector and each output connector of the plurality of output connectors is in electrical communication with an activation mechanism.

A semiconductor test apparatus is disclosed. The semiconductor test apparatus according to an aspect of the present disclosure may include a housing; a substrate disposed on a lower side of the housing; a plurality of contact pins mounted on the substrate; a soldering part configured to fix the plurality of contact pins to the substrate; and a cover part configured to surround the soldering part.

A contacting device is provided for an impedance limit switch, the contacting device including: a printed circuit board having an electrically conductive contact surface; a radially disposed annular spring configured to establish electrical contact between the electrically conductive contact surface of the printed circuit board and at least one electrode of the impedance limit switch; and a non-conductive housing element. An impedance limit switch is also provided, including the contacting device; an electronic cup; and a measuring head configured to carry out a conductive and/or capacitive measurement and to record measurement data, the contacting device being configured to transmit the measurement data from the measuring head to the electronic cup via the contacting unit.

A calibrated test and measurement cable for connecting one or more devices under test and a test and measurement instrument, including a first port structured to electrically connect to a first signal lane, a second port structured to electrically connect to a second signal lane, a third port structured to electrically connect to a test and measurement instrument, and a multiplexer configured to switch between electrically connecting the first port to the third port and connected the second port to the third port. The first and second signal lanes can be included on the same device under test or different devices under test. An input can receive instructions to operate the multiplexer.

A intermittent load generator for tracking an electrical wire, the wire tracker including: a housing; an electrical cable extending outward from the housing to an ambient environment; a plug which is in electrical communication with the electrical cable; an indicator light which is retained on the housing and is in electrical communication with the electrical cable; one or more resistors which are housed in the housing and are in electrical communication with the electrical cable; and a switch which is in electrical communication with the one or more resistors, is housed in the housing and is configured to switch the one or more resistors on and off in oscillations with a period of 0.05 seconds to 120 seconds.

A power connector is provided that is configured to conduct a current. The power connector includes a base structure, an extension structure, and a connector head structure that define a current path for the current. The extension structure is coupled to and extends between the base structure and the connector head structure. The connector head structure includes a bore-hole that vertically extends into the connector head structure toward the base structure. The bore-hole is configured to receive a fastener for coupling the power connector to an electrical interface of a device. The connector head structure has a mechanical engagement feature configured to mechanically engage with a torque stabilization tool during a fastening of the fastener to the connector head structure in order to prevent a torque applied by the fastening of the fastener from being transferred to the extension structure.

A connection jig comprises: a first output terminal and a second output terminal for connecting to signal lines of the measuring instrument; a jig body having the shape of a plate-shaped block, into which the small connector can be inserted, and having an insertion hole penetrating from the upper surface to the lower surface of the plate-shaped block; a printed circuit board for a jig that can be inserted into the lower surface of the plate-shaped block and has a signal pattern that can be electrically connected to the small connector accommodated in the insertion hole; a lower cover detachably attached to the lower surface of the jig body and fixing the printed circuit board for the jig to the jig body; and an upper cover attachable to and detachable from the upper surface of the jig body and fixing the small connector to the jig body.