G01R1/06711

MEASURING ROD FOR ELECTRIC METER AND ELECTRIC METER ASSEMBLY USING THE SAME
20200158765 · 2020-05-21 ·

A measuring rod for an electric meter and an electric meter assembly using the same are disclosed, wherein the device to be detected disposed around the front end of at least one of the test probes allows the electric meter to determine the type of currently inserted test probes and whether the test probes are suitable for use under a current operation mode of the electric meter in a situation when the device to be detected is inserted into the electric meter; and the measuring socket corresponding to the device to be detected is disposed with a determination mechanism for allowing the electric meter to determine whether the abovementioned test probes or test probes of different types are suitable for use under a current operation mode of the electric meter.

Probe assembly and capacitive space transformer thereof

The instant disclosure provides a probe assembly and a capacitive space transformer thereof. The probe assembly includes a space transformer and a plurality of probe structures. The space transformer includes a transfer board and a plurality of dielectric structures. The transfer board includes a plurality of conductive portions. Each of the dielectric structures is disposed on one side of the corresponding conductive portion and contacts the corresponding conductive portion. Each of the dielectric structures is disposed between the corresponding conductive portion and the corresponding probe structure. The probe structure includes a first end portion, a second portion, and a connecting portion connected between the first and second end portions.

SLIP-PLANE MEMS PROBE FOR HIGH-DENSITY AND FINE PITCH INTERCONNECTS
20200103440 · 2020-04-02 ·

A device probe includes a primary probe arm and a subsequent probe arm with a slip plane spacing between the primary probe arm and subsequent probe arm. Each probe arm is integrally part of a probe base that is attachable to a probe card. During probe use on a semiconductive device or a semiconductor device package substrate, overtravel of the probe tip allows the primary and subsequent probe arms to deflect, while sufficient resistance to deflection creates a useful contact with an electrical structure such as an electrical bump or a bond pad.

Testing head comprising vertical probes with internal openings
10578646 · 2020-03-03 · ·

A testing head for functionality testing a device under test comprises a plurality of contact probes, each contact probe having a rod-like body having a preset length less than 5000 m extending between a first and a second end, the second end being a contact tip and an opening extending all over its length and defining a plurality of arms, parallel to each other, separated by the opening and connected to the end portions of the contact probe, and an auxiliary guide, arranged transverse to the body and provided with suitable guide holes, the contact probes sliding through each of them, the auxiliary guide defining a gap including one end of the opening being a critical portion of the body and a zone more prone to breakings in the body undergoing low or even no bending stresses in the gap with respect to the rest of the body.

Probe for a contact inspection device
10571488 · 2020-02-25 · ·

A probe includes: a probe base body having a first end as a portion that contacts a test object in an inspection and a second end that contacts a contact point member; a covering member that covers the probe base body between the first end and the second end; and an enlarged diameter portion 6 provided at an exposed portion on the second end side of the probe base body. The probe is attached in a bent-deformed state by pressing a terminal portion on the first end side of the covering member against a base portion of the contact inspection device. The second end of the probe base body is pressed against a contact point of the contact point member by opposing force due to the pressing.

INSPECTION DEVICE AND INSPECTION METHOD
20200025819 · 2020-01-23 · ·

An inspection device is provided, which is capable of detecting a short circuit failure even when a connector is provided on a wiring board. The inspection device is configured to inspect a short circuit failure generated at any connected part of a plurality of pins 153 to a wiring board via solder. The plurality of pins 153 is included in a connector provided on the wiring board. The inspection device includes: a wiring 11 connected to certain pins 153 of the plurality of pins 153; a second wiring 12 connected to remaining pins 153 of the plurality of pins 153; and a tester unit connected to the first wiring 11 and to the second wiring 12 so as to inspect insulation between the certain pins 153 and the remaining pins 153.

Particle measurement device, three-dimensional shape measurement device, prober device, particle measurement system, and particle measurement method

The particle measurement device includes: an acquiring unit configured to acquire pad surface shape data indicating a surface shape of an electrode pad including a probe needle mark where a probe needle has contacted; a roughness calculating unit configured to calculate volume of a recessed portion recessed from a pad reference surface and volume of a protruding portion protruding from the pad reference surface based on the pad surface shape data; and a particle quantity calculating unit configured to calculate a particle quantity from a volume difference between the volume of the recessed portion and the volume of the protruding portion.

Cantilever probe card device and focusing probe thereof

A cantilever probe card device and a focusing probe thereof are provided. The focusing probe includes a soldering segment, a testing segment, two outer elastic arms spaced apart from each other, and a focusing portion. The testing segment is spaced apart from the soldering segment along an arrangement direction, and has a needle tip, an outer edge, and an inner edge that is opposite to the outer edge. Each of the two outer elastic arms has two end portions respectively connected to the soldering segment and the inner edge of the testing segment. The focusing portion is connected to the inner edge and is located between the needle tip and the two outer elastic arms, and has a plurality of focusing points arranged on one side thereof away from the two outer elastic arms.

LOW FORCE WAFER TEST PROBE

A probe includes a pedestal and at least one feature extending from the pedestal to engage a surface of a corresponding contact at a position offset from a central longitudinal axis of the contact.

PROBE, INSPECTION JIG, INSPECTION DEVICE, AND METHOD OF MANUFACTURING PROBE

Provided are a probe that enables control of a bending direction and can be simply manufactured, an inspection jig using the probe, an inspection device, and a method of manufacturing the probe. A probe has a substantially bar-like shape extending linearly and includes: a tip end portion, a body portion continuous with the tip end portion Pa; and a base end portion continuous with the body portion. The body portion includes a first connection region having a thickness in a thickness direction perpendicular to an axial direction of the bar-like shape that gradually decreases away from the tip end portion, and a second connection region having a thickness that gradually decreases away from the base end portion. A dimension of the body portion in a width direction perpendicular to the thickness direction is larger than dimensions of the tip end portion and the base end portion.