A test circuit and a method for testing an integrated circuit are provided. The integrated circuit includes a test circuit. The test circuit includes a conductive track extending over at least a portion of the periphery of the integrated circuit, at least one component and an activation circuit adapted to deviating an input data signal into the conductive track during a test mode, and to transmitting the input data signal to the at least one component during a normal operating mode.

A wafer inspection method and inspection apparatus are provided. On a wafer having layout lines connecting electrode points of individual dies in series, the dies within a matrix range are inspected one after another in turn in a column/row control means by a first switch group and a second switch group of a probe card, so that each die is selectively configured in a test loop of a test process by turning on/off of a corresponding switch. Thus, after inspection of a die under inspection (a selected die) within the matrix range is complete, the column/row control means is used to switch to a next die to achieve fast switching. Accordingly, for the inspection procedure of each die within the matrix region, a conventional procedure of moving one after another in turn can be eliminated, significantly reducing the total test time needed and enhancing inspection efficiency.

A high speed signal transmitting and receiving detection device is provided. The high speed signal transmitting and receiving detection device includes a substrate unit and a plurality of probe units. The plurality of probe units pass through the substrate unit. The substrate unit includes a conducting space, a plurality of fillers and a plurality of barriers. Each of the fillers is arranged in the conducting space and between two of the probe units that are adjacent to each other. Each of the barriers is arranged in the conducting space and between the two of the probe units that are adjacent to each other. A capacitance effect between the two of the probe units that are adjacent to each other is formed through the filler and the barrier that correspond to the two of the probe units that are adjacent to each other.

An electrical measurement contacting system for use with a component testing system operable to convey devices includes: a first module including a test contact module having a test contact adapted to electrically contact devices conveyed by the component testing system, and a second module including circuitry electrically coupled to the test contact module and operative to perform an electrical measurement on devices conveyed to the test contact. The circuitry is connected, within the second module, to a first conductive path and a second conductive path. The first conductive path and the second conductive path extend into the first module. The first conductive path and the second conductive path are electrically connected to each other and to the test contact module in the first module.

A high speed signal transmitting and receiving detection device is provided. The high speed signal transmitting and receiving detection device includes a substrate unit and a plurality of probe units. The plurality of probe units pass through the substrate unit. The substrate unit includes a conducting space, a plurality of fillers and a plurality of barriers. Each of the fillers is arranged in the conducting space and between two of the probe units that are adjacent to each other. Each of the barriers is arranged in the conducting space and between the two of the probe units that are adjacent to each other. A capacitance effect between the two of the probe units that are adjacent to each other is formed through the filler and the barrier that correspond to the two of the probe units that are adjacent to each other.

Systems, methods, and a computer readable medium are provided herein for providing an indication of a connection terminal on a measurement device for use in performing a test of a target device. The system can include a target device and a measurement device. The measurement device can couple to the target device via a plurality of connection terminals to perform a test of the target device. The measurement device can receive an input identifying a test to be performed on the target device by the measurement device. The measurement device can determine, based on the received input, an indication identifying at least one connection terminal of the plurality of connection terminals to connect to the target device to perform the test. The measurement device can provide the indication of the at least one connection terminal via an indication mechanism associated with the at least one connection terminal.

Methods and systems for collecting operational data from a target digital system are disclosed. In some embodiments, a method includes determining a test configuration to be used to configure a probe circuit. Determining the test configuration may include selecting one or more signal sources, defining one or more signal patterns within the selected signal sources, and defining one or more trigger events associated with the one or more signal patterns. Based on the test configuration, the probe circuit selects input/output (I/O) channels for a test cycle and captures one or more traces from the selected I/O channels during the test cycle.

A measurement input circuit for a measurement device for measuring an electric signal in a device under test comprises a signal input that receives the electronic signal from the device under test and provides the received electronic signal at a signal node, a direct signal coupling path that is coupled between the signal node an electrical ground and comprises a first impedance value, an alternating signal coupling path that is coupled between the signal node and the electrical ground, and comprises a second impedance value that is lower than the first impedance value, and a signal output that is coupled to the signal node and outputs the received electronic signal.

An adapter for a current probe is described, said adapter being configured to be connected with said current probe. Said adapter enables a voltage measurement by using said adapter and said current probe. Said adapter comprises a current loop and at least one transconductance unit. Said transconductance unit transforms the voltage to be measured into a current wherein the current obtained is forwarded by said current loop. Further, a testing system is described.

A test circuit and a method for testing an integrated circuit are provided. The integrated circuit includes a test circuit. The test circuit includes a conductive track extending over at least a portion of the periphery of the integrated circuit, at least one component and an activation circuit adapted to deviating an input data signal into the conductive track during a test mode, and to transmitting the input data signal to the at least one component during a normal operating mode.