Systems, methods, and a computer readable medium are provided herein for providing an indication of a connection terminal on a measurement device for use in performing a test of a target device. The system can include a target device and a measurement device. The measurement device can couple to the target device via a plurality of connection terminals to perform a test of the target device. The measurement device can receive an input identifying a test to be performed on the target device by the measurement device. The measurement device can determine, based on the received input, an indication identifying at least one connection terminal of the plurality of connection terminals to connect to the target device to perform the test. The measurement device can provide the indication of the at least one connection terminal via an indication mechanism associated with the at least one connection terminal.

A structure and method for providing a housing which includes a high frequency (HF or RF) connection between a device under test (DUT) having a waveguide 22. The waveguide includes a wave insert 22, and a conductive compliant member 40 which maintains bias between the adapter/insert 22 and the DUT HF port 20 while also maintaining an RF shield despite the variable height of the DUT waveport. A passage 50 provides an RF connection between the RF port 62 on the DUT and a RF wave guide horn 54. A plurality of transmitting horns 54 can be arranged to transmit to a single receiving horn 154 so that fewer receivers are required to test multiple DUTs in sequence.

A high-frequency measurement line structure includes a circuit board structure and a multi-conductor transmission line section, a high-frequency measurement probe pad section and a transition section which are formed by the circuit board structure, wherein the transition section is arranged between the multi-conductor transmission line section and the high-frequency measurement probe pad section to be connected to the multi-conductor transmission line section and the high-frequency measurement probe pad section. The high-frequency measurement probe pad section includes a group of high-frequency measurement probe pads arranged on a first metal layer of the circuit board structure to touch a high-frequency probe to transmit a high-frequency signal. A second metal layer of the circuit board structure defines a slot arranged in accordance with the high-frequency measurement probe pad section and the transition section to help a mode conversion between the high-frequency probe and the multi-conductor transmission line section.

A method for assembling an ultrahigh-frequency spring probe test assembly includes: drilling signal cavities, power supply cavities, and grounding cavities, assembling an upper mold core and a lower mold core and performing curing, mounting an upper shaft sleeve and a lower shaft sleeve, inserting a signal probe, a power supply probe and a grounding probe, and mounting an upper base to complete assembling the probe test assembly. The signal probe becomes coaxial with the signal cavity by mounting the insulating ring, achieving small signal loss; the insulating mold core is inserted into the power supply cavity after drilling and is bonded to the power supply cavity via adhesive to form a dual-layer insulating structure between the power supply probe and the base, having high insulation performance and low power loss; the grounding probe is in direct contact with the metal base, achieving high conductivity.

An electrical connecting device includes an insulating probe (10) including a bottom-side plunger (11), a top-side plunger (12), and a barrel (13), and a probe head (30) including a combined guide plate (30A) having a conductive region (301) made of a conductive material and an insulating region (302) made of an insulating material arranged adjacent to each other in a planar view. The bottom-side plunger (11) and the top-side plunger (12) are electrically connected to each other inside the barrel (13), and the bottom-side plunger (11) and the top-side plunger (12) are electrically insulated from the barrel (13). The probe head (30) holds the insulating probe (10) in a state in which the barrel (13) penetrates through the conductive region (301). The barrel (13) of the insulating probe (10) is connected to a ground potential via the conductive region (301) when an inspection object (4) is measured.

A cantilever-type probe with multiple metallic coatings is disclosed. The cantilever-type probe includes at least one probe pin. A first metallic coating is disposed upon a tip of the probe pin, and a second metallic coating is disposed upon a root of the probe pin. The second metallic coating is in contact with the first metallic coating and comprises a softer (more flexible) metal than the first metallic coating.

Probes for testing electrical circuits having decoupled electrical and mechanical design are provided. For example, a mechanically resilient core can be surrounded by an electrically conductive shell. In this way, electrical parameters of the probes are determined by the shells and mechanical parameters of the probes are determined by the cores. An important application of this approach is to provide impedance matched transmission line probes.

A probe head includes a probe seat, a first spring probe penetrating through upper, middle and lower dies of the probe seat for transmitting a first test signal, and at least two shorter second spring probes penetrating through the lower die for transmitting a second test signal with higher frequency. Two second spring probes are electrically connected in a way that top ends thereof are abutted against two electrically conductive contacts on a bottom surface of the middle die electrically connected by a connecting circuit therein. The lower die has a communicating space and at least two lower installation holes communicating therewith and each accommodating a second spring probe partially located in the communicating space. The probe head is adapted for concurrent high and medium or low frequency signal tests, meets fine pitch and high frequency testing requirements and prevents probe cards from too complicated circuit design.

Provided is a probe device used for electrical inspection of a printed wiring board, the probe device including at least one probe group including a plurality of wire probes configured to be able to simultaneously abut against a wire provided on the printed wiring board and extending in a specified direction, the plurality of wire probes abutting against the wire along the direction and being electrically connected to each other.

A system and method for operating a data processing system to modify a time domain input signal to a signal generator to correct for distortions introduced by the signal generator are disclosed. The method includes receiving a target signal specifying a signal to be generated by the signal generator and initializing an input signal with the target signal, the method includes a) inputting the input signal to the signal generator to arrive at a signal generator output signal; b) measuring a frequency spectrum of the signal generator output signal with a test instrument; c) updating the input signal based on a comparison of said measured frequency spectrum and a frequency spectrum of target input signal; and d) repeating steps a)-c) until an exit condition is satisfied.