A probe card for a test equipment of electronic devices includes a flexible membrane configured to carry high frequency signals between a device under test and a support plate. The flexible membrane is connected to the support plate through a peripheral zone, and a damping structure is arranged between the support plate and the flexible membrane. A plurality of micro contact probes include a body extending between a first end and a second end, and the second end is configured to abut onto contact pads of the device under test, and the damping structure and the first ends of the micro contact probes are in contact with opposite faces of a same contact zone of the flexible membrane. The flexible membrane includes at least one weakening zone arranged between the contact zone and the peripheral zone.

The test system provides an array of test probes. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. A plurality of flex circuits at the different heights engage bottom probe ends at their respective height levels and flex circuits continue the electrical connection from the probes to a load board. The test probes are bonded to the flex circuits by ring shaped flowable conductive material. The flex circuits are biased against a load board by an elastomeric pad of spaced part conical projections.

A connector pin device includes a test socket body made of a flexible insulating material and including a pin mounting part in which mounting holes have been formed and a support part supporting the pin mounting part, sliding contact pins respectively formed in the mounting holes and each including a first contact pin having a first end externally exposed and a second end located within the mounting hole and a second contact pin having a first end externally located on the side opposite the first end of the first contact pin and a second end located within the mounting hole, wherein the first and second ends of the first and the second contact pins are provided to slide and come into contact with each other, and an cavity portion formed in a portion where the second ends of the sliding contact pins in the mounting hole are located.

A probe head includes a probe seat, a first spring probe penetrating through upper, middle and lower dies of the probe seat for transmitting a first test signal, and at least two shorter second spring probes penetrating through the lower die for transmitting a second test signal with higher frequency. Two second spring probes are electrically connected in a way that top ends thereof are abutted against two electrically conductive contacts on a bottom surface of the middle die electrically connected by a connecting circuit therein. The lower die has a communicating space and at least two lower installation holes communicating therewith and each accommodating a second spring probe partially located in the communicating space. The probe head is adapted for concurrent high and medium or low frequency signal tests, meets fine pitch and high frequency testing requirements and prevents probe cards from too complicated circuit design.

A deskew fixture includes first and second deskew probe points for contacting first and second probes, respectively, during deskew calibration, a signal generating circuit for generating a calibration signal provided to the first and second deskew probe points, and a feedback loop for automatically self-calibrating the deskew fixture. The feedback loop includes first and second analog to digital converters (ADCs) for digitizing the calibration signal at the first and second deskew probe points while contacting the first and second probes, respectively, to provide first and second digitized calibration signals, and a processing unit programmed to determine inherent skew of the deskew fixture between the first and second skew probe points using the first and second digitized calibration signals, and to provide the determined inherent skew to a test instrument for use in the deskew calibration of the first and second probes.

A test point adaptor includes a body having a first and second end along a longitudinal axis. The second end includes an outer conductive sleeve. A cap includes a sleeve and a terminator. The body includes a first and second interface at the first and second ends, respectively. A center conductor extends though the body from the first interface toward the second interface. The second end includes a conical contact surface of the outer conductive sleeve. The cap matingly engages the second interface. The second end includes an electrically conductive contact member in electrical contact with the center conductor and a gripping arrangement electrically coupled with the electrically conductive contact member. The cap includes a conical contact surface to engage the conical contact surface of the outer conductive sleeve. A terminator is received by the gripping arrangement, which electrically couples the terminator to the center conductor.

A spring pin-based electrical interconnect system with a non-conductive socket body, a spring pin located in part in the socket body and defining two ends, an anisotropically-conductive elastomeric sheet with first and second opposed surfaces wherein the first surface is in contact with a first end of the spring pin. A PCB is in contact with the second surface of the elastomeric sheet.

A radio-frequency probe system with a transmitting or receiving element integrated into a cable assembly is disclosed. In some embodiments a preferred configuration may contain one or more sensing elements integrated into the transmitting or receiving element. In another embodiment, the radio frequency probe comprises an antenna body fixed to a coaxial cable, in which the center conductor of the coaxial cable serves as the transmitting or receiving element. A method for monitoring, transmitting, or detecting one or more parameters using a single radio frequency probe is also disclosed.

Methods, systems, and apparatus for an electrical connector assembly for connecting an integrated circuit chip to a printed circuit board. The electrical connector assembly includes a socket body that is made of an insulating material. The socket body has a top surface, a bottom surface, and a first plurality of cavities including a first cavity and a second cavity. The first cavity and the second cavity each have an inner surface plated with a conductive material to form a metal grounding shell. The electrical connector assembly includes multiple probes including a first probe and a second probe. The first probe is configured to be positioned within the first cavity and the second probe is configured to be positioned within the second cavity. The electrical connector assembly includes one or more signal traces that electrically connect the metal grounding shells of the first cavity and the second cavity.

Provided is a vertical probe card, the vertical probe card includes: a printed circuit board (PCB) including a bottom hole and a PCB pad surrounding the bottom hole; a cover plate disposed on the PCB and including a cover hole, where the cover hole and the bottom hole are disposed coaxial with each other and form a receiving space; and a probe received in the receiving space. The probe includes a probe head passing through the cover hole to extend out of the cover plate and to contact with a chip, where an end, which is provided with the probe head, of the probe is a first end; and a protruding portion disposed in the mid-portion of the probe and in contact with the PCB pad, where a part between the probe head and the protruding portion of the probe and the protruding portion are conductors.