An apparatus for coupling a test and measurement instrument to a device under test comprises a clip structured to be attached between two conductive portions of the device under test, and an insert structured to be removably installed in the clip. The insert is configured to provide a current path between the two conductive portions of the device under test. In embodiments, the insert comprises a resistive element, which may be a round rod resistor. Additional embodiments may be described and/or claimed herein.

A manufacturing process for an electrical contact assembly that uses an assembly jig with a middle horizontal lip adapted to fit into a plurality of C-shaped inner contact pins, as well as top and bottom guide teeth that guide top and bottom parts of the inner pins as they are being assembled. An inner holder then covers the inner pins, at which point epoxy is applied, which when cured, secures the inner holder to the plurality of inner pins. Outer contact pins in turn cover the outside of the inner holder, and an outer holder covers the outer contact pins. Epoxy is also applied between the outer holder and outer pins, which when cured, secures the outer holder to the plurality of outer pins. A heat curing process is also employed to assist with the curing of the epoxy, during which a clamp temporarily holds the assembly in place.

An RF connection assembly is provided for DC to mmWave signals. The RF connection assembly includes a GTMS assembly including a shroud, glass insulation filling a portion of the shroud to define an inner recess, and a gold plated GTMS center conductor secured by the glass insulation and protruding from the inner recess; and a pin and bead assembly including an RF center conductor including a clamping mechanism having a collar, and a center socket defined by the clamping mechanism, the center socket being accessible through an opening in the collar. The collar has a smooth inner edge around a perimeter, configured to guide a tip of the GTMS center conductor into the center socket of the RF center conductor for connecting the GTMS assembly and the pin and bead assembly, minimizing scraping of the GTMS center conductor by the inner edge of the opening.

A printed circuit board according to various embodiments of the disclosure includes a plurality of layers in which at least one opening is formed and at least one antenna included in at least one layer among the plurality of layers, and the at least one opening is located within a specified distance from the at least one antenna and is formed through at least one of the plurality of layers.

A ultra-wideband interconnection probe (100) connectable to a first access port of a first electronic device (101), the first access port comprising a first tapered coupler (101a) and to a second access port of a second electronic device (102), the second access port comprising a second tapered coupler (102a), the ultra-wideband interconnection probe (100) comprising a dielectric waveguide structure (120) establishing a high-pass characteristic interconnect, operating over a high frequency range starting from a low cut-off frequency fa in the microwave range or in the millimeter-wave range, wherein the dielectric waveguide structure (120) comprises a first tapered end (120a) connectable to the first access port via the first tapered coupler (101a) and a second tapered end (120b) connectable to the second access port via the second tapered coupler (102a).

A contact element for a probe head for an electronic device test apparatus is disclosed, having a body extending along a longitudinal axis between a first and a second opposite contact end, each made of electrically conductive material. The body includes a first section which extends over a distance less than 1000 m along the longitudinal axis starting from the first contact end towards the second contact end, a second section which extends along the longitudinal axis starting from the second contact end towards the first contact end, and a third section, interposed between the first and second sections, made of an electrically insulating material. The sections follow each other along the longitudinal axis so that the first contact end is included only in the first section, the second contact end is included only in the second section, and the third section electrically insulates the first section from the second section.

An apparatus for probing a device-under-test (DUT) includes a fixture, a circuitry film attached to the fixture, a probing tip disposed on and electrically coupled to the circuitry film to probe a device-under-test, and a first signal connector disposed on the circuitry film and electrically coupled to the probing tip through the circuitry film. The first signal connector is oriented in a direction that is angularly offset from a lengthwise direction of the probing tip.

The socket 20 comprises a first contact probe 21 which has a first end which is to contact with a first terminal 91 of the DUT 90, a second contact probe 22 which has a second end which is to contact with a second terminal 92 of the DUT 90, and an inner housing 23 which holds the first and second contact probes 21, 22 so that the first end and the second end are located on substantially the same virtual plane VP, and the length L.sub.2 of the second contact probe 22 is shorter than the length L.sub.1 of the first contact probe 21. The interposer 30 comprises a substrate 31 which has a through hole 311 into which the first contact probe 21 is to be inserted, and a wiring pattern 32 which is disposed on the substrate 31, and the wiring pattern 32 has a pad 321 with which the second contact probe 22 is to contact.

An RF signal processing system including multiple drop-in modular circuit blocks is disclosed. The drop-in modular circuit blocks include input and output launches exhibiting the same launch geometry. The RF system may include a conductive plate with a grid of holes disposed on the conductive plate. Multiple modular blocks may be installed on the conductive plate to form a cascade of modular blocks that exhibit common launch geometries. The cascade may include an RF probe with a projection and conductive pin that overhang a portion of a launch of a modular block at an end of the cascade. Flex connects may be disposed on, and held in position by, anchors to connect adjacent modular blocks together in a prototype system. A production RF system may exhibit the same overall geometry as a prototype RF system to speed up the transition from prototype design to production design.

A sample pipe is provided in a sample temperature control pipe. A detection coil is provided in a low-temperature airtight chamber and configured to irradiate a sample with a high-frequency magnetic field. A room-temperature shield is provided on an outer circumferential surface of the sample temperature control pipe or on an inner circumferential surface thereof, and is configured to block irradiation of the high-frequency magnetic field from the detection coil from reaching a region other than an observation object. A low-temperature shield is provided in an airtight chamber and between the detection coil and the room-temperature shield and is configured to block irradiation of the high-frequency magnetic field from the detection coil from reaching the room-temperature shield.