A probe card device includes an upper die unit, a lower die unit, a spacer sandwiched between the upper and lower die units, an impedance adjusting member, and conductive probes. The upper die unit includes a first die and a second die spaced apart from the first die. The first die has a penetrating hole, and the second die has a circuit layer. The impedance adjusting member is disposed on the second die and is electrically coupled to the circuit layer. Each of the conductive probes passes through the upper die unit, the spacer, and the lower die unit. At least one of the conductive probes includes an upper contacting segment protruding from the upper die unit and an extending arm connected to the upper contacting segment. The extending arm is abutted against the circuit layer by passing through the penetrating hole.

Probe for testing a radio frequency device, test system and test method. An enhanced probe is used for measuring radio frequency signals provided by the device under test or for providing test signals to the device under test. In particular, the probe comprises a power detector directly connected to the contacting elements of the probe. Accordingly, such a power detector can provide a power signal highly correlated with the power signal of a radio frequency signal at input or output terminals connected to the probe.

A probe holder includes: a first layered member including members layered over one another; and a second layered member bonded to the first layered member and including members layered over one another. Each of the first and second layered members includes: a first member made of a material having a low dielectric constant; a second member provided on one of surfaces of the first member and having higher hardness than the first member; and a third member provided on the other surface of the first member and having higher hardness than the first member. The probe holder further includes a holder hole formed by bonding the third members of the first and second layered members, the holder hole penetrating the probe holder in a direction in which the first and second layered members are layered, and having a stepped hole shape having a smaller diameter in the second members.

A contact terminal may include an outer tubular body being tubular and conductive and an inner tubular body being tubular and conductive, that is inserted into a cylinder of the outer tubular body. An outer first spring part that is elastic in an axial direction of the outer tubular body and whose winding direction is a first direction to be formed into a helical shape, may be formed on the outer tubular body. An inner first spring part that is elastic in an axial direction of the inner tubular body and whose winding direction is a second direction that is opposite to the first direction to be formed into a helical shape, may be formed on the inner tubular body.

Apparatuses, systems, and techniques for characterizing asymmetry effects caused by cathode designs, ESC designs, cable routing, and process chamber geometries are provided. Such apparatuses, systems, and techniques may include, for example, a rotatable RF probe assembly in physical contact to a conductive plate disposed on a surface of a pedestal.

A test and measurement probe system (100,104), including an input (106) to receive an input signal, the input signal including a low frequency (LF) and/or direct current (DC) component and an alternating current (AC) component, an extractor circuit (110), such as an AC coupling circuit or a LF and/or DC rejection circuit, configured to receive the input signal and to separate the AC component and the LF and/or DC component from the input signal, a first output (118) to output the alternating current component to the test and measurement instrument, and a second output to output the direct current component to the test and measurement instrument. In some embodiments, the LF and/or DC component is digitized prior to being output by the second output.

A hermetically sealed link for low loss coaxial airline connection between the wafer probe and the RF connector of an external instrument with 30 or 45 degrees wafer probes allows continuous, micro-positioner controlled, 3 axis horizontal and vertical probe movement. A flexible sealing ring ensures airtight and/or RF-EMI shielded operation. A metallic or plastic collar ensures wafer testing under EMI, airtight or high temperature conditions.

A high-frequency characteristic inspection apparatus includes a pair of high-frequency probes that inspect an electrical characteristic of a plane circuit including a signal region and a ground region formed apart from each other by an S parameter obtained by pushing a tip against a surface of the plane circuit and discharging a high frequency and a measurement apparatus. The high-frequency probe includes a ground terminal that is in contact with the ground region at its tip and a signal terminal that is in contact with the signal region simultaneously with the ground terminal at its tip. The pair of high-frequency probes are configured to contact with a surface of the plane circuit at the same time while facing each other at a certain interval.

A multi-section probe and a tapered probe for impedance tuners to broaden the band width of the probes and hence the band width of the tuners. The multi- section probe and the tapered probe are configured to transform the characteristic impedance of the tuner transmission line step-by-step or continuously to a target impedance value.

A test probe assembly includes a mounting fixture, a co-planar waveguide lead frame having a device contact point, where the co-planar waveguide lead frame is mounted to the mounting fixture, and at least one radio frequency (RF) connector assembly electrically coupled with the co-planar waveguide lead frame.