A sensor device according to an embodiment of the present technology includes a sensor head and a measurement unit. The sensor head includes a first probe and a second probe, the first probe including a first antenna section used for transmission, the second probe including a second antenna section used for reception, the second probe being situated at a specified distance from the first probe and facing the first probe. The measurement unit includes a signal generator that generates a measurement signal that includes information regarding characteristics of a propagation of an electromagnetic wave in a medium between the first and second antenna sections.

A printed circuit board according to various embodiments of the disclosure includes a plurality of layers in which at least one opening is formed and at least one antenna included in at least one layer among the plurality of layers, and the at least one opening is located within a specified distance from the at least one antenna and is formed through at least one of the plurality of layers.

An object of the present invention is to provide a prober that is able to carry out accurate inspection of semiconductor device in wafer state by reducing the effect of the external noises and the leakage of current and further by eliminating the stray capacitance of the chuck stage against the prober housing. The present invention attains this object by providing a prober comprising a chuck cover conductor that comprises a bottom conductor and a side conductor and an open top, wherein a chuck stage can be contained within a space surrounded by the bottom conductor and the side conductor; an upper cover conductor which has opening through which the conducting support members of the probe for front-side electrodes and the probe for back-side electrodes can be passed, and which is large enough to cover, in a plane view, at least the open top of the chuck cover conductor when the contact member of the probe for front-side electrodes moves relatively within a wafer under inspection; and, a conducting means that brings the chuck cover conductor and the upper cover conductor into contact and makes them electrically continuous.

A deskew fixture includes first and second deskew probe points for contacting first and second probes, respectively, during deskew calibration, a signal generating circuit for generating a calibration signal provided to the first and second deskew probe points, and a feedback loop for automatically self-calibrating the deskew fixture. The feedback loop includes first and second analog to digital converters (ADCs) for digitizing the calibration signal at the first and second deskew probe points while contacting the first and second probes, respectively, to provide first and second digitized calibration signals, and a processing unit programmed to determine inherent skew of the deskew fixture between the first and second skew probe points using the first and second digitized calibration signals, and to provide the determined inherent skew to a test instrument for use in the deskew calibration of the first and second probes.

A probe that enables a circuit board for electronic components, which is a measurement subject, to be disposed more densely. The probe is capable of simultaneously measuring a plurality of locations. The probe includes a plurality of main body portions having central conductors that make contact with connectors, and a first member that binds the plurality of main body portions together. A recess portion, having a base surface from which tip ends of the plurality of central conductors project, is provided in the first member. The recess portion has a sloped surface that flares outward from a base portion of the recess portion toward an opening in the recess portion.

An example contact head includes coaxial contacts configured for transmission of radio frequency (RF) signals or digital signals between a test system and a device under test (DUT). Each of the coaxial contacts is configured to target a specific impedance. Each of the coaxial contacts includes a coaxial structure having an open-curve shape. The coaxial structure includes a spring material that bends in response to applied force and that returns to the open-curve shape absent the applied force. The coaxial structure includes a center conductor terminating in a contact pin and a return conductor separated by a dielectric from the center conductor. At least part of the center conductor and the return conductor include an electrically-conductive material. Flexible contacts on the coaxial contact include the electrically-conductive material.

Embodiments of the present invention provide an RF probe for coupling out a probe signal from a transmission line of a circuit. The RF probe includes at least two probe pins having first ends for contacting the circuit and second ends. Furthermore, the RF probe includes a provider for providing a variable impedance at the second ends of the probe pins. The RF probe is configured to provide the probe signal based on a signal propagating along at least one of the probe pins.

A flexible resistive tip cable assembly includes a probe Radio Frequency (RF) connector structured to receive a RF differential signal and a testing connection assembly. A coaxial cable is structured to conduct the RF differential signal between the probe RF connector and the testing connection assembly. The coaxial cable includes a cable for conducting the differential signal, and a plurality of magnetic elements positioned along a length of the cable and structured to isolate the differential signal from common mode interference. The magnetic elements are separated from adjacent magnetic elements by a gap with elastomeric elements is positioned in each gap to provide cable flexibility. The assembly may also include an Electrically Erasable Programmable Read Only Memory (EEPROM) loaded with an attenuation associated with the flexible resistive tip cable assembly for use in signal testing by a device coupled to the testing connection assembly.

A probe module, which is provided between a tester and a DUT for transmitting electrical signals therebetween, includes a signal transmitting member, a plurality of probes, a positioning member, and a signal connector. The signal transmitting member has a circuit and two grounding. The probes are electrical connected to the circuit and the groundings of the signal transmitting member. The positioning member is made of an insulating material, and provided on the probes. The signal connector is adapted to be electrically connected to the tester, wherein the signal connector has a signal transmission portion and a grounding portion; the signal transmission portion is electrically connected to the circuit of the signal transmitting member, and the grounding portion is electrically connected to the at least one grounding of the signal transmitting member.

High frequency operation of an integrated circuit test system is greatly extended by incorporation of a dedicated high frequency signal element that provides a circuit specific compensation network as part of the intermediation circuit board that enables connectivity between test equipment and the integrated circuit under test.