A diagnostic and testing module for an electrically powered vehicle integrates multiple high-voltage buses for assessment while protecting personnel from accessing equipment energized at hazardous voltages. The consolidated module contains circuitry for assessing each high-voltage bus, including checking for ground faults, generating and distributing a priming voltage before energization of the buses, and identifying a bus voltage exceeding a predetermined hazardous level. A protective wall separates the high-voltage buses and circuitry at a rear of the module from a probing block at a front of the module. Lamps within the protective wall warn of energized bus voltages above the hazardous level. If the lamps are not illuminated, personnel can verify de-energized bus voltages using test points within the probing block and then install a grounding bar across all test points to ensure de-energization and prevent inadvertent re-energization.

A test system and method for performing high-voltage testing on a device under test (DUT), which provides a gas monitoring device and a control unit of the test system. The high-voltage test probe card system is equipped with synchronized pressure and flow monitoring functionality. A pressure and flow sensor is arranged upstream of a gas space of a probe card assembly, in coordination with the gas monitoring device and the control unit of the test system, thereby forming a complete and closed-loop control mechanism.

Testing performance of a semiconductor device includes redirecting a heated gas from an external source into a closed probe card assembly via a rigid gas manifold to create a pressurized region proximate to a device under test (DUT) and returning a sampling of the heated gas from the pressurized region to a controller device external to the closed probe assembly via a rigid return gas manifold. The heated gas is injected within a range of pressure and temperature to increase arc suppression on the DUT, and the pressure and the temperature of the heated gas is monitored at the controller.

A probe assembly includes a stepped insulator and a printed circuit board. The insulator is configured to surround a current carrying conductor. The printed circuit board includes a main portion and an outward protruding portion. The outward protruding portion is implemented as a voltage probe and extends outward away from the main portion and into the insulator. The printed circuit board includes a conductive element, one or more dielectric layers, and a pickup element, where the conductive element extends through the one or more dielectric layers and is connected to the pickup element, and where the pickup element is embedded in the one or more dielectric layers and disposed proximate the current carrying conductor. The printed circuit board includes signal conditioning components connected to the conductive element of the voltage probe.

The present disclosure relates to probes and apparatuses for high-voltage surge testing of a device under test. The probes comprises a handle configured to be gripped by an operator to position the probe onto the DUT, an adapter configured to releasably attach a proximal end of a contact electrode to the handle, a current conductor configured to couple the contact electrode to a high-voltage surge generator to deliver a high-voltage surge current to the DUT via a distal end of the contact electrode, and a voltage measurement conductor configured to couple the contact electrode to a voltage measurement circuit. Biasing mechanisms allowing the contact electrode to move into the adapter when the distal end is pressed against the DUT, as well as trigger mechanisms for triggering the delivery of the high-voltage surge current, are also disclosed.