The present disclosure relates to a method of depositing a fluid onto a substrate. In some embodiments, the method may be performed by mounting a substrate to a micro-fluidic probe card, so that the substrate abuts a cavity within the micro-fluidic probe card that is in communication with a fluid inlet and a fluid outlet. A first fluidic chemical is selectively introduced into the cavity via the fluid inlet of the micro-fluidic probe card.

The present disclosure provides a probe card and a thermal conduction device thereof. The thermal conduction device includes a plurality of first walls and a plurality of second walls. The first walls and the second walls are crossly arranged to form a plurality of accommodation spaces. The probe assemblies are disposed in the accommodation spaces. Each probe assembly includes a plurality of probes and a case which is configured to accommodate the probes. First ends of the probes face toward an opening of the corresponding accommodation space. Second ends of the probes face toward another opening of the corresponding accommodation space.

An semiconductor wafer measurement apparatus includes a holder; a probe with a capillary tube containing a mercury column for contacting a wafer with the column; a pneumatic control means applying a partial vacuum or pressure above the column; a probe arm affixed to the probe; a positioning means controlling the position of the tube relative to the wafer; a measurement means causing a current through the wafer and for measuring electrical properties of the wafer; a first electrical contact connected to the column; a second electrical contact connected to the holder; a mercury container; and a control unit in communication with the pneumatic control means, the positioning means and the measurement means. The probe has a measurement position and a mercury change position. The tube is separated from the mercury container in the measurement position, and the tube is in fluid communication with the mercury container in the change position.

A thermal management system for a test-and-measurement probe that includes a thermally insulated shroud and a fluid inlet conduit. The shroud is configured to enclose a first portion of a test-and-measurement probe within an interior cavity of the shroud, while permitting a second portion of the test-and-measurement probe head to extend out of the shroud into a testing environment. The shroud further includes a fluid outlet passageway configured to permit a heat-transfer fluid to pass from a probe-head end of the interior cavity, through the interior cavity of the shroud, and out of the shroud through an access portion of the shroud. A fluid inlet conduit enters the shroud through an access portion of the shroud, extends through the interior cavity of the shroud, and is configured to introduce a heat-transfer fluid to a probe-head portion of the test-and-measurement probe.

A probe card system is provided. The probe card system, including a tester assembly, a probe head body configured to couple with the tester assembly, a first interconnection structure on a first side of the probe head body, and a probe layer structure on the first interconnection structure on the first side of the probe head body which is configured to engage with a wafer under test (WUT). The probe layer structure includes a sacrificial layer in connection with the first interconnection structure, a bonding layer in connection with the sacrificial layer, and a plurality of probe tips each in connection with respective conductive patterns exposed from the bonding layer and electrically coupled to the first interconnection structure. The sacrificial layer allows removal of the bonding layer and the plurality of probe tips via an etching operation. A method of manufacturing a probe card system is also provided.

The present disclosure provides a probe card and a thermal conduction device thereof. The thermal conduction device includes a plurality of first walls and a plurality of second walls. The first walls and the second walls are crossly arranged to form a plurality of accommodation spaces. The probe assemblies are disposed in the accommodation spaces. Each probe assembly includes a plurality of probes and a case which is configured to accommodate the probes. First ends of the probes face toward an opening of the corresponding accommodation space. Second ends of the probes face toward another opening of the corresponding accommodation space.

A wafer probe test system has a conductive needle configured to contact a conductive feature on a surface of a wafer, and a fluid probe having a multichannel tube, the fluid probe configured to engage the surface of the wafer to form a fluidic seal between a sensor face on the surface of the wafer and the conductive feature of the wafer, the multichannel tube having a first channel and a second channel configured to create a flow of fluid across the sensor face on the surface of the wafer.