An electrical connecting device includes a probe head, and probes for measurement and probes for confirmation held by the probe head. The probe head holds the probes for measurement and the probes for confirmation in a state in which the respective tip ends are exposed therefrom. An exposed length from the probe head to the tip end is shorter for the probes for confirmation than for the probes for measurement.

A testing apparatus includes a first coordinates obtaining unit, a second coordinates obtaining unit, and a controller that performs determining card gravity center coordinates of a probe card held at a pogo frame opposite to an alignment stage, determining reference coordinates in a target coordinate system of a reference target at predetermined coordinates, determining alignment coordinates when the first coordinates obtaining unit is aligned with the second coordinates obtaining unit, determining wafer gravity center coordinates of a wafer, and calculating contact coordinates by using the determined card gravity center coordinates, the determined alignment coordinates, and the determined wafer gravity center coordinates. The controller further performs determining actual contact coordinates at the calculated contact coordinates, calculating reference contact coordinates based on the determined reference coordinates, and correcting a position of the alignment stage based on a positional difference between the determined actual contact coordinates and the calculated reference contact coordinates.

The present invention relates to a method of establishing specific electrode positions by providing a multi-point probe and a test sample. The method comprises the measuring or determining of a distance between two of the electrodes of the multi-point probe and establishing a resistance model representative of the test sample. The method further comprises the performing of at least three different sheet resistance measurements and establishing for each of the different sheet resistance measurement a corresponding predicted sheet resistance based on the resistance model. Thereafter the method comprises the establishment of a set of differences constituting the difference between each of the predicted sheet resistance and its corresponding measured sheet resistance, and deriving the specific electrode positions of the multi-point probe on the surface of the test sample by using the distance and performing a data fit by minimizing an error function constituting the sum of the set of differences.

An inspection system includes: an inspection section provided with an inspection part having a plurality of inspection units each including a tester that performs an electrical inspection of an inspection target, and a probe card provided between the tester and the inspection target; and a loader section including an arrangement part in which a storage container for the inspection target is disposed, and a loader that delivers the inspection target between the storage container and the inspection section. The inspection part includes a plurality of inspection unit rows that are formed by arranging the plurality of inspection units in one horizontal direction and arranged in a plurality of tiers in a vertical direction. The arrangement part is provided on an end part side in one direction of the inspection part.

A device probe includes a primary probe arm and a subsequent probe arm with a slip plane spacing between the primary probe arm and subsequent probe arm. Each probe arm is integrally part of a probe base that is attachable to a probe card. During probe use on a semiconductive device or a semiconductor device package substrate, overtravel of the probe tip allows the primary and subsequent probe arms to deflect, while sufficient resistance to deflection creates a useful contact with an electrical structure such as an electrical bump or a bond pad.

A probe adapter includes an adapter body including a probe aperture and a slot. The probe adapter further includes a driver slidably mounted within the slot and slidable between a first position and a second position. The driver includes a first end and a second end opposite the first end. The first end includes a ramped recess extending in a direction from the first end toward the second end. The probe adapter further includes a threaded fastener configured to contact the second end of the driver so as to retain the driver in the first position.

The present disclosure provides a wafer test system and methods thereof. The test system includes a probe apparatus, a data server, an automation subsystem, and a probe mark assessment subsystem. The probe apparatus includes a probe card, a tester, and a camera. The probe card includes probe pins for contacting test pads in the wafer, and the camera captures an image of the test pads. The automation subsystem obtains an image specification from the probe apparatus and triggers an automated assessment of a probe mark in the image of the test pads. The probe mark assessment subsystem performs the automated assessment of the probe mark in the image of the test pads. The probe mark assessment subsystem performs an image-processing operation to obtain a probe mark assessment result, and the automation subsystem stops the probe apparatus if the probe mark assessment result indicates a probe test failure.

A semiconductor device is provided. The semiconductor device includes a first test pad and a plurality of second test pads. The first test pad includes a central portion and a plurality of peripheral portions. The plurality of peripheral portions are disposed adjacent to edges of the central portion. The plurality of peripheral portions are not in contact with each other and with the central portion. The first test pad has a plurality of detection directions, and at least one of the plurality of peripheral portions is disposed in one of the plurality of detection directions. Each of the plurality of second test pads is electrically connected to one of the plurality of peripheral portions through a first connection trace.

Probe systems for optically probing a device under test (DUT) and methods of operating the probe systems. The probe systems include a probing assembly that includes an optical probe that defines a probe tip and a distance sensor. The probe systems also include a support surface configured to support a substrate, which defines a substrate surface and includes an optical device positioned below the substrate surface. The probe systems further include a positioning assembly configured to selectively regulate a relative orientation between the probing assembly and the DUT. The probe systems also include a controller programmed to control the operation of the probe systems. The methods include methods of operating the probe systems.

Proposed are a probe head and a probe card having the same. The probe head includes: an upper guide plate having an upper guide hole; a lower guide plate having a lower guide hole; an intermediate guide plate having an intermediate guide hole, and provided between the upper guide plate and the lower guide plate; and a guide member provided at a side of the intermediate guide plate, wherein the intermediate guide plate is limited in movement by the guide member.