An automated circuit test system includes a magnetic sensor array configured to measure, at a plurality of locations, a magnetic field induced by a circuit under test. A circuit drive module can energize the circuit under test to induce the magnetic field. Optionally, the circuit drive module detects an electrical response from the circuit under test. Optionally, magnetic field data is combined with electrical response data prior to outputting the test result.

Optical sensing methods and systems for power applications, and the construction thereof, are described herein. An example method of constructing a winding assembly includes mounting a sensing component to a coil former, and winding a coil onto the coil former so that the sensing component is positioned within the coil. A system and method for detecting operating conditions within a transformer using the described winding assemblies are described.

An Antenna measurement system incorporating high speed tracking laser-based global positioning capture synchronized with radio frequency (RF) measurements. A high speed tracking laser is used for collecting RF probe position data synchronously with corresponding near-field RF measurements. The probe may be moved across an arbitrary surface surrounding or adjacent to a device under test (DUT); however, it is not necessary for the probe position to be perfectly coincident with the surface, or any of the discrete points which make up the surface. Here, the probe position is determined relative to a global positioning coordinate system which is defined by a set of monuments which are in known positions relative to the global positioning coordinate system, and not the DUT. Any difference between the actual position of the probe, in the global position coordinate system, and a given one of the discrete measuring points, in the global position coordinate system, on the surface surrounding or adjacent to the DUT can be accounted for during post processing, thus eliminating the need for advanced or intermittent calibration to achieve precise near-field measurements.

An Antenna measurement system incorporating high speed tracking laser-based global positioning capture synchronized with radio frequency (RF) measurements. A high speed tracking laser is used for collecting RF probe position data synchronously with corresponding near-field RF measurements. The probe may be moved across an arbitrary surface surrounding or adjacent to a device under test (DUT); however, it is not necessary for the probe position to be perfectly coincident with the surface, or any of the discrete points which make up the surface. Here, the probe position is determined relative to a global positioning coordinate system which is defined by a set of monuments which are in known positions relative to the global positioning coordinate system, and not the DUT. Any difference between the actual position of the probe, in the global position coordinate system, and a given one of the discrete measuring points, in the global position coordinate system, on the surface surrounding or adjacent to the DUT can be accounted for during post processing, thus eliminating the need for advanced or intermittent calibration to achieve precise near-field measurements.

A connecting device for inspection includes optical probes, and a probe head including a plurality of guide plates. The probe head includes a first guide plate, and a second guide plate arranged movably with respect to the first guide plate in a radial direction of the penetration holes in a state in which the optical probes are inserted to the respective penetration holes. The probe head holds the optical probes by inner wall surfaces of the penetration holes of the first guide plate and inner wall surfaces of the penetration holes of the second guide plate in a state in which the positions of the central axes of the penetration holes of the first guide plate are shifted in the radial direction from the positions of the central axes of the penetration holes of the second guide plate.

In the field of the counting of objects, a use is provided of a photosensitive assembly comprising at least one photodiode or one photoresistor, and a source of uniform illumination for illuminating the assembly, the establishment of a reference current supplied by the photosensitive assembly for an illuminated region of this assembly corresponding to a given fraction of the surface of the assembly, the disposition of objects to be counted against the photosensitive assembly, the illumination of the assembly by the source, the objects masking a part of the surface of the assembly, measurement of the current supplied by the assembly, and determination of a ratio between measured current and reference current to deduce the proportion between the surface area of photosensitive element illuminated and the surface area masked by the objects disposed. From this ratio, information on the number of objects disposed on the photosensitive assembly is extracted.

A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a contact probe arranged at a side of the mounting table and electrically connected to a mounting table electrode of the mounting table. The contact probe includes a contact portion, having a top surface formed uneven, to be in contact with the electrode plate, and a cable connection portion formed as one unit with the contact portion. The contact portion and the cable connection portion are vertically movable by a biasing member provided below the cable connection portion. When the probes are made contact with electrodes of a semiconductor device of the semiconductor wafer by moving up the mounting table, the contact portion and the electrode plate are made contact with each other and the backside electrode and the tester are electrically connected to each other.

A voltage/current probe includes: a circuit board; a first inductor that is located on the circuit board, that is wound in a first direction, and that includes: a first end connected to a first output conductor; and a second end; a second inductor that is located on the circuit board, that is wound in a second direction that is opposite the first direction, and that includes: a third end that is connected to a second output conductor; and a fourth end that is connected to the second end of the first inductor and to a third output conductor.

An electrical connection device includes: a plurality of probes (10) in which distal end portions contact an inspection object (2) during measurement; and a space transformer (30) including a plurality of connection wirings (33), in each of which a first terminal electrically connected to any of proximal end portions of the plurality of probes (10) is arranged on a first main surface (301), and a second terminal is exposed to a second main surface (302), and having a short-circuit wiring pattern formed on the first main surface, the short-circuit wiring pattern electrically connecting, to the same connection wiring (33), proximal end portions of a plurality of same-potential probes (10) set at a same potential during measurement among the plurality of probes (10).

An inspection apparatus includes a light sensor that detects light from a semiconductor device to which an electric signal has been input, an optical system that guides light from the semiconductor device to the light sensor, and a control device electrically connected to the light sensor. The control device includes a measurement unit that acquires waveform data obtained by optical measurement for each of a plurality of positions on a defective semiconductor device and waveform data obtained by the optical measurement for each of a plurality of positions on a non-defective semiconductor device, a calculation unit that calculates a degree of correspondence between the waveform data of the defective semiconductor device and the waveform data of the non-defective semiconductor device, and an analysis unit that analyzes a defective part of the defective semiconductor device on the basis of the degree of correspondence for each of the plurality of positions.