Disclosed herein is a system for non-contact measurement of an optoelectronic property. The system includes a sensing element configured to amplify an electromagnetic wave having a specific frequency, a thin film disposed on the sensing element such that an optoelectronic property of the thin film is measured, and an optoelectronic property measuring server configured to extract a physical property of the thin film based on the optoelectronic property of the thin film obtained when the electromagnetic wave amplified by the sensing element passes through the thin film.

An arrangement for a spatially resolved determination of the specific electrical resistance and/or of the specific electrical conductivity of a sample at different positions, in which

a plurality of detectors are configured for a spatially resolved spectral analysis of electromagnetic radiation within a wavelength interval and is incident onto the detectors. A radiation onto a surface takes place with homogeneous intensity. The measurement signals of the detectors detected with spatial resolution and wavelength resolution within a wavelength interval are compared for each detected position with a wavelength-resolved function that are compared by calculation of the propagation of electromagnetic radiation in multilayer systems while using an optical model for a physical description of the examined sample while taking account of the wavelength-dependent progressions of the linear optical refractive indices n and of the coefficients of absorption k of all the materials and/or substances forming the sample that can be approximated by a physical function of a complex refractive index of the conductive material or substance. They are brought to a sufficient overlap with a calibration curve progression by a change of the parameters of the physical function to determine the specific electrical resistance and/or the specific electrical conductivity at different positions with spatial resolution.

A method of testing a substrate, particularly a packaging substrate, with at least one electron beam column is described. The packaging substrate can be a panel level packaging substrate or an advanced packaging substrate. The method includes: placing the substrate on a stage in a vacuum chamber; directing the electron beam of the at least one electron beam column with a landing energy U.sub.pe, a first beam diameter BD.sub.1 and a first impact angle .sub.1 on one or more first surface contact points on the substrate; directing the electron beam with at least one of a second beam diameter BD.sub.2 and a second impact angle .sub.2 on one or more second surface contact points different from the one or more first surface contact points, wherein at least one of the following applies: i) the first impact angle .sub.1 is different from the second impact angle .sub.2, and ii) the second beam diameter BD.sub.2 is different from the first beam diameter BD.sub.1; and detecting signal electrons emitted upon impingement of the electron beam for testing at least a first device-to-device electrical interconnect path of the substrate.

The invention provides systems and methods for machine learning guided electrochemical impedance spectroscopy for calibration-free pharmaceutical moisture content monitoring. In certain aspects, the invention provides a system for determining moisture content in a sample that includes an electrochemical impedance spectroscopy (EIS) apparatus; and a processor configured to: receive electrical properties of a sample from the EIS apparatus; and correlate the electrical properties to moisture content of the sample.