A circuit board inspection apparatus includes an inspection processing portion that inspects an electric circuit of a board to be inspected, an inspection jig, and a position detector used to position the inspection processing portion relative to the board to be inspected. The inspection jig includes a probe unit having a probe, a first board, a second board located in parallel with the first board in a thickness direction of the first board, an electrical connection portion that electrically connects the first board and the second board, and a second board holding portion that holds the second board from the first board and holds the probe unit on a side opposite to the first board side. The second board holding portion has a position detection opening penetrating in the thickness direction, at a position overlapping the position detector as viewed from the thickness direction of the second board holding portion.

A tester apparatus is described. Various components contribute to the functionality of the tester apparatus, including an insertion and removal apparatus, thermal posts, independent gimbaling, the inclusion of a photo detector, a combination of thermal control methods, a detect circuitry in a socket lid, through posts with stand-offs, and a voltage retargeting.

A method for factory analysis and/or maintenance, preferably including receiving factory information and/or associating defects with factory components, and optionally including acting based on defect associations and/or operating factory machines. The method is preferably associated with one or more manufacturing systems and/or elements thereof.

An inspection jig includes a first board, a probe unit including a probe, a second board located in parallel with the first board and electrically connected to the probe, an electrical connection portion electrically connecting the first board and the second board, and a board holding portion holding the second board in parallel with the first board in the thickness direction and holding the probe unit. The board holding portion includes a probe-side holding plate located on the probe unit side of the second board and a holding plate support portion that positions the probe-side holding plate at a position where the probe-side holding plate is in parallel with the first board in the thickness direction. The board holding portion holds the second board so that the first board and the second board are electrically connected via the electrical connection portion being sandwiched between the first board and second board.

An apparatus includes a test head frame and a tray slidably coupled to the frame and configured to receive a printed circuit board (PCB) to be tested. The PCB is positioned within the frame when the tray is in a retracted position and outside the frame when the tray is in an ejected position. A bed of nails (BON) opposes a lower side of the PCB and includes a plurality of pins having first portions arranged on an upper side of the BON to connect with corresponding electrical pads on the lower side of the PCB when the tray containing the PCB is in the retracted position. A plurality of interface printed circuit boards is configured for connection to second portions of the plurality of pins exposed on a lower side of the BON and for receiving test signals when the tray containing the PCB is in the retracted position.

A circuit tester includes an interposer transfer board, a mounting plate, at least one sensor plate, and at least one receptacle and probe assembly. The interposer transfer board includes a first surface and a second surface opposite to the first surface, at least one amplifier holder, and at least one input header and at least one output header. The at least one amplifier holder, the at least one input header, and the at least one output header are disposed on the first surface of the interposer transfer board. The at least one receptacle and probe assembly is fixed on the at least one sensor plate. The at least one receptacle and probe assembly passes through and is mounted on the mounting plate. The at least one input header is connected to the at least one receptacle and probe assembly via wires.

A circuit board inspecting apparatus includes a rotary table having a mount surface, a rotary table support section, a suction device, a suction path having a first end connected to the suction device and a second end located at the mount surface, an adsorption mechanism that adsorbs the board onto the mount surface so that the suction device sucks in gas in the suction path, a flow rate detection section that detects a flow rate of gas flowing through a portion of the suction path, the portion located inside the rotary table support section, a flow rate determination section that determines whether the flow rate of the gas detected by the flow rate detection section is equal to or more than a predetermined value, a contactless detection section that detects a placement state of the board on the mount surface in a contactless manner, and an inspection section.

Provided is a semiconductor chip test socket configured to be coupled to a test circuit board for testing a semiconductor chip and provided with an integrated circuit (IC) chip having unique information and an algorithm for counting the number of times the semiconductor chip test socket is used, such that the number of times the semiconductor chip test socket is used may be exactly counted, and the IC chip may be easily installed and removed and securely protected from external impacts.

The disclosed apparatus may include support portions, a frame (such as a base) configured to maintain the support portions in a spaced-apart configuration, a sample holder configured to receive a sample, and a probe assembly including micromanipulators configured to position one or more probes in contact with the sample. The sample holder may rotate between the support portions, and the probe assembly may rotate with the sample holder so that the one or more probes may maintain contact with a sample in the sample holder as the sample holder is rotated, for example, to expose a portion of the sample for processing. Various other methods, systems, and computer-readable media are also disclosed.

Systems for interfacing a printed circuit board assembly (PCBA) adapter module to a receiver housing are provided. The receiver housing may have a first interface mounted on the receiver housing via a first mount and the PCBA adapter module may have a second interface mounted on the adapter module via a second mount. One of the interfaces has a protruding feature that aligns the interfaces when matingly engaged, while the other interface has a centering hole opposite the protruding feature. The first centering hole is enlarged with respect to an axis of an insertion-angle plane such that the protruding feature substantially clears the centering hole without causing either interface to exceed a limit of free-play between that interface and its respective mount.