The present disclosure provides a testing fixture. The testing fixture includes a carrier, a plurality of sets of electrical lines and a plurality of electrical lines. The carrier includes a base and a frame extending along an upper surface of the base. The base and the frame define a first recess, a second recess extending longitudinally from the first recess, and a third recess extending transversely from the first recess. The plurality of sets of electrical contacts are disposed on the base and arranged in a rotationally symmetrical manner, and the electrical lines are electrically connected to the plurality of sets of electrical contacts.

A measurement arrangement and method for providing at least one combined measurement dataset, said measurement arrangement comprising at least one measurement device configured to generate measurement data in a measurement session, and a mobile device configured to generate measurement session context data of said measurement session, said measurement device and said mobile device being connected via at least one wireless link for data transfer, wherein the measurement data generated by said measurement device and associated measurement session context data generated by said mobile device are linked to provide a combined measurement dataset.

The present disclosure relates to the field of display technology, in particular to a test fixture, comprising a pressing connection mechanism (1), an eccentric mechanism (2), and a working carrier (3), the pressing connection mechanism (1) and the working carrier (3) being arranged correspondingly, and the rotation of the eccentric mechanism (2) driving the pressing connection mechanism (1) to move up and down in a Y direction so as to conduct a signal pressing connection test for a tested product on the working carrier (3). The test fixture has a simple structure and steady properties, easy to be operated and maintained conveniently.

The present invention discloses a test probe, a test probe component, and a test platform. The test probe comprises a probe body, wherein one end of the probe body is of a hollow design, thereby cooperating with a gold finger through insertion. According to the present invention, one end of the probe body is of a hollow design, thereby cooperating with the gold finger through insertion, thus solving the current technical problems of the assembling of the probe being relatively difficult, the requirements for processing of the through-hole being relative high, and the powering on being unstable.

A signal testing apparatus for a printed circuit board is disclosed which includes a plurality of input terminals for receiving an external testing signal, a plurality of output terminals for supplying the printed circuit board with the external testing signal, a plurality of switches arranged between the plurality of input terminals and the plurality of output terminals for controllably coupling the plurality of input terminals to the plurality of output terminals, an ammeter for measuring a magnitude of a current on a first path provided by the coupling of the plurality of switches, and a voltmeter for measuring a magnitude of a voltage on a second path provided by the coupling of the plurality of switches.

In one example, a first tubular member has a first diameter and is configured to attach to a printed circuit board. A second tubular member has a second diameter different from the first diameter and is configured to hold an environmental sensor for collecting data relating to an environment of the printed circuit board. The second tubular member is vertically adjustable relative to the first tubular member.

A test module, is provided including a tester that electrically tests a semiconductor device. A device under test (DUT) board is connected to the tester and the semiconductor device. A base board is disposed between the DUT board and the tester. The base board includes a lower plate, a plurality of connection lines that penetrate the lower plate, an upper plate disposed on the lower plate, and a first temperature controller disposed in the base board. The first temperature controller maintains the connection lines at a first temperature. A docking connector is disposed on the first temperature controller. The docking connector connects the connection lines to the DUT board. A second temperature controller is disposed between the first temperature controller and the upper plate. The second temperature controller maintains the docking connector at a second temperature different from the first temperature.

A method for testing printed circuit boards (20) in a test apparatus having a carrying apparatus for the printed circuit board (20) and having test modules for measuring physical variables of components (EB) and contact points (29) on the printed circuit board (20), in which the width of the printed circuit board (20) defines an X direction, its length defines a Y direction and its thickness defines a Z direction inside the test apparatus, reference points, the X, Y and Z positions of which relative to the carrying apparatus are known, are present on the printed circuit board (20) or outside the latter, the X and Y positions of the components (EB) and contact points (29) relative to the reference points are known, the measurement of the physical variables depends on an actual Z position of the printed circuit board at the X and Y positions of the component (EB) or contact point (29) to be measured, and the actual Z position of the printed circuit board at the X and Y positions of the component (EB) or contact point (29) to be measured is determined by means of an interpolation method starting from the X, Y and Z positions of selected reference points.

A probe assembly for capacitive testing electrical connections of a low profile component to a circuit assembly. The probe assembly is configured to reduce coupling of noise signals from the circuit assembly to the capacitive probe. The probe assembly includes a sensing member with a geometry that allows the probe to preferentially couple to test signals from the pins of a component under test rather than conductive structures on the circuit assembly, such as pads, and signal traces to which those pins are attached. The sensing member may be a vertical capacitive sense plate such that coupling is to an edge of the plate. The sensing member alternatively may be a horizontal capacitive sense plate with an active area of the probe surrounded by an isolation ring. Measurements made with such capacitive probes may provide test measurements that yield a reliable discrimination between a properly attached pin and an open pin.

A testing device for testing an electronic device includes a base, a testing mechanism, a pushing mechanism, and a fastening mechanism. The testing mechanism is rotatably fastened to the base and can be rotated from a first position to a second position. The fastening mechanism is mounted on the base. The pushing mechanism is rotatably mounted on the testing mechanism. When the testing mechanism is rotated from the first position to the second position, the pushing mechanism is rotated and pushes against the testing mechanism. The testing mechanism is connected to an electronic device. The testing mechanism is positioned in the second position via the fastening mechanism.