A physical property of a test sample with a conductive or semi-conductive material (line/area/volume) is obtained. Periodic Joule heating is induced within the test sample by passing an AC current across a first pair of probe terminals electrically connected to the test sample, measuring the voltage drop across a second pair of probe terminals electrically connected to the test sample at one and three times the fundamental excitation frequency of the current-conducting terminals, and calculating the temperature-modulated property/properties of the test sample as a function of the potential drop measurement(s). This includes: a) determining a value proportional to the TCR of the test sample, b) a geometric parameter of the test sample (affected by coupling of its TCR to heat transport to/from the test sample), or c) the true resistivity of the test sample at the ambient experimental temperature by subtracting measurable and accountable TCR offset(s).

A method for electrical testing of an electrical circuit for defects, all electrical or electronic parts are measured simultaneously, so an electrical image of the electrical circuit is received by a control/evaluation unit, in which an electrical excitation signal of an electrical current or an electrical voltage is applied simultaneously by the control/evaluation unit and a plurality of driver circuits at a plurality of test points of the electrical circuit, which test points may be arranged in any way. The electrical excitation signals applied via the driver circuits differ with regard to their spectral characteristic. The electrical current flowing in the particular test point and the resultant electrical voltage are recorded synchronously with regard to a waveform in relation to an electrical ground potential, and subsequently parameters of the parts and their electrical connections are calculated by the control/evaluation unit.

An electronic device, which includes at least a first part and a second part bonded to each other is provided. The first part includes a first bonding area. The first bonding area includes at least one first testing area. The first testing area includes a plurality of testing pads. The second part includes a second boding area corresponding to the first bonding area. The second bonding area includes a plurality of testing terminals, and includes at least one second testing area respectively corresponding to the at least one first testing area. The second testing area includes a plurality of testing pins. The plurality of testing pads, the plurality of testing terminals and the plurality of testing pins are configured to form a current channel and a voltage testing channel, for measuring a resistance of bonded testing pads and testing pins on both the current channel and the voltage testing channel.

The present invention is directed to a system for testing printed circuit boards. The system is configured to test the simultaneously test a multiplicity of printed circuit boards. The system examines the electrical characteristics of a printed circuit board and is operable to identify if a printed circuit board meets a desired characteristic.

An electronic device includes a display panel, an input sensor disposed on the display panel and including a sensing electrode, a first signal line connected to the sensing electrode, and a second signal line connected to the sensing electrode, and a circuit board electrically connected to the input sensor. The circuit board includes a first group signal line electrically connected to the first signal line, a second group signal line electrically connected to the first group signal line and to the second signal line, a first inspection signal line electrically connected to the first group signal line, and a second inspection signal line electrically connected to the second group signal line.

A test and measurement instrument including a voltage source configured to output a source voltage, a current sensor, and one or more processors. The one or more processors are configured to determine an estimation of a load of an unknown connected device under test based on the source voltage, the current sensor, and a voltage of the connected device under test without any prior knowledge of the connected device under test.

A method for detecting a physical short-circuit defect between the first metal layer and a gate below. A first detection structure and a second detection structure are arranged in parallel in a detection region or a dicing channel region on a wafer, each detection structure comprises a P-type active detection, a detection gate structure, a contact hole in the P-type active detection, gate contact holes at two ends of the detection gate structure, a metal wire connected to the contact hole in the P-type active detection, and a metal wire connected to the gate contact hole. The detection gate structure of the first detection structure and the metal wire above it at least partially overlap. However, there is no projective overlap region between the detection gate structure of the second detection structure and the metal wire—above it.

Apparatus, systems, and methods for progressive corrosion detection are disclosed. An example apparatus includes a query generator to query a multiplexer channel to receive an output voltage, the multiplexer channel linked to a fin group of an electrode array, the fin group forming an open circuit in the absence of conductive crystal formation, a quantifier to determine, using a reference voltage, a difference between the reference voltage and the output voltage from the queried multiplexer channel, and a contamination level comparator to identify presence of conductive crystal formation based on the difference between the reference voltage and the output voltage.

Systems and methods for detecting the presence and/or location of defects (e.g., incomplete solders, broken cables, misconnections, defective sockets, opens, shorts, etc.) along electrical lines are described. The systems and methods described herein may use time-domain reflectometry (TDR), a measurement technique used to determine the characteristics of electrical lines by observing reflected waveforms. TDR may be performed in some embodiments by determining the times when a first event and a second event occur, and by determining the space traveled by a probe signal based on these times. The first event may occur when a first signal transition crosses a first threshold and the second event may occur when a second signal transition crosses a second threshold, where the second signal transition may arise in response to the first signal transition reflecting against a defect along the electrical line.

The present invention is directed to a system for testing printed circuit boards. The system is configured to test the simultaneously test a multiplicity of printed circuit boards. The system examines the electrical characteristics of a printed circuit board and is operable to identify if a printed circuit board meets a desired characteristic.