An abnormal state latch unit comprises: an detection circuit that masks an abnormality position signal; a timer circuit that starts motion when the abnormality position signal indicates the occurrence of an abnormality based on the abnormality position signal, and completes the motion and outputs a reset signal after passage of a predetermined period; and a latch circuit that latches the abnormality position signal output from the detection circuit when the reset signal is output. The detection circuit masks the abnormality position signal when the latch circuit makes latching motion to disable an output from the detection circuit. The timer circuit masks an input to the timer circuit when the latch circuit makes the latching motion to maintain a state indicating completion of the motion. Abnormality voltage signals generated by an signal generation circuit are wired-OR connected and supplied through a single signal line to a monitor circuit.

In a method of testing an interconnection substrate, a blocking condition of a reference light reflected from a probe having an intrinsic optical characteristic may be set. An electric field emitted from a test interconnection substrate having a plurality of circuits may change the intrinsic optical characteristics of the probe into test optical characteristics. Light may be irradiated to the probe having the test optical characteristics. The reference light reflected from the probe having the test optical characteristic may be blocked in accordance with the blocking condition. The remaining reflected light that may be due to an abnormal circuit may be detected.

Disclosed are a substrate inspection apparatus and a method for displaying a component in a three-dimensional inspection of a substrate. The substrate inspection apparatus measures a substrate or an inspection target region of interest of the substrate and displays an image of components positioned within the measured region on a display unit. The image of the components displayed on the display unit may be displayed in a predetermined reference direction. The difference between the reference direction and a direction in which the actual component is disposed on the substrate is displayed in the form of a numerical value or a figure. Alternatively, the image of the component in the reference direction and the image of the actually disposed component are simultaneously displayed on a screen, and a user may convert a display method of the image by using a toggle button.

A system includes a signal generator configured to generate a signal, the signal being a constant frequency signal or the signal ranging in frequency during a time period. The system includes a probe electrically coupled to the signal generator, and the probe is configured to hover across or touch an encapsulated or uncapsulated strain gauge. The probe includes a coil and a stylus. The coil is configured to receive the signal from the signal generator and generate a magnetic field. The stylus is configured to transmit the magnetic field to the strain gauge. The system includes a data acquisition component coupled to the strain gauge. The data acquisition component is configured to receive stimulus data from the strain gauge, resulting from the magnetic field transmitted by the probe. The data acquisition component is configured to determine whether the stimulus data from the strain gauge is above a threshold, and if so, determine that the strain gauge is operable.

A power control integrated circuit (IC) chip can include a direct current (DC)-DC converter that outputs a switching voltage in response to a switching output enable signal. The power control IC chip can also include an inductor detect circuit that detects whether an inductor is conductively coupled to the DC-DC converter and a powered circuit component in response to an inductor detect signal. The power control IC chip can further include control logic that (i) controls the inductor detect signal based on an enable DC-DC signal and (ii) controls the switching output enable signal provided to the DC-DC converter and a linear output disable signal provided to a linear regulator based on a signal from the inductor detect circuit indicating whether the inductor is conductively coupled to the DC-DC converter and the powered circuit component.

An inspection device with improved inspection accuracy of electrical characteristics of a component, including a holding table, a pair of measuring elements configured to grip a component held on the holding table 32 and measure electrical characteristics of the component; and a relative movement device configured to relatively move the holding table and the pair of measuring elements. In a state in which component is clamped by the pair of measuring elements, by moving holding table, component and the holding table are separated by at least a set value, and in that state the electrical characteristics are measured. Therefore, even if the holding table is made of a conductive material, effects on the component are reduced, and the electrical characteristics can be measured accurately.

In an electrical characteristic acquisition apparatus, a condition under which an electrical characteristic of a target object is acquired can be inputted by an operator, and an electrical characteristic of the target object is acquired under the input condition. In a case where a condition is inputted as a condition under which an electrical characteristic of the target object is acquired, an erroneous determination is made due to the different conditions that the target object is not an electrical component which complies with the nominal value, or, in a case where a difference between a value representing an electrical characteristic of the target object and a nominal value of the target object is larger than a permissible tolerance, an erroneous determination is made that the target object is defective. Here, these erroneous determinations are prevented from being made.

A substrate inspection apparatus according to an embodiment of the present invention comprises a projection unit, an illumination unit, an image acquisition unit and a processing unit. The projection unit irradiates an inspection target with light for obtaining three-dimensional shape information of the inspection target. The illumination unit irradiates the inspection target with at least two lights having different colors. The image acquisition unit acquires a first image by receiving light irradiated by the projection unit and reflected from the inspection target, and a second image by receiving the lights irradiated by the illumination unit and reflected from the inspection target. The processing unit acquires brightness information and color information from the first image and the second image, respectively, which are acquired by the image acquisition unit, and acquires at least a portion of a boundary by using the bright information and the color information. Therefore, the accuracy and reliability of the inspection can be improved.

A power control integrated circuit (IC) chip can include a direct current (DC)-DC converter that outputs a switching voltage in response to a switching output enable signal. The power control IC chip can also include an inductor detect circuit that detects whether an inductor is conductively coupled to the DC-DC converter and a powered circuit component in response to an inductor detect signal. The power control IC chip can further include control logic that (i) controls the inductor detect signal based on an enable DC-DC signal and (ii) controls the switching output enable signal provided to the DC-DC converter and a linear output disable signal provided to a linear regulator based on a signal from the inductor detect circuit indicating whether the inductor is conductively coupled to the DC-DC converter and the powered circuit component.

The system for automatic signal measurement includes a device under test, a control circuit, a data processing circuit, and a display device. The device under test includes a test pad area, which has multiple exposed test pads coupled to multiple circuit nodes in the device under test. The control circuit is coupled to the exposed test pads through a clamping fixture. The control circuit receives multiple test signals from the exposed test pads, stores multiple test signals in the memory, and controls a power on/off operation applied to the device under test through the exposed test pads. The data processing circuit is configured to receive the test signals stored in the memory, and determine whether the test signals meet a set of predetermined criteria to generate a verification result. The display device displays a signal waveform of the test signals and the verification result.