Patent classifications
G01R31/2813
FOREIGN SUBSTANCE DETECTING CIRCUIT AND ELECTRONIC DEVICE INCLUDING THE SAME
Provided are a foreign substance detecting circuit, an electronic device including the foreign substance detecting circuit, and a method of detecting foreign substance. The electronic device includes a connector connected to an external cable and including a plurality of pins, a foreign substance detecting circuit configured to, when the cable is connected to the connector, detect a resistance from a first pin that is set to be in an open state or to be connected to a pull-down resistor from among the plurality of pins in a state where the cable is connected, and determine whether there is a foreign substance in the connector, and an application processor configured to control operations in the electronic device for performing a post-process when there is the foreign substance in the connector, according to a detection result from the foreign substance detecting circuit.
APPARATUS AND METHOD FOR TIN WHISKER ISOLATION AND DETECTION
An apparatus for tin whisker isolation and detection includes a substrate having a plurality of pads for connecting to an electronic component placed on the substrate, and a shield placed on a surface of the substrate. The shield includes a plurality of cavities aligned over the plurality of pads. A plurality of sensing components each associated with one of the plurality of cavities are configured for sensing an electrically conductive growth from a corresponding pad of the plurality of pads. A plurality of circuit connections are each configured to connect one of the sensing components to detection circuitry. The detection circuitry is configured to receive one or more sensing signals from one or more of the sensing components and detect an electrically conductive growth from the corresponding pad based on the one or more sensing signals.
ABNORMALITY DETECTOR FOR ELECTRONIC DEVICE
An abnormal state latch unit comprises: an detection circuit that masks an abnormality position signal; a timer circuit that starts motion when the abnormality position signal indicates the occurrence of an abnormality based on the abnormality position signal, and completes the motion and outputs a reset signal after passage of a predetermined period; and a latch circuit that latches the abnormality position signal output from the detection circuit when the reset signal is output. The detection circuit masks the abnormality position signal when the latch circuit makes latching motion to disable an output from the detection circuit. The timer circuit masks an input to the timer circuit when the latch circuit makes the latching motion to maintain a state indicating completion of the motion. Abnormality voltage signals generated by an signal generation circuit are wired-OR connected and supplied through a single signal line to a monitor circuit.
Detector for detecting position of IC device and method for the same
An apparatus for detecting an attitude of electronic components. The electronic components include an electronic component having a plurality of terminals. The apparatus includes a storage and an image processor. The image processor is configured to: extract a binarized image from an image acquired by an imaging device; perform image matching between a terminal in the binarized image and a terminal in a model image to extract attitude candidates of image matching; obtain coordinates of a corner part of the plurality of terminals from the binarized image of the electronic component; select an attitude candidate from among the attitude candidates of image matching; and output the attitude candidate as a detected attitude of the electronic component.
Strain Gauge Detection and Orientation System
A system includes a signal generator configured to generate a signal, the signal being a constant frequency signal or the signal ranging in frequency during a time period. The system includes a probe electrically coupled to the signal generator, and the probe is configured to hover across or touch an encapsulated or uncapsulated strain gauge. The probe includes a coil and a stylus. The coil is configured to receive the signal from the signal generator and generate a magnetic field. The stylus is configured to transmit the magnetic field to the strain gauge. The system includes a data acquisition component coupled to the strain gauge. The data acquisition component is configured to receive stimulus data from the strain gauge, resulting from the magnetic field transmitted by the probe. The data acquisition component is configured to determine whether the stimulus data from the strain gauge is above a threshold, and if so, determine that the strain gauge is operable.
APPARATUS AND METHOD FOR TESTING AN INTERCONNECT CIRCUIT AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THE TEST METHOD
An interconnect circuit testing apparatus including: an electric signal generating circuit for generating an electric signal; a first electrode arranged at a first region of a substrate, wherein the substrate includes an interconnect circuit, an upper surface and a lower surface; a second electrode arranged at a second region of the substrate; and a sensor for detecting an electric field emitted from the first region or the second region when the electric signal is applied to the substrate through the first electrode and the second electrode.
Conductivity inspection method of printed circuit board and manufacturing method of printed circuit board
First and second measurement probes come into contact with first and second electrode pads, respectively, and third and fourth measurement probes come into contact with the first and second electrode pads, respectively. A current flows in a current path including the first and second electrode pads and a plurality of lines through the first and second measurement probes. A value of the current in the current path is measured, and a value of a voltage between the third and fourth measurement probes is measured. Conductivity between the first and second electrode pads is inspected based on the measured value of the current and the measured value of the voltage.
METHOD OF INSPECTING A TERMINAL OF A COMPONENT MOUNTED ON A SUBSTRATE AND SUBSTRATE INSPECTION APPARATUS
A substrate inspection apparatus according to an embodiment of the present invention comprises a projection unit, an illumination unit, an image acquisition unit and a processing unit. The projection unit irradiates an inspection target with light for obtaining three-dimensional shape information of the inspection target. The illumination unit irradiates the inspection target with at least two lights having different colors. The image acquisition unit acquires a first image by receiving light irradiated by the projection unit and reflected from the inspection target, and a second image by receiving the lights irradiated by the illumination unit and reflected from the inspection target. The processing unit acquires brightness information and color information from the first image and the second image, respectively, which are acquired by the image acquisition unit, and acquires at least a portion of a boundary by using the bright information and the color information. Therefore, the accuracy and reliability of the inspection can be improved.
Method for detecting faults on retention cell pins
Embodiments are disclosed for systems and methods that include pulsing a clock pin of retention cells included within a scan chain to shift a sequence of logic values into the scan chain, so that successive cells are loaded with opposite logic values. Embodiments also include pulsing a retain pin to retain the logic values, and pulsing the clock pin to shift the sequence of logic values through the chain, so that retained logic values are output from, and logic values opposite to the retained logic values are loaded into, the cells. Embodiments also include pulsing a restore pin to restore the retained logic values, pulsing the clock pin to shift the logic values out of the scan chain, comparing the logic values shifted out of the scan chain with the logic values shifted into the scan chain, and detecting a fault on the retain pin based on said comparison.
Insulation inspection method and insulation inspection apparatus
In an insulation inspection apparatus configured to perform insulation inspection of a wiring pattern, when a voltage for performing the insulation inspection is applied between inspection objects, a current control unit controls a first current to be greater than a second current, the first current being supplied until the potential difference between the first inspection part and the second inspection part reaches the predetermine potential difference, the second current being supplied when the predetermined potential difference is reached.