A burn-in chamber is provided, configured to provide the required temperature for a device under test (DUT), including a side wall, a guiding plate, an air flow plate, a partition assembly, and a fan. The air flow plate has a ventilation structure, and the guiding plate is located between the side wall and the air flow plate. The partition assembly is disposed on both sides of the air flow plate. The partition assembly and the air flow plate together form an accommodating space for accommodating the DUT. The partition assembly forms a return channel with respect to the other side of the accommodating space with the side wall. When the fan is active, air from the accommodating space passes through the air flow plate and is guided to the return channel via the guiding plate, and air is returned to the accommodating space through the return channel.

A thermal chamber multiple sides that form an enclosed chamber. The thermal chamber includes a first side of the multiple sides, the first side configured to adjustably mount an electronic circuit board within the enclosed chamber. The thermal chamber includes a second side of the multiple sides, the second side located opposite the first side and including one or more ports that expose the enclosed chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy locally to and from a plurality of electronic devices of an electronic system that is coupled to and positioned above the electronic circuit board.

A thermal chamber includes multiple sides, such as a back side, a front side, a first end, a second end, a top side, and a bottom side. An electronic circuit board is adjustably mounted to the bottom side and positioned above the bottom side of the thermal chamber. In the closed position the multiple sides form an enclosed chamber. The top side includes one or more ports orientated along the horizontal axis. Each of the one or more ports includes a top side open area that exposes the enclosed chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy locally to and from multiple electronic devices of an electronic system that is coupled to and positioned above the electronic circuit board.

Techniques for environmental contaminant monitoring are disclosed. In some embodiments, a contaminant detection system electronically instigates a test circuit that shares an environment with another circuit to induce an electrical anomaly in the test circuit when environmental contamination is present. While electronically instigating the first circuit, the contaminant detection system monitors for an electrical anomaly indicative of the environmental contamination. Responsive to detecting an electrical anomaly in the test circuit that is indicative of environmental contamination, the contaminant detection system generates an alert that indicates that the second circuit has likely been exposed to the environmental contamination. The contaminant detection system may provide early warning of potentially caustic environments before creep corrosion or similar phenomena manifest in expensive hardware resources. Thus, hardware outages may be mitigated or avoided.

A method for estimating degradation of a wire-bonded power semi-conductor module is provided. The method includes obtaining an indicator of degradation (Degr.sub.est_t-1); estimating an estimated indicator of degradation (Degr.sub.est_t) by a temporal degradation model; obtaining a set of on-line measure (X.sub.on_meas_t); then, (1) converting the on-line measure (X.sub.on_meas_t) into a deducted indicator of degradation (Degr.sub.meas_t) by an electrical equivalence model, and (2) computing a deviation between estimated and deducted indicator of degradation (Degr.sub.est_t; Degr.sub.meas_t); and/or (1) converting the estimated indicator of degradation (Degr.sub.est_t) into a set of on-line estimation (X.sub.on_est_t), and (2) computing a deviation between set of on-line measure and estimation (X.sub.on_meas_t; X.sub.on_est_t); and correcting the estimated indicator of degradation (Degr.sub.est_t) into a corrected estimated indicator of degradation (Degr.sub.corr_t) as a function of the computed deviation.

Embodiments of the present invention provide a method (1000) of assembling an electrical circuit comprising one or more copper electrical conductors, the method comprising plating (1010) a surface of the one or more conductors with a layer comprising tin; annealing the plating; applying (1020) solder to at least a portion of the one or more electrical conductors, wherein said solder comprises tin and copper; and annealing the electrical circuit.

The disclosed apparatus may include support portions, a frame (such as a base) configured to maintain the support portions in a spaced-apart configuration, a sample holder configured to receive a sample, and a probe assembly including micromanipulators configured to position one or more probes in contact with the sample. The sample holder may rotate between the support portions, and the probe assembly may rotate with the sample holder so that the one or more probes may maintain contact with a sample in the sample holder as the sample holder is rotated, for example, to expose a portion of the sample for processing. Various other methods, systems, and computer-readable media are also disclosed.

A chip-on-film test board on which a chip-on-film is mounted according to an embodiment of the present disclosure includes a main board in which a test circuit configured to output a test pattern signal is formed, and a chip-on-film fixing part that fixes a position of the chip-on-film.

In one example, a first tubular member has a first diameter and is configured to attach to a printed circuit board. A second tubular member has a second diameter different from the first diameter and is configured to hold an environmental sensor for collecting data relating to an environment of the printed circuit board. The second tubular member is vertically adjustable relative to the first tubular member.

A test circuit includes one or more sensors adapted to be formed on a wafer, each sensor detecting one or more wafer characterization data in a stressed condition; a stress generator controlling the one or more sensors to place the one or more sensors under stress during wafer manufacturing; memory coupled to the one or more sensors to store wafer characteristics under the stressed condition; and an interface coupled to the memory to communicate the wafer characterization data to a tester.