A method for determining the remaining usability of a semiconductor module in normal use. The semiconductor module is thermally coupled to a cooling device. A predefined electrical load is applied to the semiconductor module while predefined cooling is effected by the cooling device. A temperature of a semiconductor element of the semiconductor module is sensed at least for the predefined electrical load on the semiconductor module. The sensed temperature is compared with a comparison temperature in a first comparison. The comparison temperature is assigned to the predefined electrical load with the predefined cooling, and prediction data for the remaining usability of the semiconductor module in normal use up to a usability end are determined at least in accordance with the first comparison.

The present invention relates to a test method for an unpopulated printed circuit board, comprising the steps of: exposing the unpopulated printed circuit board to temperatures of a reflow soldering process in a first step; and testing the electrical connections of the unpopulated printed circuit board. The present invention further relates to a test device and a method for producing populated printed circuit boards.

The present disclosure provides a carrier mechanism including at least one rotator, a supporting unit, and a driving unit. The rotator rotates about an axis and has a gradually enlarged cam surface. The supporting unit has at least one carrier. The carrier has a first passive member and a second passive member contacting two sides of the rotator respectively. The driving unit has at least one driver to drive the rotator to rotate about the axis so as to push the first passive member and the second passive member. Thus, the carrier can precisely adjust the location of the carrier.

A method, printed circuit board assembly (PCBA), and device comprising a PCBA are disclosed. The method includes obtaining a material comprising silver halide grains, incorporating the material into a PCBA having at least one component in contact with the material, detecting a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enacting a data protection response. The PCBA includes a material comprising silver halide grains, at least one component in contact with the material, and a monitoring component. The monitoring component is configured to detect a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enact a data protection response.

A printed circuit board (PCB) includes a plurality of layers disposed at different depths of the PCB, circuit components disposed at different layers of the PCB, and a plurality of temperature measurement sensors located at one or more layers of the PCB, where each temperature measurement sensor is associated with a corresponding circuit component. A measured temperature is obtained at an embedded temperature measurement sensor located at an embedded layer within the PCB, and the measured temperature is correlated with an electrical property of an embedded circuit component located at the same embedded layer within the PCB as the embedded temperature measurement sensor. A plurality of moisture measurement sensors can also be located at one or more layers of the PCB to facilitate a measured moisture with an electrical property of an embedded circuit component.

The present disclosure relates to a radio frequency (RF) functional probe for testing an RF device in a cryogenic environment. The RF functional probe includes a probe head configured to receive the RF device, a flange structure, an isolation structure coupled between the probe head and the flange structure, and an RF cable structure extending from the flange structure, through the isolation structure, and to the probe head. The isolation structure is configured to provide thermal and electrical isolation to reduce radiant heat leak from the RF cable structure to the RF device. Herein, the isolation structure includes multiple baffle structures, each of which includes cable guides. The cable guides of each baffle structure are configured to guide routing paths for the RF cable structure. The RF cable structure is configured to transmit signals to and from the RF device.

A control device including a solder joint life predictor includes: a temperature sensor that measures temperature of a solder joint on an electronic circuit board that drives a heater and a motor; a storage that stores a reference acceleration factor that is an acceleration factor based on a test condition of a thermal shock test and a reference condition in an environment in which the electrical appliance is used; a calculator that calculates an actual acceleration factor from a temperature variation range and a maximum reached temperature of the solder joint during one cycle from start to end of driving of the heater or the motor; and a determiner that predicts the life of the solder joint by comparing the integrated value of the acceleration factor ratios with a threshold.

A device includes a first oscillator, a second oscillator and a frequency comparison block. The first oscillator includes a first LC tank circuit and is designed to generate first sustained oscillations at a first resonant frequency. The second oscillator includes a second LC tank circuit and is designed to generate second sustained oscillations at a second resonant frequency. The frequency comparison block is designed to perform a comparison of the frequencies of the second sustained oscillations and the first sustained oscillations to determine a change in inductance in one of a first inductor of the first LC tank circuit and a second inductor of the second LC tank circuit. One of the oscillators serves as a reference oscillator, and enables determination of the change in inductance to be immune to changes in environmental conditions.

The disclosure relates to technology for determining stress on integrated circuits. These include using ring oscillators formed on the integrated circuit, where one ring oscillator has its frequency dependent on the current flowing through its stages being limited by its NMOS devices and another ring oscillator has its frequency dependent on the current flowing through its stages being limited by its PMOS devices. This allows the stress on the integrated circuit to be determined in different directions along the integrated circuit. A temperature sensor can be used to compensate for temperature dependence on the frequencies of the ring oscillators.

A device for testing performance of main boards of electronic devices includes a housing, two bases, a control device, a humidifier, a heating device, and a refrigerating device. A cavity in the housing comprises separated first and second portions. The heating device is interconnected with the first portion to create a predefined high temperature environment and the refrigerating device is interconnected with the second portion to create a predefined low temperature environment. The humidifier is interconnected with the first portion and the second portion, and configured to create predefined degrees of humidity respectively in the first portion and the second portion. The bases are inside the first portion and the second portion, and electrically connected to the control device.