Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate, and a die module coupled to the package substrate. In an embodiment, the die module comprises a die and a chiplet coupled to the die. In an embodiment, the chiplet is coupled to the die with a hybrid bonding interconnect architecture.

A test socket includes: a first body including a fixing portion configured to receive a sample having a plurality of test terminals; a second body facing the first body and coupled with the first body such that the second body rotates relative to the first body about a hinge pin; a test board provided on the second body and configured to test the sample, wherein the test board has a plurality of first openings provided therein; and a plurality of interface pins penetrating through the first openings, wherein each of the plurality of interface pins includes a contact pin and a spring, wherein the contact pin is provided in a first end portion of each of the plurality of interface pin and is configured to come into contact with a test terminal of the plurality of test terminals, and the spring elastically supports the contact pin.

A test card and a test display adapter are disclosed. The test card includes an assembling plate and an electrical heat source. The electrical heat source is provided on the assembling plate. The electrical heat source includes a first heat transfer plate, a second heat transfer plate and at least one heat source element. The first heat transfer plate is stacked on the assembling plate, and the second heat transfer plate is laminated over the first heat transfer plate, with the heat source element being sandwiched between the first and second heat transfer plates. The test card and the test display adapter have a wide variety of advantages including very low cost, easy material availability, a short wait time, easy manufacturability, a long service life, easy modifiability and good interoperability.

A circuit tester includes an interposer transfer board, a mounting plate, at least one sensor plate, and at least one receptacle and probe assembly. The interposer transfer board includes a first surface and a second surface opposite to the first surface, at least one amplifier holder, and at least one input header and at least one output header. The at least one amplifier holder, the at least one input header, and the at least one output header are disposed on the first surface of the interposer transfer board. The at least one receptacle and probe assembly is fixed on the at least one sensor plate. The at least one receptacle and probe assembly passes through and is mounted on the mounting plate. The at least one input header is connected to the at least one receptacle and probe assembly via wires.

A testing apparatus for Data Storage Devices (DSDs) includes a chassis and at least one interface module configured to be removably inserted into the chassis and house a plurality of interface boards. Each interface board includes a DSD connector for connecting a DSD to the interface board and a backplane connector for connecting to a backplane for communicating with a respective computing unit. In one aspect, the at least one interface module includes a housing and a plurality of openings in a side of the housing with each opening configured to receive a respective interface board. A plurality of guide member pairs is positioned to guide respective interface boards when inserted into respective openings such that the backplane connector is located at a respective predetermined location for connecting to the backplane. In another aspect, the interface boards are removable from the interface module.

The systems and methods described herein are for remaining useful life prediction in electronics and include measuring a plurality of circuit parameters for each of a plurality of circuit components at a plurality of different temperatures, determining a probability density function of failure as a function of time for each of the plurality of circuit components and combining the probability density functions for each of the plurality of circuit components as a function of a circuit that contains the plurality of circuit components.

A method and an apparatus for diagnosing an electronic apparatus are provided. The device for diagnosing an electronic device includes a master diagnosis block that generates a control signal when a diagnosis mode is started, a multiplexer that sequentially outputs a diagnosis power through a diagnosis power path based on the control signal, a slave diagnosis block that is sequentially supplied the diagnosis power through the diagnosis power path and generates diagnosis data of a power management circuit of the electronic device by using the diagnosis power, a modulator that transmits the diagnosis data by modulating a power signal of the diagnosis power path, and a demodulator that receives the diagnosis data by demodulating the power signal of the diagnosis power path and provides the diagnosis data to the master diagnosis block.

A system for monitoring a circuit, comprising a device under test, such as a power field effect transistor or capacitor, coupled to a power source and a signal source and configured to generate a power output using the signal source, a current output, a voltage output and an end of life detector coupled to the current output and the voltage output and configured to generate a first impedance as a function of the current output and the voltage output, to compare the first impedance to a second impedance and to generate an indicator if the first impedance exceeds the second impedance.

A module for initializing and calibrating a product during the manufacture of the product in a manufacturing environment, wherein the module is able to be arranged on the product and wherein the module has a first interface for wireless data transmission between the module and the manufacturing environment, a second interface for establishing a data connection between the module and the product, an electrical energy source and a data processing unitft. The module is designed to supply the product at least temporarily with energy by way of the energy source, to establish a data connection with the product via the second interface, to perform test and/or calibration routines on the product via the second interface, wherein the data processing unit generates test and/or calibration data during the performance of the test and/or calibration routines, and to transmit the test and/or calibration data to the manufacturing environment via the first interface.

An inspection jig is used for inspection for an inspection target device including a flexible substrate having a flexible base material with external connection terminals formed thereon. The inspection jig is composed of an inspection device and an attraction part. The inspection device has inspection terminals, and the inspection terminals have vacuum attraction holes. The attraction part has an attraction surface. The external connection terminals have first through holes. In inspection, the attraction part is placed on the front surface of the flexible base material so that the first through holes and the vacuum attraction holes overlap each other and the attraction surface covers the first through holes, and the insides of the first through holes and the vacuum attraction holes are made into vacuum, whereby the attraction surface is attracted to the flexible base material and the external connection terminals are attracted to the inspection terminals.