There is described a method for assembling or repairing an electrical cable in an environment. The method comprises obtaining a unique identifier of an origin connector of the electrical cable to be assembled or repaired. A computing device receives a reading of the unique identifier of the origin connector of the electrical cable to be assembled or repaired and identifies a connection between the origin connector of the electrical cable to be assembled or repaired and a destination electrical component. At the computing device, there is made a determination of the connection that was identified with a connectivity list required for the electrical cable, from a database, to determine a next step of the assembling or the repairing which depends on the connection identified by the computing device.

A test fixture for PCB components is described herein. The test fixture comprises a shim with an aperture configured to direct RF energy from a component of a PCB, via an end of the PCB, and to a top clamp of the test fixture. The end of the PCB may correspond to a cut line of a destructive test. The test fixture also comprises the top clamp with a test port and a taper configured to direct the RF energy from the aperture to the test port. The test fixture also comprises a bottom clamp attached to the top clamp to retain the PCB between the top and bottom clamps for testing. The test fixture allows for quick mounting of the PCB and testing of the component without modifying a design of the PCB or requiring specific drilling of the PCB.

A system and method are disclosed for formulating a sequential equivalency problem for fault (non)propagation with minimal circuit logic duplication by leveraging information about the location and nature of a fault. The system and method further apply formal checking to safety diagnoses and efficiently models simple and complex transient faults.

In one embodiment, an apparatus includes a bi-directional coupler for coupling an upstream signal and a downstream signal to a termination load. A test point detection mechanism is configured to detect when a test point device is inserted in a test point connector. The test point device is configured to perform a test of the upstream signal or the downstream signal. A switch is configured to switch from being coupled to the termination load to being coupled to the test point device when the test point device is detected as being inserted in the test point connector. The switch is configured to switch from being coupled to being coupled to the test point device to the termination load when the test point device is detected as being removed from being inserted in the test point connector.

The present invention is related to a condensation prevention type transmission window for a CMS module test chamber, the transmission window being provided at the module test chamber. The condensation prevention type transmission window includes: a multilayer glass panel in which heating wires are coated on upper, lower, left, and right side surfaces thereof; and an air injector provided at each of opposite surfaces of the transmission window to inject air from an upper side edge and/or a lower side edge of the transmission window and to form an air curtain. The present invention provides the condensation prevention type transmission window for a CMS module test chamber, which prevents freezing and fogging on inside and outside surfaces of the transmission window of the CMS module test chamber varying in a temperature range from 40° C. to +125° C.

The present application discloses a testing device of array substrates and a testing method. The testing device of array substrates includes: a machine and testing interfaces, the testing interfaces being disposed on the machine; and testers disposed above the machine. There are at least two sets of testers, and the testers synchronously operate according to a preset scheme.

The present application discloses a testing device of array substrates and a testing method. The testing device of array substrates includes: a machine and testing interfaces, the testing interfaces being disposed on the machine; and testers disposed above the machine. There are at least two sets of testers, and the testers synchronously operate according to a preset scheme.

A testing apparatus comprises a test interface board comprising a plurality of socket interface boards, wherein each socket interface board comprises: a) an open socket to hold a DUT; b) a discrete active thermal interposer comprising thermal properties and operable to make thermal contact with the DUT; c) a superstructure operable to contain the discrete active thermal interposer; and d) an actuation mechanism operable to provide a contact force to bring the discrete active thermal interposer in contact with the DUT.

Example automatic test equipment (ATE) includes a first test instrument to receive a waveform from a device under test, where the waveform is based on test signals sent from the ATE to the DUT; circuitry to generate digital pulses based on the waveform; and a second test instrument to receive the digital pulses over at least two digital pins and to process the digital pulses to test the DUT.

In some examples, a device includes a power structure and a sensing structure that is electrically isolated from the power structure. The device also includes processing circuitry configured to determine whether the sensing structure includes a prognostic health indicator, wherein the prognostic health indicator is indicative of a health of the power structure.